Claims
- 1. A method of forming a substrate for attaching an array of biological or chemical analytes, said method comprises:a) providing a flat, rigid, non-porous, impermeable, inorganic understructure; b) applying a porous, predominantly inorganic layer to a top surface of said inorganic understructure; wherein said porous inorganic layer is formed by an process that comprises: 1) applying a frit layer of individual particles of an inorganic material to a top surface of said inorganic understructure, said particles having a predetermined mean size of not less than 0.1 μm; 2) forming a network of inorganic material from said individual particles to create a plurality of interconnected voids of a predetermined mean size of not less than 0.1 μm dispersed through-out said porous inorganic layer, and having void channels that extend through to a top surface of said porous inorganic layer; c) configuring said inorganic material and contents of said voids to exhibit a high contrast in their indices of refraction relative to each other such as to scatter light; d) preparing said top surface of said porous inorganic layer for binding biological or chemical analytes.
- 2. The method according to claim 1, further comprising applying an interlayer disposed between said inorganic understructure and said porous inorganic layer, and said interlayer having a coefficient-of-thermal-expansion compatible with said inorganic understructure and with said porous inorganic layer.
- 3. The method according to claim 1, wherein said preparing step comprises applying a uniform coating of a binding agent over at least a part of a surface area of said voids and said top surface of said porous inorganic layer.
- 4. The method according to claim 3, wherein said binding agent is a cationic polymer.
- 5. The method according to claim 3, wherein said cationic polymer is either gamma-aminopropyltriethoxysilane or polylysine.
- 6. The method according to claim 1, wherein said inorganic material is characterized as a material that is non-absorbing and transparent to light when in the form of a solid of an amorphous or single crystal material.
- 7. The method according to claim 6, wherein said material is a glass, or a metal oxide.
- 8. The method according to claim 7, wherein said material is a silicate, aluminosilicate, boroaluminosilicate or borosilicate glass.
- 9. The method according to claim 7, wherein said material is TiO2, SiO2, Al2O3, Cr2O3, CuO, ZnO, or ZrO2.
- 10. The method according to claim 1, wherein said porous inorganic layer has a thickness of at least 5 μm.
- 11. The method according to claim 1, wherein said inorganic material particles having a predetermined mean size in the range of about 0.3 μm to about 5 μm.
- 12. The method according to claim 1, further comprises after step b) and before step c) firing said porous inorganic layer at a temperature to adhere said individual particles into said network of inorganic material.
- 13. The method according to claim 1, wherein said voids have a predetermined mean size in the range of about 0.3 μm to about 5 μm.
- 14. The method according to claim 1, wherein said voids have a predetermined mean size in the range of about 0.5 μm to about 3.5 μm.
- 15. The method according to claim 1, wherein said content of said voids consists of either a gas, a liquid, or a solid.
- 16. The method according to claim 1, wherein said porous inorganic layer is characterized as having a microstructure that produces a sensitivity of fluorescent molecules of at least one order of magnitude greater than that of a comparable, non-porous substrate.
- 17. The method according to claim 1, wherein said substrate is fabricated using a tape casting process.
- 18. The method according to claim 1, wherein said substrate is fabricated using a screen printing process.
- 19. The method according to claim 1, wherein said porous inorganic layer has a coefficient of thermal expansion compatible with that of said inorganic understructure.
- 20. The method according to claim 1, wherein said inorganic material forms a continuous networked matrix.
- 21. The method according to claim 12, wherein said porous inorganic layer is fired at a temperature of about 650° C. to about 735° C.
- 22. The method according to claim 21, wherein said porous inorganic layer is fired at a temperature of about 650° C. to about 720° C.
CLAIM OF PRIORTY
This Application claims benefit of priority as a continuation-in-part to U.S. patent application Ser. No. 09/650,885, filed on Aug. 30, 2000, now abandoned and U.S. Provisional Patent Application No. 60/152,186, filed on Sep. 2, 1999. The contents of both of the aforementioned applications are incorporated herein by reference.
US Referenced Citations (9)
Foreign Referenced Citations (1)
Number |
Date |
Country |
WO 0061282 |
Oct 2000 |
WO |
Non-Patent Literature Citations (3)
Entry |
M. Glazer et al., “High Surface Area Substrates for DNA Arrays”, Mat. Res. Soc. Symp. Proc. vol. 576, 1999 Materials Research Society, pp. 371-375. |
Thomas H. Elmer, “Porous and Reconstructed Glasses”, Engineered Materials Handbook, vol. 4, The Materials Information Society, pp. 427-432, no date provided. |
M. Glazer et al., “Colloidal Silica Films for High-Capacity DNA Probe Arrays”, Chem. Mater. 2001, vol. 13, pp. 4773-4782. |
Provisional Applications (1)
|
Number |
Date |
Country |
|
60/152186 |
Sep 1999 |
US |
Continuation in Parts (1)
|
Number |
Date |
Country |
Parent |
09/650885 |
Aug 2000 |
US |
Child |
10/101135 |
|
US |