The present invention relates to computer hardware, and more specifically, to a port that accommodates a heat sink.
Conventional peripheral component interconnects (PCIs) are common structures used for attaching hardware devices in a computer, such as a server. A PCI chassis typically has several parallel connectors attached to a backplane into which PCI cards are connected. There is a bay associated with each connector where the bulk of the PCI card will reside. To conserve space, each bay is directly adjacent to at least one other bay, which limits the width of the PCI cards.
Some PCI cards can include a connector for connecting a cable that originates outside of the PCI chassis. In some instances, such a cable can be an active cable. Because an active cable can have an electronic circuit in the header of the cable, active cables can have heat sinks that must be accommodated by the PCI card and the PCI chassis.
According to an embodiment of the present disclosure, an electronic interconnect includes a board, a rotatable connector, and a heat sink. The board extends along a plane, and the rotatable connector is connected to the board. The rotatable connector is configured to allow rotation about an axis parallel to the plane, between a first position and a second position. The heat sink is connected to the rotatable connector and extends a first distance from the board in the first position and a second, greater distance from the board in the second position.
According to an embodiment of the present disclosure, a peripheral component interconnect card includes a circuit board extending from a front side to a back side, an electrical component mounted to the circuit board, and a bracket mounted to the circuit board that includes a port for a cable to pass through. Also included are a rotatable connector mounted to the circuit board and electrically connected to the electrical component. The rotatable connector is configured to electrically connect to the cable and rotate with the cable along an axis that extends from the front side to the back side of the circuit board from a first position to a second position.
According to an embodiment of the present disclosure, an electrical connection system includes a chassis, a card, and a cable. The chassis includes a front wall, a rear wall, and a cavity divided into card bays. The card is positioned in one of the card bays and is connected to the chassis. The card includes an electrical component, a bracket mounted to the chassis including a port, and a rotatable connector electrically connected to the electrical component. The cable includes a cord, an electronic circuit, a heat sink, and a cable connector configured to connect to the rotatable connector, wherein the rotatable connector can rotate with rotation of the cable, when the cable is connected to the rotatable connector, between a first position and a second position.
In the illustrated embodiment, PCI assembly 100 includes chassis 102, card 104, and cable 106. Chassis 102 has a large internal cavity with connectors (not shown) arranged in parallel along the inside of rear wall 108. Chassis 102 also has a plurality of threaded mounting holes 110 on front wall 109 for fasteners 112 to secure cover plates 114 and/or PCI cards, such as card 104. Chassis 102 can be divided into bays (shown in
In the illustrated embodiment, card 104 includes circuit board 116 that has electrical components 118, card connector 120, rotatable connector assembly 122, bracket (or tailstock) 124, and board connector 126 mounted thereto. Rotatable connector assembly 122 includes rotatable connector 128 and leads 129 which electrically connect board connector 126 and rotatable connector 128. In addition, conductors 130 extend between board connector 126, electrical components 118, and card connector 120, respectively, to electrically connect those components. In turn, card connector 120 electrically connects card 104 to the backplane (not shown) of chassis 102, which can be connected to a greater computing system, such as a server (not shown).
In the illustrated embodiment, cable 106 includes cord 132 and header 134. Bracket 124 includes a port 136 that has a shape that corresponds with the shape of header 134. For example, if the shape of header 134 is rectangular, then the shape of port 136 would also be a rectangle, although it would be of slightly larger size as to accommodate header 134 as it passes through port 136. Due to the size of header 134, the rectangular shape of port 136 is oriented such that the longer portion extends along bracket 124 and the shorter portion extends across bracket 124. Port 136 is aligned front-to-back with rotatable connector 128, and header 134 is configured to pass through port 136 and connect to rotatable connector 128. After this has occurred, grommet 138 can be fit into port 136 and/or around cord 132 to block electromagnetic interference (EMI) leakage from the interior of chassis 102. Therefore, grommet 138 can be comprised of, for example, an elastomeric, polymer, and/or metal material. In addition to or instead of grommet 138, bracket 124 can include door 140 (shown in phantom in an opened position in
The components and configuration of PCI assembly 100 allow for cable 106 to be connected to and disconnected from card 104 while card 104 is connected to chassis 102. In addition, cable 106 can be rotated with respect to card 104 while cable 106 is connected to rotatable connector assembly 122.
Heat sink 146 can be an integral part of header 134, although in other embodiments, heat sink 146 is permanently affixed to header 134, for example, by brazing. Fins 148 can be, for example, between 5 mm (0.20 in.) and 15 mm (0.59 in.) in height dimension HF. In some such embodiments, for example, fins 148 can be between 5 mm (0.20 in.) to 6 mm (0.24 in.) in height dimension HF, and in other such embodiments, for example, fins 148 can be between 10 mm (0.39 in.) to 15 mm (0.59 in.) in height dimension HF. yes
In addition, there can be greater or fewer than nine fins 148. When electronic circuit 142 is operating, heat sink 146 can extract heat from electronic circuit 142 where it can be transferred to the ambient environment. Thereby, electronic circuit 142 can be cooled, for example, by forcing a cooling fluid, such as air, through chassis 102 (shown in
In the assembled configuration, receptacle disk 154 can still be rotated despite being in contact with lead disk 156. In addition, each contact 162 is positioned to contact a different one of rings 164, and each ring 164 is connected to only one of leads 129. Therefore, in the illustrated embodiment, four separate electrical connections can be made and maintained between receptacle 160 and leads 129 regardless of the rotational position of receptacle disk 154.
When in the connecting position, header 134 extends a relatively short distance from circuit board 116 so that header 134 can pass through port 136 in bracket 124 (both indicated in phantom). But in the installed position, heat sink 146 extends a relatively long distance from circuit board 116 such that heat sink 146 extends beyond the side edge of bracket 124 and its own bay 166A (because, in the illustrated embodiment, bay 166A is the same size as bracket width dimension WB). Thereby, heat sink 146 extends into the adjacent bay 166B. While this precludes the adjacent bay 166B from having any components in the space swept and occupied by heat sink 146, heat sink 146 can extend farther from circuit board 116 than would be possible with a conventional design that had a cable connecting to a fixed connector on a card. In some embodiments, for example, a height dimension HH of header 134 can be wider than a width dimension WB of bracket 124. For another example, a height dimension HH to width dimension WH (HH/WH) ratio of header 134 can be greater than 1.0/1.0, specifically between 1.5/1.0 to 3.0/1.0, as opposed to a conventional design of between 1.0/1.5 to 1.0/1.0. This results in heat sink 146 being exposed to about 340 linear meters per minute (1100 linear feet per minute) of air speed, as opposed to about 150 linear meters per minute (500 linear feet per minute) with a conventional design. Thereby, heat sink 146 is exposed to more air in chassis 102 which increases the efficiency of cooling cable 106 (including electronic circuit 142, shown in
In such an embodiment, card 204 includes guide 267 and cord 206 includes lugs 268. Guide 267 comprises two pairs of rails 270 that begin slightly in front of bracket 224, with one pair being on one side of port 236 and the other pair being on the opposite side of port 236. The pairs of rails 270 define a helical structure (e.g., a double helix) of pathways that extend towards board connector 226. In the illustrated embodiment, guide 267 (as well as rails 270 and the pathways) is shaped such that guide 267 rotates ninety degrees between bracket 224 and board connector 226.
Lugs 268 are guiding features that are configured to fit into guide 267 and allow for guide 267 to direct the rotation of header 234. Thereby, guide 267 controls the alignment of plug 244 with receptacle 260. In the illustrated embodiment, one lug 268 is positioned on each side of header 234, opposite of each other, with heat sink 246 on the side in between.
Each lug 268 fits between a pair of rails 270. At the entrance to guide 267, lugs 268 engage rails 270 at straight portion 272 of guide 267. At straight portion 272, plug 244 is misaligned ninety degrees from receptacle 260. Adjacent to straight portion 272 is curved portion 274. As header 234 is moved along curved portion 274 of guide 267 towards board connector 226, plug 244 is aligned with receptacle 260. Plug 244 then connects with receptacle 260 as header 234 is moved along another straight portion 276 of guide 267 that is adjacent to curved portion 274. Each pair of rails 270 is joined at the end of straight portion 276 and can limit the inward travel of header 234 such that board connector 226 is not excessively stressed during insertion of plug 244 into receptacle 260. In other embodiments, each pair of rails 270 may be open at the end of straight portion 276 since board connector 226 can limit the inward travel of header 234 and prevent header 234 from going beyond rails 270. In other embodiments, the first straight portion 272 is absent, and guide 267 begins at curved portion 274.
When plug 244 and receptacle 260 are connected, heat sink 246 is positioned wholly within the chassis (i.e., wholly on the board-side of bracket 224). Because header 234 is taller than it is wide and port 236 has a corresponding shape, heat sink 246 is relieved adjacent the cord-side of header 234. More specifically, the cross-section of heat sink 246 is reduced in order to provide clearance from the edges of port 236 as header 234 translates and rotates along guide 267. In the illustrated embodiment, the reduction is in the form of two planar faces 278A and 278B opposite one another instead of pointed corners that would have been present due to the generally rectangular shape that header 234 otherwise has. In some embodiments, the planar faces 278 are the same size, but in other embodiments (such as the illustrated one), planar face 278A on heat sink 246 is significantly larger than planar face 278B. In other embodiments, there is only one planar face 278, for example, planar face 278A.
In other embodiments, the reduction of header 234 is in the form of a curved ribbon surface. In such an embodiment, the reduction can be shaped according to a trigonometric function that depends on the size of port 236, the axis of rotation of guide 267, the rate of twist of guide 267, and where the twisting of guide 267 begins (e.g., the beginning of curved portion 274). While the shape of header 234 would be complex, the size of header 234 would be maximized, which would maximize the heat transfer of heat sink 246.
In other embodiments, guide 267 and lugs 268 can be positioned ninety degrees from where they are shown in
The components and configuration of PCI assembly 200 allow for increased cooling due to the increased size of heat sink 246 while employing a simple, stationary board connector 226. Furthermore, guide 267 may be added to some existing cards without requiring full card redesigns.
The descriptions of the various embodiments of the present invention have been presented for purposes of illustration, but are not intended to be exhaustive or limited to the embodiments disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the described embodiments. The terminology used herein was chosen to best explain the principles of the embodiments, the practical application or technical improvement over technologies found in the marketplace, or to enable others of ordinary skill in the art to understand the embodiments disclosed herein.
Number | Name | Date | Kind |
---|---|---|---|
3284672 | Munn | Nov 1966 | A |
4376250 | Baker, Jr. | Mar 1983 | A |
5398161 | Roy | Mar 1995 | A |
5764479 | Crump | Jun 1998 | A |
5878271 | Crump | Mar 1999 | A |
5912801 | Roy | Jun 1999 | A |
6162073 | Haq | Dec 2000 | A |
6171120 | Bolich | Jan 2001 | B1 |
6465746 | Kajita | Oct 2002 | B1 |
6475021 | Tan | Nov 2002 | B1 |
6532158 | Buttet | Mar 2003 | B1 |
6600647 | Girvin | Jul 2003 | B1 |
6715023 | Abu-Lebdeh | Mar 2004 | B1 |
6856747 | Cloud | Feb 2005 | B2 |
6890188 | Le | May 2005 | B1 |
6911836 | Cannon | Jun 2005 | B2 |
7099152 | Gasbarro | Aug 2006 | B2 |
7242576 | Coster | Jul 2007 | B2 |
7249992 | Kalenian | Jul 2007 | B2 |
7256992 | Stewart | Aug 2007 | B1 |
7313000 | Fiorentino | Dec 2007 | B2 |
7397674 | Schlack | Jul 2008 | B2 |
7452239 | Montena | Nov 2008 | B2 |
7525810 | Jiang | Apr 2009 | B2 |
7564696 | Winick | Jul 2009 | B1 |
7635046 | Tominaga | Dec 2009 | B2 |
7679933 | Makabe | Mar 2010 | B2 |
7813143 | Dorenkamp | Oct 2010 | B2 |
7940532 | Willing | May 2011 | B2 |
8070504 | Amidon | Dec 2011 | B2 |
8169789 | Tong | May 2012 | B1 |
8416572 | Olsen | Apr 2013 | B2 |
8911244 | Elison | Dec 2014 | B2 |
9072195 | Kameno | Jun 2015 | B2 |
9681572 | Artman | Jun 2017 | B2 |
9893474 | Jandt | Feb 2018 | B1 |
10098262 | Ross | Oct 2018 | B2 |
10201112 | Ju | Feb 2019 | B1 |
20060114652 | Jory | Jun 2006 | A1 |
20090009964 | Suzuki | Jan 2009 | A1 |
20130238817 | Klein | Sep 2013 | A1 |
20170269314 | Gaal | Sep 2017 | A1 |
20170294823 | Akiyoshi | Oct 2017 | A1 |
Number | Date | Country |
---|---|---|
20040533972 | Jun 2004 | WO |
Entry |
---|
List of IBM Patents or Patent Applications Treated as Related, dated Aug. 4, 2019, 2 pages. |
Staats Jr., “Active Heat Transfer Enhancement in Integrated Fan Heat Sinks,” Department of Mechanical Engineering, Massachusetts Institute of Technology, Sep. 2012, 211 pages. |
Stathakis et al., “Port for Heat Sink on Active Cable End,” U.S. Appl. No. 16/533,407, filed Aug. 6, 2019. |