1. Technical Field
The present disclosure relates to electronic devices, and particularly to a portable electronic device having a heat pipe.
2. Description of Related Art
The continuing and fast development of the electronic industry has resulted in a remarkable increase in the heat generated by electronic components. If this heat cannot be removed away in time from the electronic components, damage to the electronic components will be inevitable. On the other hand, the drive towards greater miniaturization is a prevalent tendency in the development of electronic equipment and this tendency further increases the difficulty of dissipating heat from electronic components.
What is needed, therefore, is a portable electronic device which can overcome the described limitations.
Referring to
The heat generating electronic component 20 is planar and includes a planar first surface 21 and a planar second surface 22 opposite to the first surface 21. A size of the heat pipe 30 is not less than that of the heat generating electronic component 20. In this embodiment, the size of the heat pipe 30 is larger than that of the heat generating electronic component 20. The first surface 21 is adhered to a central portion of a bottom side of the heat pipe 30 by thermal grease 50 laid therebetween. The second surface 22 is adhered on the printed circuit board 40 to fix the heat generating electronic component 20 on the printed circuit board 40.
The heat pipe 30 includes a casing 31, a wick structure 32 arranged on an inner surface of the casing 31, and working fluid (not shown) contained in the casing 31.
The casing 31 is rectangular and sealed, and includes an evaporating side 33 and a condensing side 34 located at opposite sides thereof. A central portion of the evaporating side 33 thermally contacts the first surface 21 of the heat generating electronic component 20 to absorb heat generated from the heat generating electronic component 20. The first surface 21 of the heat generating electronic component 20 is adhered to the central portion of the evaporating side 33 by the thermal grease 50 laid therebetween. The condensing side 34 is assembled to an inner surface of the shell 10 by the thermal grease 50 laid therebetween to transfer heat absorbed from the heat generating electronic component 20 to the shell 10.
The wick structure 32 is continuous and arranged on the inner surface of the casing 31. A channel 35 is defined in the casing 31 and enclosed by the wick structure 32 to allow vaporized working fluid circulating therein. The wick structure 32 is made of sintered metallic powder and includes a plurality of pores (not shown) therein. In the other embodiment, the wick structure 32 is formed by weaving a plurality of wires etc.
The heat pipe 30 is thin to suitable for the portable electronic device 100. In this embodiment, a thickness of the heat pipe 30 is varied between 1 millimeter and 3 millimeter. Thus, the heat pipe 30 can intimately contacts the heat generating electronic component 20 and the shell 10.
When the portable electronic device 100 is operated, the evaporating side 33 of the heat pipe 30 thermal contacts the heat generating electronic component 20. The working fluid at the evaporating side 33 absorbs heat generated by the heat generating electronic component 20, and thereby turns to vapor. Due to the difference in vapor pressure between the evaporating side 33 and the condensing side 34 of the heat pipe 30, the generated vapor moves in the channel 35, carrying the heat with it, toward the condensing side 34. At the condensing side 34, the vapor condenses after transferring the heat to the shell 10. The shell 10 then releases the heat into the ambient environment. The condensed working fluid is drawn back by the wick structure 32 to the evaporating side 33 where it is again available for evaporation.
Referring to
It is to be understood, however, that even though numerous characteristics and advantages of the embodiment(s) have been set forth in the foregoing description, together with details of the structures and functions of the embodiment(s), the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the disclosure to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
Number | Date | Country | Kind |
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201110142076.4 | May 2011 | CN | national |