The present invention relates to a technology for preventing electronic circuit malfunctions brought about by electrostatic discharge, and particularly relates to a technology for preventing malfunctions in portable electronic devices provided with a charging terminal.
In recent times, malfunctions brought about by external electromagnetic stress from electrostatic discharge noise and the like occur more readily at the lower operating voltages used in LSI (Large Scale Integration). Electrostatic discharge noise may even destroy an LSI in an electronic device.
An imaging device that prevents malfunctions and the destruction of a device in advance due to the effect of external noise and static electricity is disclosed in patent document 1.
Although different in purpose from the above device, an example of ferrite material mounted as a high-frequency current suppression part on the ground port of a portable wireless device is disclosed in patent document 2. This prior art has a high-frequency current suppression part, which maintains high impedance in a high-frequency band, mounted on the connecting portion between a portable wireless device that can operate using an internally disposed rechargeable battery, and the charging unit of the portable wireless device. The portable wireless device is cut off from the charging unit in terms of high frequency. It can be envisioned in patent document 2 that performance degradation will occur in the portable wireless device unit when a high-frequency current suppression part is mounted in the portable wireless device unit, and it is a characteristic of the unit that the suppression part is mounted in the charging unit. This prior art prevents high-frequency current from flowing from the portable wireless device unit to the charging unit via the rechargeable battery, and reducing the antenna gain of the portable wireless device due a disruption of the ground current distribution.
In patent document 3, an electrically conductive member on which an antenna is mounted, and a connection terminal to which an external part is connected, are connected via high-impedance connection means that cuts off the conduction of high-frequency current in order to ensure that stable antenna characteristics can be obtained and that the effect exerted on antenna characteristics by electroconductive members other than the electroconductive members on which the antenna is installed can be reduced, in a portable wireless device having a detachable external part. In other words, in the prior art, high-impedance parts for cutting off conduction of high-frequency current are connected between electroconductive members that are disposed inside the portable wireless device and that contain signal transceiving circuits and the like, as well as a power terminal and earth terminal for connecting to an external charging unit. The mounting location is the main unit of the device. The high-frequency current that flows in the electroconductive member on which the antenna is mounted prevents drainage into electroconductive member disposed inside the external charging unit, and stabilizes antenna characteristics. However, high impedance of 120 π(Ω) or greater in the frequency used by the antenna is required in the high-impedance part in order to achieve this goal.
On the other hand, it is known that the occurrence of oscillations in the ground circuit due to electrostatic discharge current that flows into the ground circuit has a deleterious effect on CMOS circuits, as described in, e.g., non-patent document 1. In the document, a technique is described in which a series resistance or capacitance is added to the circuits as an effective way to deal with this problem.
Patent Document 1: Japanese Laid-Open Patent Application No. 09-275515
Patent Document 2: Japanese Laid-Open Patent Application No. 11-341126
Patent Document 3: Japanese Patent No. 3425073
Non-patent Document 1: Printed Circuit Board Design Techniques for EMC Compliance, by Mark I. Montrose. Translated as “Purinto Kairo no EMC Sekkei” by Hirokazu Deguchi and Masaaki Taue, Oomu-sha, Nov. 25, 1997, pp. 160-161.
However, the prior arts described above have problems such as those described below.
The prior art disclosed in patent document 1 has a problem in that the entry pathway for electrostatic noise is inherently limited to the signal ports. The reason for this is that it is difficult to add a filter part similar to a ground port because impedance in the high-frequency band must be kept low so that an electric potential difference will not be generated in the ground as described above. However, in portable electronic devices such as cellular phones, which run on an internal battery housed in the device, the entry pathway for electrostatic discharge noise is often a connector shell or another ground port rather than a signal port, and this cannot be handled by the art of patent document 1.
Provided hereunder is a general overview of a presumed entry of electrostatic discharge noise into the portable electronic device, the subsequent secondary electric discharge (a removal of electricity to the exterior of the device) that occurs, and the ground current of the printed circuit board that is a further source of LSI malfunctions. As described above, the entry pathway for noise is often a connector shell or another ground port. Electrostatic noise that enters the device from the exterior, or static electricity that is present in the portable electronic device due to friction of the device, may cause a secondary discharge from the ground to the exterior of the device. In such a case, the discharge pathway is a charging terminal or another ground port. In this instance, a discharge can occur on, e.g., a desk having a metal table top or the like, irrespective of whether the charging terminal is mounted inside the charging unit or not. The ground electric current of a printed circuit board produces oscillations due to the discharge electric current that flows at this time, and LSI malfunctions can occur due to the generation of an electric potential difference at the ground location.
The prior art disclosed in patent document 2 experiences a problem when an attempt is made to expand application to the electrostatic discharge noise described above. In other words, in the patent document, the high-frequency suppression part is mounted in the charging unit rather than in the device unit with the aim of preventing a decline in the performance of the device unit and isolating high frequencies between the device unit and the charging unit. Therefore, this method of dealing with static electricity does not function when the device is not mounted in the charging unit.
A purpose of the prior arts disclosed in patent documents 2 and 3 is the control of antenna characteristics, and a purpose is not the suppression of ground current from electrostatic discharge noise and the like. For this reason, characteristics that would be required in a high-frequency suppression part would inevitably be different, and both inventions entail the mounting of high-impedance parts.
The insertion of parts into a circuit as described in non-patent document 1 has a problem in that resistance parts or capacitance parts must be disposed in the circuits when the number of target circuits is considerable, and this leads to a larger device and simultaneously inhibits high-density mounting.
The present invention was contrived in view of the foregoing problems, and a purpose thereof is to provide a portable electronic device that can prevent situations in which a secondary electric discharge (diselectrification) occurs via externally exposed charging electrodes and the like, and circuit malfunctions are caused by oscillations brought about in the ground current of a printed circuit board by a discharge electric current that flows at this time, in cases in which electrostatic discharge noise is applied from the exterior to the portable electronic device.
The portable electronic device according to the present invention is characterized in having a printed circuit board, a casing for housing the printed circuit board, and an electrically conductive portion that is connected to a ground of the printed circuit board and in which a portion thereof is exposed on the exterior of the casing, wherein a high-frequency current suppression part having loss due to eddy current in relation to direct current is serially disposed between the electrically conductive portion and the ground, excluding the electrically conductive portion as a terminal used in data transmission.
When electrostatic discharge noise and the like is applied from the exterior to the portable electronic device, a secondary electric discharge occurs via charging electrodes and other electrically conductive parts that are exposed to the exterior of the casing, ground current of the device causes oscillations due to the discharge current that flows at this time, and an electric potential difference is generated depending on the ground location, whereby malfunctions are generated in the electronic circuits. Circuit malfunctions are prevented in the present invention by serially mounting a high-frequency current suppression part that suppresses a secondary discharge current between the printed circuit board ground and electrically conductive parts partially exposed to the casing exterior. It is preferred that a material that has an eddy current loss in a direct current be used as the high-frequency current suppression part, and it is further preferred that the high-frequency current suppression part be a low-resistance part.
In the present invention, the mounting location of the high-frequency current suppression part is at the portion where the secondary discharge current is discharged to the exterior. Also, countermeasure parts are concentrated in a single location, and an increase in the size of the device can be avoided in comparison with prior art in which it is general practice to mount high-frequency current suppression parts at the point of entrance of electrostatic discharge noise and the like.
The portable electronic device according to the present device is characterized in having a printed circuit board, a casing for housing the printed circuit board, and an electrically conductive portion that is connected to a ground of the printed circuit board and in which a portion thereof is exposed on the exterior of the casing, wherein a high-frequency current suppression part having a resistance value deemed equivalent to a case of connecting a metal wire having high electrical conductivity in relation to direct current is serially disposed between the electrically conductive portion and the ground, excluding the electrically conductive portion as a terminal used in data transmission.
The high-frequency current suppression part can be considered to be one having a resistance value deemed equivalent to a case of connecting a metal wire having high electrical conductivity in relation to direct current. Here, examples of metals having excellent conductivity include silver, copper, gold, aluminum, and other metals, and further include alloys, plating, and other like of these metals. Copper or aluminum is preferred from the standpoint of manufacturing costs. However, gold plating, which has a high resistance to corrosion, can be used in connection portions; and copper, a copper alloy, copper plating, or the like can be used in the wiring portions.
It is thus preferred that the high-frequency current suppression part be a material having a resistance value deemed equivalent to a case of connecting a metal wire having high electrical conductivity in relation to direct current. Specifically, sufficient effect can be achieved when the part is one having an impedance in which the real part Rp is 0.1 (Ω) or greater at high frequencies of 100 MHz or higher, and in which the real part Rp is Z or less, where Z is the magnitude of the characteristic impedance of the printed circuit board.
The imaginary part of the impedance of the high-frequency current suppression part is not required to be large. In other words, impedance that causes the loss of high-frequency current can be set so that the real part Rp is 0.1 (Ω) or greater at high frequencies of 100 MHz or higher, and the imaginary part Xp is (Z2−Rp2)0.5 or less, where Z is the magnitude of the characteristic impedance of the printed circuit board.
The electrically conductive portion exposed on the exterior of the casing can be, e.g., a charging terminal of a cellular phone or the like.
In the present invention, a high-frequency current suppression part is disposed between the ground and an electrically conductive portion connected to the ground of the printed circuit board and a partially exposed on the exterior of the casing. Oscillations of the ground current of the printed circuit board that are induced when electrostatic discharge noise or the like is applied can thus be reduced, and printed circuit board malfunctions and destruction can be prevented. The original functionality is not affected in any way even if high-frequency current is suppressed by the present invention. This is because the sole consideration is to send direct current, or a low-frequency electric current parasitic to the direct current, to the charging terminal by way of the original function in cases in which the discharge pathway of a secondary discharge is a charging terminal of a portable communications terminal. Moreover, mounting space can be saved in comparison with conventional configurations because the high-frequency current suppression parts are concentrated and disposed in a single point.
Embodiments of the present invention will be described in detail below with reference to the attached diagrams.
A printed circuit board 2 is mounted inside a portable electronic device enclosed by a casing 1, and a pair of charging electrodes 3 exposed to the exterior is provided to the casing 1, as shown in
A part having a resistance value deemed equivalent to a case of connecting a metal wire having high electrical conductivity in relation to direct current may be used as the high-frequency current suppression part 5, and the part is not required to have a particularly high resistance value. This is because the present invention suppresses the electrical current oscillation of the printed circuit board ground by deterring the high-frequency current component, and differs from prior art in which a purpose is to reduce an antenna current by setting the impedance high. Here, examples of metals having excellent conductivity include copper and aluminum. Gold plating, which has a high resistance to corrosion, can be used in connection portions; copper, a copper alloy, copper plating, or the like can be used in the wiring portions; and common electrode materials can be used. Specifically, sufficient effect can be achieved when the part is one having an impedance in which the real part Rp is 0.1 (Ω) or greater at high frequencies of 100 MHz or higher, and in which the real part Rp is Z or less, where Z is the magnitude of the characteristic impedance of the printed circuit board 2. The imaginary part of the impedance of the high-frequency current suppression part 5 is not required to be large. The impedance that causes the loss of high-frequency current can be set so that the real part Rp is 0.1 (Ω) or greater at high frequencies of 100 MHz or higher, and the imaginary part Xp is (Z2−Rp2)0.5 or less, where Z is the magnitude of the characteristic impedance of the printed circuit board 2.
Next, a high-frequency current that may be generated in the ground of the printed circuit board via a secondary electrostatic discharge will be described.
Next, results will be described from numerical simulations that were performed in order to confirm the effectiveness of the present embodiment and to investigate the resistance properties required in a high-frequency current suppression part. As a model of a portable communications terminal operating in the high-frequency band, a case was used in which static electricity was applied to a single point at the edge of a printed circuit board, a secondary discharge (removal of electricity) was induced via a charging terminal position set on the printed circuit board, and the electric current distribution on the printed circuit board was calculated in an electromagnetic field simulation.
Next, a modified example of the embodiments of the present invention will be described.
Fundamental configurations of the present invention are shown in
In the present embodiment, the charging terminal (negative electrode, or ground) 4b is configured so as to be exposed to the exterior of the casing 1 via the charging electrodes 3, but the electrically conductive portion that is exposed to the exterior is not limited to the charging terminal and may be a metallic or metal-plated design part or the like used in the vicinity of an earphone jack or a hinge. The electrically conductive portion need not be exposed to the exterior, but may be applied to a metal part, a metal portion, a metal plating, an electrically conductive plating, an electrically conductive coating, or to any location that is connected to ground in which a creepage distance (the spatial distance along the insulation material where an insulation breakdown occurs) required for a secondary discharge is provided through a gap or the like in a seam of the casing.
The present invention can be used advantageously to prevent malfunctions in portable electronic devices and other electronic circuits brought about by electrostatic discharges.
Number | Date | Country | Kind |
---|---|---|---|
2005-313580 | Oct 2005 | JP | national |
Filing Document | Filing Date | Country | Kind | 371c Date |
---|---|---|---|---|
PCT/JP2006/318068 | 9/12/2006 | WO | 00 | 1/2/2009 |