Pin-in-hole mounted pins

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CPC
H05K2201/10303

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/10303Pin-in-hole mounted pins

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Electromagnetic interference shielding and thermal management syste...
- Patent number 12,137,515
- Issue date Nov 5, 2024
- Aptiv Technologies AG
- Scott D. Brandenburg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board assembly
- Patent number 12,068,552
- Issue date Aug 20, 2024
- Hitachi Astemo, Ltd.
- Shinya Kawakita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and process for creating high-performance coax sockets
- Patent number 12,052,830
- Issue date Jul 30, 2024
- Advantest America, Inc
- Donald Eric Thompson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Circuit structure and electrical junction box
- Patent number 12,027,500
- Issue date Jul 2, 2024
- Autonetworks Technologies, Ltd.
- Akira Haraguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid state relay
- Patent number 11,949,407
- Issue date Apr 2, 2024
- Zonit Structured Solutions, LLC
- Steve Chapel
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Panel-molded electronic assemblies
- Patent number 11,751,338
- Issue date Sep 5, 2023
- Vicor Corporation
- Patrizio Vinciarelli
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High-current contact device and method of producing a high-current...
- Patent number 11,688,984
- Issue date Jun 27, 2023
- TE Connectivity Germany GmbH
- Dominik Heiss
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer structure and related method of manufacture for electronics
- Patent number 11,594,482
- Issue date Feb 28, 2023
- TACTOTEK OY
- Jarmo Sääski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-hole and surface mount printed circuit card connections for...
- Patent number 11,570,894
- Issue date Jan 31, 2023
- Rockwell Collins, Inc.
- James B. Mayfield
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solid state relay
- Patent number 11,522,534
- Issue date Dec 6, 2022
- Zonit Structured Solutions, LLC
- Steve Chapel
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
High speed traceless interconnect
- Patent number 11,482,802
- Issue date Oct 25, 2022
- Cisco Technology, Inc.
- Jason Visneski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structurally improved current leakage interrupter
- Patent number 11,469,556
- Issue date Oct 11, 2022
- Hin Yeung Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board module
- Patent number 11,460,015
- Issue date Oct 4, 2022
- ebm-papst St. Georgen GmbH & Co. KG
- Volker Ehlers
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Grant
Connectors for interconnecting microelectronic circuits
- Patent number 11,431,115
- Issue date Aug 30, 2022
- Centipede Systems, Inc.
- Thomas H. Di Stefano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pin side edge mount connector and systems and methods thereof
- Patent number 11,431,117
- Issue date Aug 30, 2022
- Lockheed Martin Corporation
- Samuel Muen Shyu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Camera head
- Patent number 11,395,406
- Issue date Jul 19, 2022
- SCOUTCAM LTD.
- Amir Govrin
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method for producing electrical connections
- Patent number 11,317,518
- Issue date Apr 26, 2022
- Lewis James Marggraff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated multilayer structure and a method for manufacturing a mu...
- Patent number 11,309,676
- Issue date Apr 19, 2022
- TACTOTEK OY
- Ilpo Hänninen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component and method for producing same
- Patent number 11,289,425
- Issue date Mar 29, 2022
- Siemens Aktiengesellschaft
- Rene Blank
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetic terminal for an AIMD having a pin joint in a feedthrough c...
- Patent number 11,202,916
- Issue date Dec 21, 2021
- Greatbatch Ltd.
- Dominick J. Frustaci
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having buffer structure for external terminals
- Patent number 11,191,157
- Issue date Nov 30, 2021
- Fuji Electric Co., Ltd.
- Toshiyuki Miyasaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board assembly
- Patent number 11,184,979
- Issue date Nov 23, 2021
- Phoenix Contact GmbH & Co. KG
- Werner Schäfertöns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical interconnection system and method for electrically inter...
- Patent number 11,165,178
- Issue date Nov 2, 2021
- Lear Corporation
- Marc Tena Gil
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Structure with controlled capillary coverage
- Patent number 11,152,226
- Issue date Oct 19, 2021
- International Business Machines Corporation
- Kevin Drummond
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board configuration to facilitate a surface mount d...
- Patent number 11,153,971
- Issue date Oct 19, 2021
- Cisco Technology, Inc.
- Fanghui Ren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connector and luminaire assembly
- Patent number 11,149,933
- Issue date Oct 19, 2021
- Suzhou Opple Lighting Co., Ltd.
- Xiufeng Shi
- F21 - LIGHTING
Information Patent Grant
Electronic module with an electrically conductive press-fit termina...
- Patent number 11,114,780
- Issue date Sep 7, 2021
- Infineon Technologies AG
- Katharina Teichmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer structure and related method of manufacture for electronics
- Patent number 11,088,066
- Issue date Aug 10, 2021
- TACTOTEK OY
- Jarmo Sääski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit substrate arrangement with improved electrical contact
- Patent number 11,071,203
- Issue date Jul 20, 2021
- Robert Bosch GmbH
- Thomas Wiesa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of integrating an electronic module with conductive fabric
- Patent number 11,051,401
- Issue date Jun 29, 2021
- Flextronics AP, LLC
- Weifeng Liu
- D03 - WEAVING

Patents Applicationslast 30 patents

Information Patent Application
DIRECT CONNECTION OF CONTACTORS AND SHUNT TO PRINTED CIRCUIT BOARD
- Publication number 20240413557
- Publication date Dec 12, 2024
- Our Next Energy, Inc.
- Richard Hampo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STORAGE
- Publication number 20240324116
- Publication date Sep 26, 2024
- Kabushiki Kaisha Toshiba
- Hayato YAMAGUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC CONTROL DEVICE
- Publication number 20240107687
- Publication date Mar 28, 2024
- LG Innotek Co., Ltd.
- Kun Yong SONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE TO BOARD INTERCONNECT WITH LIQUID METAL AND SURFACE PINS
- Publication number 20230395480
- Publication date Dec 7, 2023
- Intel Corporation
- Tin Poay Chuah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTION ELEMENT FOR ELECTRICALLY CONNECTING TWO CIRCUIT CARRIERS
- Publication number 20230380064
- Publication date Nov 23, 2023
- ROBERT BOSCH GmbH
- Joerg Offterdinger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPRESSED PINOUTS FOR HIGH-SPEED DIFFERENTIAL PAIRS
- Publication number 20230380067
- Publication date Nov 23, 2023
- Intel Corporation
- Raul Enriquez Shibayama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TEMPERATURE MEASURING DEVICE
- Publication number 20230358615
- Publication date Nov 9, 2023
- LISA DRAXLMAIER GMBH
- Stephan SCHAFFERHANS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RADAR SYSTEM
- Publication number 20230319981
- Publication date Oct 5, 2023
- ROBERT BOSCH GmbH
- Christian Hollaender
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for manufacturing a component
- Publication number 20230209703
- Publication date Jun 29, 2023
- Scio Holding GmbH
- Marius Sillmann
- B60 - VEHICLES IN GENERAL
Information Patent Application
METHOD AND PROCESS FOR CREATING HIGH-PERFORMANCE COAX SOCKETS
- Publication number 20230180397
- Publication date Jun 8, 2023
- R&D Circuits
- Donald Eric Thompson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
POWER SUPPLY MODULE AND POWER DEVICE
- Publication number 20230036995
- Publication date Feb 2, 2023
- Huawei Digital Power Technologies Co., Ltd.
- Xiaojing LIAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISPLAY PANEL AND DISPLAY DEVICE
- Publication number 20220408564
- Publication date Dec 22, 2022
- WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Bo LIU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTOR
- Publication number 20220285862
- Publication date Sep 8, 2022
- YAZAKI CORPORATION
- Fuminori KONDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit Board
- Publication number 20220271453
- Publication date Aug 25, 2022
- Hitachi Astemo, Ltd.
- Shinya KAWAKITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROMAGNETIC INTERFERENCE SHIELDING AND THERMAL MANAGEMENT SYSTE...
- Publication number 20220248525
- Publication date Aug 4, 2022
- Aptiv Technologies Limited
- Scott D. Brandenburg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH SPEED TRACELESS INTERCONNECT
- Publication number 20220181807
- Publication date Jun 9, 2022
- Cisco Technology, Inc.
- Jason Visneski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20220077103
- Publication date Mar 10, 2022
- Fuji Electric Co., Ltd.
- Narumi SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-HOLE AND SURFACE MOUNT PRINTED CIRCUIT CARD CONNECTIONS FOR...
- Publication number 20210360789
- Publication date Nov 18, 2021
- Rockwell Collins, Inc.
- James B. Mayfield
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
AN INTEGRATED MULTILAYER STRUCTURE AND A METHOD FOR MANUFACTURING A...
- Publication number 20210359481
- Publication date Nov 18, 2021
- TactoTek Oy
- Ilpo HÄNNINEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Connectors for Interconnecting Microelectronic Circuits
- Publication number 20210257758
- Publication date Aug 19, 2021
- Centipede Systems, Inc.
- Thomas H. Di Stefano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING BUFFER STRUCTURE FOR EXTERNAL TERMINALS
- Publication number 20210235579
- Publication date Jul 29, 2021
- Fuji Electric Co., Ltd.
- Toshiyuki MIYASAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Current leakage interrupter
- Publication number 20210194189
- Publication date Jun 24, 2021
- Hin Yeung LI
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
UNMANNED AIRCRAFT SYSTEM WITH SWAPPABLE COMPONENTS AND SHIELDED CIR...
- Publication number 20210171197
- Publication date Jun 10, 2021
- Zipline International Inc.
- Ethan C. Anderson
- B64 - AIRCRAFT AVIATION COSMONAUTICS
Information Patent Application
PIN SIDE EDGE MOUNT CONNECTOR AND SYSTEMS AND METHODS THEREOF
- Publication number 20210151913
- Publication date May 20, 2021
- Lockheed Martin Corporation
- Samuel Muen SHYU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL INTERCONNECTION SYSTEM AND METHOD FOR ELECTRICALLY INTER...
- Publication number 20210135384
- Publication date May 6, 2021
- LEAR CORPORATION
- Marc TENA GIL
- B60 - VEHICLES IN GENERAL
Information Patent Application
STRUCTURE WITH CONTROLLED CAPILLARY COVERAGE
- Publication number 20210111039
- Publication date Apr 15, 2021
- International Business Machines Corporation
- Kevin Drummond
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROL DEVICE FOR UNMANNED AERIAL VEHICLE AND UNMANNED AERIAL VEHICLE
- Publication number 20210100100
- Publication date Apr 1, 2021
- Shanghai Topxgun Robotics Co., Ltd.
- Liangliang Yin
- B64 - AIRCRAFT AVIATION COSMONAUTICS
Information Patent Application
PRINTED CIRCUIT BOARD ASSEMBLY
- Publication number 20210100102
- Publication date Apr 1, 2021
- Phoenix Contact GmbH & Co. KG
- Werner SCHÄFERTÖNS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAMERA HEAD
- Publication number 20210084766
- Publication date Mar 18, 2021
- MEDIGUS LTD.
- Amir GOVRIN
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
CIRCUIT SUBSTRATE ARRANGEMENT WITH IMPROVED ELECTRICAL CONTACT
- Publication number 20210076497
- Publication date Mar 11, 2021
- ROBERT BOSCH GmbH
- Thomas Wiesa
- H01 - BASIC ELECTRIC ELEMENTS

Pin-in-hole mounted pins

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electromagnetic interference shielding and thermal management syste...

Circuit board assembly

Method and process for creating high-performance coax sockets

Circuit structure and electrical junction box

Solid state relay

Panel-molded electronic assemblies

High-current contact device and method of producing a high-current...

Multilayer structure and related method of manufacture for electronics

Through-hole and surface mount printed circuit card connections for...

Solid state relay

High speed traceless interconnect

Structurally improved current leakage interrupter

Printed circuit board module

Connectors for interconnecting microelectronic circuits

Pin side edge mount connector and systems and methods thereof

Camera head

Method for producing electrical connections

Integrated multilayer structure and a method for manufacturing a mu...

Semiconductor component and method for producing same

Hermetic terminal for an AIMD having a pin joint in a feedthrough c...

Semiconductor device having buffer structure for external terminals

Printed circuit board assembly

Electrical interconnection system and method for electrically inter...

Structure with controlled capillary coverage

Printed circuit board configuration to facilitate a surface mount d...

Electrical connector and luminaire assembly

Electronic module with an electrically conductive press-fit termina...

Multilayer structure and related method of manufacture for electronics

Circuit substrate arrangement with improved electrical contact

Method of integrating an electronic module with conductive fabric

Patents Applicationslast 30 patents

DIRECT CONNECTION OF CONTACTORS AND SHUNT TO PRINTED CIRCUIT BOARD

STORAGE

ELECTRONIC CONTROL DEVICE

SUBSTRATE TO BOARD INTERCONNECT WITH LIQUID METAL AND SURFACE PINS

CONNECTION ELEMENT FOR ELECTRICALLY CONNECTING TWO CIRCUIT CARRIERS

COMPRESSED PINOUTS FOR HIGH-SPEED DIFFERENTIAL PAIRS

TEMPERATURE MEASURING DEVICE

RADAR SYSTEM

Method for manufacturing a component

METHOD AND PROCESS FOR CREATING HIGH-PERFORMANCE COAX SOCKETS

POWER SUPPLY MODULE AND POWER DEVICE

DISPLAY PANEL AND DISPLAY DEVICE

CONNECTOR

Circuit Board

ELECTROMAGNETIC INTERFERENCE SHIELDING AND THERMAL MANAGEMENT SYSTE...

HIGH SPEED TRACELESS INTERCONNECT

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

THROUGH-HOLE AND SURFACE MOUNT PRINTED CIRCUIT CARD CONNECTIONS FOR...

AN INTEGRATED MULTILAYER STRUCTURE AND A METHOD FOR MANUFACTURING A...

Connectors for Interconnecting Microelectronic Circuits

SEMICONDUCTOR DEVICE HAVING BUFFER STRUCTURE FOR EXTERNAL TERMINALS

Current leakage interrupter

UNMANNED AIRCRAFT SYSTEM WITH SWAPPABLE COMPONENTS AND SHIELDED CIR...

PIN SIDE EDGE MOUNT CONNECTOR AND SYSTEMS AND METHODS THEREOF

ELECTRICAL INTERCONNECTION SYSTEM AND METHOD FOR ELECTRICALLY INTER...

STRUCTURE WITH CONTROLLED CAPILLARY COVERAGE

CONTROL DEVICE FOR UNMANNED AERIAL VEHICLE AND UNMANNED AERIAL VEHICLE

PRINTED CIRCUIT BOARD ASSEMBLY

CAMERA HEAD

CIRCUIT SUBSTRATE ARRANGEMENT WITH IMPROVED ELECTRICAL CONTACT