Claims
- 1. A method of forming an image comprising image-wise exposing a light-sensitive material comprising a support having in order thereon a light-sensitive layer containing 20 to 100% by weight of an o-quinone diazide compound, the solubility of said compound being increased in alkaline solution upon irradiation with active light rays, said light-sensitive layer being coated directly on said support, and a non-light sensitive organic coating layer, said organic coating layer comprising a water-insoluble but organic solvent soluble high molecular weight compound having film forming properties, said high molecular weight compound being selected from the group consisting of styrene/maleic anhydride copolymer, styrene/acrylic acid copolymer, polyvinyl butyral, shellac and polyamide resin, said organic coating layer being water insoluble and barely soluble in alkaline solution, but permeable to alkaline solution, the exposed portion of said light-sensitive layer being completely removed by alkaline solution development along with superimposed corresponding co-extensive exposed portion of the organic coating layer by the alkaline developer, permeating the organic coating layer and dissolving the exposed portion of the light-sensitive layer, and developing the exposed light-sensitive material in an alkaline developer solution comprising an aqueous solution of an inorganic alkali or a basic solvent, the concentration of said alkali or solvent in said developer solution being about 1 to 20% by weight, said non-light-sensitive layer not dissolving in the developer solution more readily than the light-sensitive part of the light-sensitive layer, thereby forming an image of unexposed light-sensitive layer superimposed by corresponding co-extensive unexposed portion of organic coating layer, the thickness of each of said layers in said light-sensitive material being from about 0.01 g/m.sup.2 to 7.0 g/m.sup.2.
- 2. The process of claim 1, wherein said light-sensitive layer comprises said o-quinone diazide compound and an organic resin which is alkali soluble or barely soluble in alkali solution.
- 3. The process of claim 2, wherein said organic resin is a phenol resin, a cresol resin, a styrene/maleic anhydride copolymer or shellac.
- 4. The process of claim 1 wherein said support is a metal sheet, a resin film, a paper, a resin film-paper laminate, or a glass sheet.
- 5. The process of claim 4, wherein the surface of said support is hydrophilic.
- 6. The process of claim 5, wherein said support is an aluminum sheet.
- 7. The process of claim 1, wherein said O-quinone diazide compound is an ester of an aromatic polyhydroxy compound and an O-quinone diazide sulfonic acid.
- 8. The process of claim 7, wherein said O-quinone diazide compound is 2,2'-dihydroxydiphenyl-bis-(naphthoquinone-1,2-diazide-5-sulfonic acid ester), 2,3,4-trioxybenzophenone-bis-(naphthoquinone-1,2-diazide-5-sulfonic acid ester), 2,7-dihydroxynaphthalene-bis-(naphthoquinone-1,2-diazide-5-sulfonic acid ester), the ester of a phenol-formaldehyde resin and naphthoquinone-1,2-diazide-5-sulfonic acid, or the naphthoquinone-1,2-diazide-5-sulfonic acid ester of the polyhydroxyphenyl obtained by the condensation of acetone and pyrogallol.
- 9. The process of claim 1, wherein the combined thickness of said two layers is 7.0 g/m.sup.2 or less.
Priority Claims (1)
Number |
Date |
Country |
Kind |
48-60074 |
May 1973 |
JPX |
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Parent Case Info
This application is a divisional application of Ser. No. 746,555, filed Dec. 1, 1976, in turn a continuation application of Ser. No. 474,465, filed May 29, 1974, now abandoned.
US Referenced Citations (20)
Divisions (1)
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Date |
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746555 |
Dec 1976 |
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Continuations (1)
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474465 |
May 1974 |
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