Patent Application
20250105070
The present disclosure relates to a power module and a power conversion device.
Priority is claimed on Japanese Patent Application No. 2022-75437, filed Apr. 28, 2022, the content of which is incorporated herein by reference.
Patent Document 1, for example, discloses a power semiconductor module (power module) in which a groove portion is formed between terminal block portions on which main circuit terminals are disposed.
The groove portion secures a creepage distance between the main circuit terminals and, as a result, the module is made compact in size while securing an insulation distance compliant with international standards.
Insulation distance is composed of two elements: a creepage distance and a clearance distance.
Patent Document 1: JP 2012-5301 A
In the field of power modules, even if the creepage distance between terminals is secured by a groove, it is necessary to secure the clearance distance between the terminals according to a magnitude of a voltage applied to the terminals.
Securing the insulation distance therefore makes it necessary to increase the clearance distance according to the voltage applied to the terminal.
This may, as a result, increase the size of the power module.
The present disclosure has been made to solve the problem described above, and an object of the present disclosure is to provide a power module and a power conversion device in which an increase in size can be suppressed.
To solve the problem described above, a power module according to the present disclosure includes a main terminal portion including a first conductor including a P terminal at one end of the first conductor, the P terminal including a first main surface and a first back surface facing a side opposite to the first main surface, and a second conductor including an N terminal at one end of the second conductor, the N terminal including a second main surface facing a direction identical to a direction in which the first main surface faces and a second back surface facing a side opposite to the second main surface, the second conductor being connected to a capacitor together with the first conductor and being arranged side by side with the first conductor with a gap interposed between the second conductor and the first conductor; a circuit board including a power semiconductor element configured to convert a DC voltage from the main terminal portion into an AC voltage; an output terminal portion configured to output an AC voltage from the power semiconductor element; a pair of fastening portions connecting the P terminal and a positive-electrode-side terminal of the capacitor to each other and connecting the N terminal and a negative-electrode-side terminal of the capacitor to each other; a base plate to which the circuit board is fixed, the base plate including a front surface facing the first back surface and the second back surface; a case fixed to the front surface of the base plate and including an accommodation space accommodating the P terminal, the N terminal, and the pair of fastening portions; and a first insulating portion disposed in the accommodation space and covering the first main surface, the second main surface, and the pair of fastening portions from a side opposite to the base plate, in a state of the gap being filled with the first insulating portion.
A power conversion device according to the present disclosure includes the power module described above, the capacitor, and a second insulating portion formed integrally with the positive-electrode-side terminal and the negative-electrode-side terminal so as to extend from the first insulating portion, and covering the positive-electrode-side terminal and the negative-electrode-side terminal from an outer side.
According to the present disclosure, it is possible to provide a power module and a power conversion device in which an increase in size can be suppressed.
Further,
Hereinafter, embodiments for implementing a power conversion device according to the present disclosure will be described with reference to the accompanying drawings.
A power conversion device is a device that converts DC power into three-phase AC power or the like.
Examples of the power conversion device of the present embodiment include an inverter used in a system of a power plant or the like, and an inverter used for driving an electric motor of an electric vehicle or the like.
As illustrated in
The casing 1 forms an outer shell of the power conversion device 100.
The casing 1 in the present embodiment is formed of a metal such as aluminum, a synthetic resin, or the like, and has a rectangular parallelepiped shape.
The casing 1 includes two side surfaces disposed back to back.
Hereinafter, of these two side surfaces, the side surface facing one side is referred to as an input-side side surface 1a, and the side surface facing the other side is referred to as an output-side side surface 1b.
An external input conductor 2 for inputting DC power is led out from the input-side side surface 1a.
The external input conductor 2 is a pair of electrical conductors (busbars) that supply DC power supplied from a power grid or the like outside the power conversion device 100 to the capacitor.
The external input conductor 2 in the present embodiment is formed of a metal containing copper or the like.
One end of the external input conductor 2 is connected to the capacitor 3, and the other end of the external input conductor 2 extends in a direction intersecting the input-side side surface 1a of the casing 1.
The capacitor 3 is a smoothing capacitor for storing electric charge input from the external input conductor 2 and suppressing voltage fluctuation associated with power conversion.
The DC voltage input from the external input conductor 2 is supplied to the power conversion unit 4 via the capacitor 3.
The capacitor 3 includes a main body portion 3a and a connection conductor 3b.
The main body portion 3a is a portion that mainly exhibits the function of the smoothing capacitor described above.
The connection conductor 3b is an electrical conductor (busbar) for transmitting power from the main body portion 3a to the power conversion unit 4.
The connection conductor 3b is formed of a metal such as copper.
The connection conductor 3b has a positive-electrode-side terminal 3p and a negative-electrode-side terminal 3n.
The positive-electrode-side terminal 3p forms a positive electrode of the capacitor 3 and is a current path connecting the main body portion 3a and a positive electrode of a power module 400.
The negative-electrode-side terminal 3n forms a negative electrode of the capacitor 3 and is a current path connecting the main body portion 3a and a negative electrode of the power module 400.
The positive-electrode-side terminal 3p and the negative-electrode-side terminal 3n are disposed side by side at an interval.
One end of each of the positive-electrode-side terminal 3p and the negative-electrode-side terminal 3n is connected to the main body portion 3a.
Note that a detailed illustration of a connected state between the positive-electrode-side terminal 3p and the negative-electrode-side terminal 3n and the main body portion 3a is omitted.
The other end of each of the positive-electrode-side terminal 3p and the negative-electrode-side terminal 3n is connected to the power module 400.
As illustrated in
Hereinafter, the interval that occurs between the positive-electrode-side terminal 3p and the negative-electrode-side terminal 3n by the two being disposed side by side is referred to as a gap G1.
In other words, the negative-electrode-side terminal 3n is arranged side by side with the positive-electrode-side terminal 3p with the gap G1 interposed therebetween.
A clearance distance (isolation distance) is secured by the gap G1 so that discharge does not occur between the positive-electrode-side terminal 3p and the negative-electrode-side terminal 3n due to a potential difference generated between the positive-electrode-side terminal 3p and the negative-electrode-side terminal 3n.
The clearance distance in the present embodiment is desirably, for example, from 1 mm to 10 mm.
As illustrated in
In order to output three-phase AC power, the power conversion unit 4 in the present embodiment includes three power modules 400 respectively responsible for outputs for a U phase, a V phase, and a W phase.
Accordingly, the power conversion device 100 in the present embodiment is a three-phase inverter including the three power modules 400.
A configuration of the power module 400 will be described in detail below.
The external output conductor 5 is an electrical conductor (busbar) that supplies the AC power converted by the power conversion unit 4 to a device provided outside the power conversion device 100.
The power conversion device 100 in the present embodiment includes three external output conductors 5 for the U phase, the V phase, and the W phase, and one of these external output conductors 5 is provided in each power module 400.
The external output conductor 5 in the present embodiment is formed of a metal containing copper or the like.
One end of each external output conductor 5 is connected to the power module 400, and the other end of each external output conductor 5 extends in a direction intersecting the output-side side surface 1b of the casing 1.
As illustrated in
Note that wiring or a terminal (not illustrated) for current output, for example, is connected to the other end side of the external output conductor 5.
This makes it possible to output AC power to outside the power conversion device 100.
As illustrated in
The cooling device 6 is provided layered on the casing 1, and is fixed to and integrated with the casing 1.
A liquid coolant such as water, for example, is introduced into the cooling device 6 from the outside.
This liquid coolant cools the power module 400 by performing heat exchange with the power module 400 and being heated.
Hereinafter, a configuration of the power module 400 included in the power conversion unit 4 according to the present embodiment will be described.
The power module 400 is a device that converts input power and outputs the converted power.
The power module 400 in the present embodiment constitutes part of the power conversion unit 4.
As illustrated in
The base plate 10 is a member having a flat plate shape.
The base plate 10 includes a front surface 10a and a back surface 10b positioned on a back side of this front surface 10a.
That is, the front surface 10a and the back surface 10b of the base plate 10 are back-to-back in a state of being parallel to each other.
The back surface 10b of the base plate 10 is fixed to, for example, the cooling device 6 (refer to
Copper, for example, is adopted for the base plate 10 in the present embodiment.
Note that a metal such as aluminum may be adopted for the base plate 10.
The circuit board 20 includes an insulating plate 21, a front surface pattern 22, a power semiconductor element 23, and a back surface pattern 24.
The insulating plate 21 has a flat plate shape.
The insulating plate 21 includes a first surface 21a and a second surface 21b positioned on a back side of this first surface 21a.
That is, the first surface 21a and the second surface 21b of the insulating plate 21 are back-to-back in a state of being parallel to each other.
The back surface pattern 24, which is a pattern of copper foil or the like, is formed on the entire second surface 21b of the insulating plate 21.
The back surface pattern 24 is fixed to a center of the front surface 10a of the base plate 10 via a bonding material S.
The insulating plate 21 in the present embodiment is formed of, for example, an insulating material such as ceramic.
Note that, as the insulating material that forms the insulating plate 21, a paper phenol, a paper epoxy, a glass composite, a glass epoxy, a glass polyimide, a fluororesin, or the like can be adopted in addition to ceramic.
The front surface pattern 22 is a pattern of copper foil or the like formed on the first surface 21a of the insulating plate 21 and extending in a planar shape.
The front surface pattern 22 is formed by, for example, being fixed to the first surface 21a of the insulating plate 21 by joining or the like and then being etched or the like.
A plurality of the front surface patterns 22 are disposed on the first surface 21a of the insulating plate 21.
The plurality of front surface patterns 22 are disposed adjacent to each other with gaps interposed therebetween in an extending direction of the insulating plate 21. In the present embodiment, a case in which three front surface patterns 22 are disposed on the first surface 21a will be described as an example.
Hereinafter, as illustrated in
The first front surface pattern 221 and the second front surface pattern 222 are patterns for exchanging input and output of a direct current with the capacitor 3, and correspond to an inlet section or an outlet section of a loop between P and N formed in the front surface patterns 22.
The external output conductor 5 for outputting the AC current converted by the power semiconductor element 23 to a load (not illustrated) provided outside the power conversion device 100 is connected to the third front surface pattern 223.
The power semiconductor element 23 is a circuit element that converts power by a switching operation of turning on and off a voltage or a current.
The power semiconductor element 23 is, for example, a switching element such as an insulated-gate bipolar transistor (IGBT) or a metal-oxide-semiconductor field-effect transistor (MOSFET).
In a case in which an IGBT is used, it is necessary to arrange in parallel a diode that causes a current to flow in a direction opposite to that of the IGBT. However, in the present embodiment, as an example, a case in which a MOSFET is applied to the power semiconductor is illustrated, and four power semiconductor elements 23 are connected to the front surface patterns 22 of the circuit board 20.
The four power semiconductor elements 23 in the present embodiment are constituted by two first power semiconductor elements 231 and two second power semiconductor elements 232.
The first power semiconductor elements 231 are connected to the first front surface pattern 221.
The second power semiconductor elements 232 are connected to the third front surface pattern 223.
In a case in which the power semiconductor element 23 is a MOSFET, the power semiconductor element 23 includes an input surface on which an input terminal (not illustrated) corresponding to a drain is formed, an output surface on which an output terminal (not illustrated) corresponding to a source is formed, and a gate corresponding to a control signal input terminal for controlling the switching of the power semiconductor element 23.
The input surface of each power semiconductor element 23 is electrically connected to the front surface pattern 22 via a bonding material.
The bonding wire Wb serving as a conducting wire is electrically connected to the output surface of each power semiconductor element 23 at one end.
The bonding wire Wb is formed of a metal such as aluminum.
That is, the front surface patterns 22 formed on the first surface 21a are electrically connected to each other by wire bonding.
The input surface of the first power semiconductor element 231 is connected to the first front surface pattern 221.
The bonding wire Wb connected to the output surface of the first power semiconductor element 231 at the one end is connected to the third front surface pattern 223 at the other end.
The input surface of the second power semiconductor element 232 is connected to the third front surface pattern 223.
The bonding wire Wb connected to the output surface of the second power semiconductor element 232 at the one end is connected to the second front surface pattern 222 at the other end.
DC power is input to the first power semiconductor element 231 via the first front surface pattern 221, and DC power is input to the second power semiconductor element 232 via the second front surface pattern 222 and the bonding wire Wb connecting this second front surface pattern 222 and the second power semiconductor element 232.
The first power semiconductor element 231 and the second power semiconductor element 232 perform a switching operation, thereby converting the DC power described above into AC power, and the AC power is output to the third front surface pattern 223.
A control signal generated by a control unit (not illustrated) provided outside the circuit board 20 is input to the power semiconductor element 23.
The power semiconductor element 23 performs switching in accordance with the control signal.
Note that, in a case in which the power semiconductor element 23 is an IGBT, the power semiconductor element 23 includes an input surface corresponding to a collector, an output surface corresponding to an emitter, and a gate corresponding to a control signal input terminal.
As illustrated in
The main terminal portion 30 is formed of a metal such as copper.
The main terminal portion 30 includes a first conductor 31 as a positive electrode and a second conductor 32 as a negative electrode.
The first conductor 31 and the second conductor 32 are disposed side by side with a gap G2 interposed therebetween.
In other words, the second conductor 32 is arranged side by side with the first conductor 31 with the gap G2 interposed therebetween.
The first conductor 31 includes a P terminal 310 connected to the positive-electrode-side terminal 3p of the capacitor 3, and a first connection portion 311 extending integrally with the P terminal 310 from the P terminal 310 and connected to the first front surface pattern 221.
Accordingly, the first conductor 31 includes the P terminal 310 at one end.
The P terminal 310 has a flat plate shape.
The P terminal 310 includes a first main surface 310a and a first back surface (not illustrated for convenience of illustration) facing the side opposite to this first main surface 310a.
In the P terminal 310, a fastening hole that extends through this P terminal 310 and opens to each of the first main surface 310a and the first back surface is formed.
The P terminal 310 is disposed with this fastening hole overlapping the hole h1 formed in the positive-electrode-side terminal 3p.
Accordingly, the P terminal 310 is disposed in a state of overlapping the positive-electrode-side terminal 3p.
The first back surface of the P terminal 310 faces the front surface 10a of the base plate 10.
The second conductor 32 includes an N terminal 320 connected to the negative-electrode-side terminal 3n of the capacitor 3, and a second connection portion 321 extending integrally with this N terminal 320 from the N terminal 320 and connected to the second front surface pattern 222.
Accordingly, the second conductor 32 includes the N terminal 320 at one end.
The N terminal 320 has a flat plate shape.
The N terminal 320 includes a second main surface 320a facing the same direction as the first main surface 310a of the P terminal 310, and a second back surface 320b facing the side opposite to this second main surface 320a.
As illustrated in
The N terminal 320 is disposed with this fastening hole h3 overlapping the hole h1 formed in the negative-electrode-side terminal 3n.
The second back surface 320b of the N terminal 320 faces the front surface 10a of the base plate 10.
The main-terminal-side fastening portions 40 are a pair of fastening members that connect the P terminal 310 of the first conductor 31 and the positive-electrode-side terminal 3p of the capacitor 3, and the N terminal 320 of the second conductor 32 and the negative-electrode-side terminal 3n of the capacitor 3 to each other.
The main-terminal-side fastening portions 40 are formed of a metal such as copper.
The main-terminal-side fastening portions 40 in the present embodiment each include a bolt 41 including a head portion 410 and a thread portion 411 formed integrally with the head portion 410, and a nut 42.
Hereinafter, a configuration of, among the pair of main-terminal-side fastening portions 40, the main-terminal-side fastening portion 40 that connects the N terminal 320 and the negative-electrode-side terminal 3n will be described as illustrated in
The main-terminal-side fastening portion 40 that connects the P terminal 310 and the positive-electrode-side terminal 3p has the same configuration as the main-terminal-side fastening portion 40 that connects the N terminal 320 and the negative-electrode-side terminal 3n, and thus a description thereof will be omitted.
The thread portion 411, in a state in which the head portion 410 is abutted against the negative-electrode-side terminal 3n, is inserted through the hole h1 of the negative-electrode-side terminal 3n and the hole h3 of the N terminal 320.
The nut 42, in a state of being screwed on the thread portion 411 of the bolt 41, is abutted against the N terminal 320 from the side opposite to the head portion 410 of the bolt 41.
The negative-electrode-side terminal 3n and the N terminal 320 are integrally fixed by being sandwiched between the bolt 41 and the nut 42.
The output terminal portion 50 is an electrical conductor (busbar) that electrically connects the external output conductor 5 and the circuit board 20.
The output terminal portion 50 is formed of a metal such as copper.
The output terminal portion 50 is connected to the third front surface pattern 223 of the circuit board 20 at one end.
A fastening hole h4 is formed in the output terminal portion 50 at the other end.
The output terminal portion 50 is disposed with this fastening hole h4 overlapping the hole h2 formed in the external output conductor 5.
Accordingly, the output terminal portion 50 is disposed in a state of overlapping the external output conductor 5.
The output-side fastening portion 60 is a fastening member that connects the external output conductor 5 and the output terminal portion 50.
The output-side fastening portion 60 is formed of a metal such as copper.
The output-side fastening portion 60 in the present embodiment includes a bolt 61 including a head portion 610 and a thread portion 611 formed integrally with the head portion 610, and a nut 62.
The thread portion 611, in a state in which the head portion 610 is abutted against the external output conductor 5, is inserted through the hole h2 of the external output conductor 5 and the hole h4 of the output terminal portion 50.
The nut 62, in a state of being screwed on the thread portion 611 of the bolt 61, is abutted against the output terminal portion 50 from the side opposite to the head portion 610 of the bolt 61.
The external output conductor 5 and the output terminal portion 50 are integrally fixed by being sandwiched between the bolt 61 and the nut 62.
The case 70 is a member that mechanically reinforces the main terminal portion 30 and the output terminal portion 50 in a state of being fixed to the front surface 10a of the base plate 10.
The case 70 is formed of, for example, a synthetic resin material (insulating material).
As the material forming the case 70 in the present embodiment, polyphenylene sulfide (PPS), for example, can be adopted.
Note that a synthetic resin material other than PPS may be adopted for the case 70.
The case 70 is fixed to the front surface 10a of the base plate 10 by, for example, an adhesive.
The case 70, in a state of covering the first conductor 31 and the second conductor 32 of the main terminal portion 30 as well as the output terminal portion 50 from the outer side, surrounds the circuit board 20 from the outer side.
As illustrated in
Accordingly, the case 70 defines a space in which the circuit board 20 is accommodated together with the base plate 10.
In the present embodiment, this space in which the circuit board 20 is accommodated is referred to as a potting space Rp.
Furthermore, the case 70 is formed with a first groove portion 71 defining a first accommodation space RI (accommodation space) that accommodates the P terminal 310 of the first conductor 31, the N terminal 320 of the second conductor 32, and the pair of main-terminal-side fastening portions 40 therein, and a second groove portion 72 defining a second accommodation space R2 that accommodates the output terminal portion 50 and the output-side fastening portion 60 therein.
That is, the case 70 includes the first accommodation space R1 and the second accommodation space R2.
In the present embodiment, a portion of the first conductor 31 disposed in the first accommodation space R1 serves as the P terminal 310 described above, and a portion of the second conductor 32 disposed in the first accommodation space R1 serves as the N terminal 320 described above.
The potting space Rp described above and the first accommodation space R1 and the second accommodation space R2 formed in the case 70 open in a direction away from the front surface 10a.
The potting space Rp, the first accommodation space R1, and the second accommodation space R2 are isolated from each other by partition walls of the case 70 in an extending direction of the front surface 10a, and form spaces independent of one other.
Here, as illustrated in
The first back surface of the P terminal 310 of the first conductor 31 and the second back surface 320b of the N terminal 320 of the second conductor 32 abut against the bottom surface 71b of the first groove portion 71.
The thread portions 411 of the bolts 41 and the nuts 42 of the main-terminal-side fastening portions 40 abut against an inner surface of the first accommodation groove 71g.
A second accommodation groove 72g that can accommodate the thread portion 411 of the bolt 41 and the nut 42 of the output-side fastening portion 60 is formed at a bottom surface 72b of the second groove portion 72.
The output terminal portion 50 abuts against the bottom surface 72b of the second groove portion 72.
Further, the thread portion 411 of the bolt 41 and the nut 42 of the output-side fastening portion 60 abut against an inner surface of the second accommodation groove 72g.
The first insulating portion 80 is an insulating member disposed in the potting space Rp, in the first accommodation space R1, and in the second accommodation space R2.
The potting space Rp, the first accommodation space R1, and the second accommodation space R2 are filled with a liquid potting material from the outside (potting) to enclose members exposed in the respective spaces (potting space Rp, first accommodation space R1, second accommodation space R2).
The potting material with which each space is filled is cured over a predetermined time, and electrically insulates each member from the other members in the spaces and each member from the space outside the power module 400.
As the potting material in the present embodiment, a silicone gel or an epoxy resin, for example, can be used.
Note that a synthetic resin other than a silicone gel and an epoxy resin may be adopted as the potting material.
Accordingly, the first insulating portion 80 is formed of this potting material.
The first insulating portion 80 in the potting space Rp is disposed covering front surfaces of the circuit board 20, the bonding wire Wb, the first connection portion 311 of the main terminal portion 30, and the output terminal portion 50.
Accordingly, the first insulating portion 80 in the potting space Rp is disposed so that the gap G2 between the first connection portion 311 of the first conductor 31 and the second connection portion 321 of the second conductor 32 is filled therewith.
The first insulating portion 80 in the first accommodation space R1 covers, from the side opposite to the base plate 10, the first main surface 310a of the P terminal 310, the second main surface 320a of the N terminal 320, the positive-electrode-side terminal 3p and the negative-electrode-side terminal 3n of the connection conductor 3b, and the bolts 41 of the main-terminal-side fastening portions 40, in a state of the gap G2 between the P terminal 310 and the N terminal 320 being filled therewith.
The first insulating portion 80 in the second accommodation space R2 covers, from the side opposite to the base plate 10, the output terminal portion 50 and the bolt 41 of the output-side fastening portion 60.
Here, the first insulating portion formed by each space being filled with the potting material and curing the potting material includes top surfaces 81, 82, 83 that are liquid surfaces when filled.
The top surface 81 of the first insulating portion 80 disposed in the first space and the top surface 82 of the first insulating portion 80 disposed in the second space are positioned farther from the front surface 10a of the base plate 10 than the top surface 83 of the first insulating portion 80 disposed in the potting space Rp.
According to the configuration described above, the first insulating portion 80 is disposed such that the gap G2 (clearance distance) in the main terminal portion 30 is filled therewith.
This makes it possible to suppress the discharge that occurs between the P terminal 310 and the N terminal 320 and the discharge that occurs between the N terminal 320 and the P terminal 310 as compared with a case in which the insulating material is not disposed between the P terminal 310 and the N terminal 320.
That is, the first insulating portion 80 is interposed between the P terminal 310 and the N terminal 320, making it possible to suppress dielectric breakdown between the P terminal 310 and the N terminal 320.
Accordingly, the gap G2 between the P terminal 310 and the N terminal 320 can be narrowed and, as a result, an increase in the size of the power module 400 can be suppressed.
Further, the first insulating portion 80 covers the first main surface 310a, the second main surface 320a, and the pair of main-terminal-side fastening portions 40 from the side opposite to the base plate 10, making it possible to suppress dielectric breakdown between the first main surface 310a and the second main surface 320a.
Further, when a current flows through the P terminal 310, the N terminal 320 is affected by a magnetic flux generated from the P terminal 310.
At this time, an induced current (eddy current) corresponding to a magnitude of a magnetic flux flows through the N terminal 320.
Similarly, when a current flows through the N terminal 320, the P terminal 310 is affected by a magnetic flux generated from the N terminal 320, and an induced current flows through the P terminal 310 as well.
These induced currents generate, from the P terminal 310 and the N terminal 320, respectively, magnetic fluxes that cancel out the magnetic fluxes generated in the P terminal 310 and the N terminal 320.
That is, by narrowing the spatial distance between the P terminal 310 and the N terminal 320, it is possible to effectively cancel out the magnetic fluxes.
Accordingly, a parasitic inductance generated in the main terminal portion 30 can be reduced.
Further, when a large current flows through the main terminal portion 30, the first conductor 31 and the second conductor 32 may generate heat and thermally expand in the extending direction of the front surface 10a of the base plate 10, for example.
According to the configuration described above, since the first insulating portion 80 is interposed between the P terminal 310 and the N terminal 320, even if the gap G2 narrows with the thermal expansion of the P terminal 310 and the N terminal 320, dielectric breakdown does not occur between the P terminal 310 and the N terminal 320.
Next, a second embodiment of the power conversion device according to the present disclosure will be described with reference to
Note that, in the second embodiment described below, the same components as those in the first embodiment described above are denoted by the same reference signs in the drawings, and description thereof will be omitted.
In the second embodiment, the configurations of the case of the power module and the first insulating portion differ from the configurations described in the first embodiment.
A case 70a is a member that mechanically reinforces the main terminal portion 30 and the output terminal portion 50 in a state of being fixed to the front surface 10a of the base plate 10.
The case 70a is formed with a first groove portion 71a defining a first accommodation space R1a (accommodation space) that accommodates the P terminal 310 of the first conductor 31, the N terminal 320 of the second conductor 32, and the pair of main-terminal-side fastening portions 40 therein, and the second groove portion 72 defining the second accommodation space R2 that accommodates the output terminal portion 50 and the output-side fastening portion 60 therein.
The first accommodation space R1a in the present embodiment is partitioned into a main-surface-side space S1 and a back-surface-side space S2 with the P terminal 310 and the N terminal 320 of the main terminal portion 30 as a boundary.
The main-surface-side space S1 and the back-surface-side space S2 communicate with each other through the gap G2 between the P terminal 310 and the N terminal 320 and an area between the P terminal 310 and the N terminal 320 and an inner surface of the first groove portion 71a.
Accordingly, when the first accommodation space R1a is filled with the potting material, the potting material spreads to the back-surface-side space S2 through the locations described above where the main-surface-side space S1 and the back-surface-side space S2 are in communication with each other.
The thread portions 411 of the bolts 41 and the nuts 42 of the main-terminal-side fastening portions 40 are disposed in the back-surface-side space S2.
In the present embodiment, the first back surface of the P terminal 310, the second back surface 320b of the N terminal 320, the thread portions 411 of the bolts 41, and the nuts 42 do not abut against the inner surface of the first groove portion 71a.
A first insulating portion 80a is an insulating member disposed in the potting space Rp, the first accommodation space R1a, and the second accommodation space R2.
The first insulating portion 80a in the first accommodation space R1a covers, from the outer side, the first main surface 310a and the first back surface of the P terminal 310, the second main surface 320a and the second back surface 320b of the N terminal 320, the positive-electrode-side terminal 3p and the negative-electrode-side terminal 3n of the connection conductor 3b, and the bolts 41 and the nuts 42 of the main-terminal-side fastening portions 40, in a state of the gap G2 between the first conductor 31 and the second conductor 32 being filled therewith.
According to the configuration described above, the first insulating portion 80a covers the first back surface of the P terminal 310, the second back surface 320b of the N terminal 320, and the pair of main-terminal-side fastening portions 40 from the base plate 10 side as well, thereby insulating the P terminal 310 and the N terminal 320 from each other in the first accommodation space R1a.
That is, the P terminal 310 and the N terminal 320 are solid-insulated by the first insulating portion 80a.
Accordingly, as compared with the configuration described in the first embodiment, it is possible to further suppress conduction between the P terminal 310 and the N terminal 320.
That is, it is possible to further narrow the gap G2 between the P terminal 310 and the N terminal 320.
Next, a third embodiment of the power conversion device according to the present disclosure will be described with reference to
Note that, in the third embodiment described below, the same components as those in the first embodiment and the second embodiment described above are denoted by the same reference signs in the drawings, and description thereof will be omitted.
In the third embodiment, the power conversion device further includes a second insulating portion.
A second insulating portion 7 is an insulating member formed integrally with the positive-electrode-side terminal 3p and the negative-electrode-side terminal 3n so as to extend integrally with the first insulating portion 80a from the first insulating portion 80a toward the main body portion 3a of the capacitor 3.
The second insulating portion 7 covers the positive-electrode-side terminal 3p and the negative-electrode-side terminal 3n from the outer side in a state of the gap G1 between the positive-electrode-side terminal 3p and the negative-electrode-side terminal 3n being filled therewith.
The second insulating portion 7 in the present embodiment is formed of a synthetic resin material different from that of the first insulating portion 80a.
According to the configuration described above, the positive-electrode-side terminal 3p and the negative-electrode-side terminal 3n of the capacitor 3 are insulated from each other.
That is, the positive-electrode-side terminal 3p and the negative-electrode-side terminal 3n are solid-insulated by the second insulating portion 7.
That is, it is possible to suppress dielectric breakdown between the positive-electrode-side terminal 3p and the negative-electrode-side terminal 3n.
Accordingly, the gap G1 between the positive-electrode-side terminal 3p and the negative-electrode-side terminal 3n can be narrowed and, as a result, an increase in the size of the power conversion device 100 can be suppressed.
Although embodiments of the present disclosure have been described in detail with reference to the drawings, specific configurations are not limited to the configurations of the embodiments, and additions, omissions, substitutions, and other modifications of the configurations can be made without departing from the gist of the present disclosure.
Note that, in the embodiments described above, the inverter is described as an example of the power conversion device 100. However, the power conversion device 100 is not limited to the inverter.
The power conversion device 100 may be, for example, a device that performs power conversion by the power semiconductor element 23, such as a converter or a combination of an inverter and a converter.
In a case in which the power conversion device 100 is a converter, a configuration may be adopted in which an AC voltage is input from an external input power supply (not illustrated) to the external output conductor 5, the power semiconductor element 23 of the circuit board 20 converts the AC voltage into a DC voltage, and the DC voltage from the power semiconductor element 23 is output to outside the power conversion device through the main terminal portion 30 and the connection conductor 3b.
Further, the configuration of the third embodiment described with reference to
That is, the power conversion device 100 described in the first embodiment may further include the second insulating portion 7 described in the third embodiment.
The power module and the power conversion device described in each embodiment are understood as follows, for example.
(1) A power module 400 according to a first aspect includes a main terminal portion 30 including a first conductor 31 including a P terminal 310 at one end of the first conductor 31, the P terminal 310 including a first main surface 310a and a first back surface facing a side opposite to the first main surface 310a, and a second conductor 32 including an N terminal 320 at one end of the second conductor 32, the N terminal 320 including a second main surface 320a facing a direction identical to a direction in which the first main surface 310a faces and a second back surface 320b facing a side opposite to the second main surface 320a, the second conductor 32 being connected to a capacitor 3 together with the first conductor 31 and being arranged side by side with the first conductor 31 with a gap G2 interposed between the second conductor 32 and the first conductor 31; a circuit board 20 including a power semiconductor element 23 configured to convert a DC voltage from the main terminal portion 30 into an AC voltage; an output terminal portion 50 configured to output an AC voltage from the power semiconductor element 23; a pair of fastening portions (main-terminal-side fastening portions 40) connecting the P terminal 310 and a positive-electrode-side terminal 3p of the capacitor 3 to each other and connecting the N terminal 320 and a negative-electrode-side terminal 3n of the capacitor 3 to each other; a base plate 10 to which the circuit board 20 is fixed, the base plate 10 including a front surface 10a facing the first back surface and the second back surface 320b; a case 70, 70a fixed to the front surface 10a of the base plate 10 and including an accommodation space (first accommodation space R1, R1a) accommodating the P terminal 310, the N terminal 320, and the pair of fastening portions; and a first insulating portion 80, 80a disposed in the accommodation space and covering the first main surface 310a, the second main surface 320a, and the pair of fastening portions from a side opposite to the base plate 10, in a state of the gap G2 being filled with the first insulating portion 80, 80a.
This makes it possible to suppress the discharge that occurs between the P terminal 310 and the N terminal 320 as comparison with a case in which the insulating material is not disposed between the P terminal 310 and the N terminal 320.
That is, the first insulating portion 80, 80a is interposed between the P terminal 310 and the N terminal 320, making it possible to suppress dielectric breakdown between the P terminal 310 and the N terminal 320.
Accordingly, it is possible to narrow the gap G2 between the P terminal 310 and the N terminal 320.
(2) The power module 400 according to a second aspect may be the power module 400 according to the first aspect, wherein the first insulating portion 80a further covers the first back surface, the second back surface 320b, and the pair of fastening portions from the base plate 10 side.
Accordingly, the P terminal 310 and the N terminal 320 are insulated from each other in the accommodation space (first accommodation space R1, R1a).
That is, the P terminal 310 and the N terminal 320 are solid-insulated by the first insulating portion 80a.
Accordingly, it is possible to further suppress conduction between the P terminal 310 and the N terminal 320.
(3) A power conversion device 100 according to a third aspect includes the power module 400 according to the first aspect or the second aspect, the capacitor 3, and a second insulating portion 7 formed integrally with the positive-electrode-side terminal 3p and the negative-electrode-side terminal 3n so as to extend from the first insulating portion 80a, and covering the positive-electrode-side terminal 3p and the negative-electrode-side terminal 3n from an outer side.
This makes it possible to suppress conduction between the positive-electrode-side terminal 3p and the negative-electrode-side terminal 3n.
Accordingly, it is possible to narrow the gap between the positive-electrode-side terminal 3p connected to the P terminal 310 and the negative-electrode-side terminal 3n connected to the N terminal 320.
According to the present disclosure, it is possible to provide a power module and a power conversion device in which an increase in size can be suppressed.
| Number | Date | Country | Kind |
|---|---|---|---|
| 2022-075437 | Apr 2022 | JP | national |
| Filing Document | Filing Date | Country | Kind |
|---|---|---|---|
| PCT/JP2023/004097 | 2/8/2023 | WO |
