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ELECTRICITY
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Electric elements
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SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
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H01L23/49838
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Patents Grants
last 30 patents
Information
Patent Grant
Package substrate insulation opening design
Patent number
12,368,092
Issue date
Jul 22, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Shu-Jung Tseng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods and apparatus for using spacer-on-spacer design for solder...
Patent number
12,368,113
Issue date
Jul 22, 2025
Micron Technology, Inc.
Faxing Che
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated millimeter-wave dual-mode matching network
Patent number
12,368,118
Issue date
Jul 22, 2025
NXP B.V.
Harish Nandagopal
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package
Patent number
12,368,122
Issue date
Jul 22, 2025
Samsung Electronics Co., Ltd.
Jinhee Hong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package substrate with glass core having vertical power planes for...
Patent number
12,368,091
Issue date
Jul 22, 2025
Intel Corporation
Aleksandar Aleksov
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic component and manufacturing method thereof
Patent number
12,368,112
Issue date
Jul 22, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Chi-Yang Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor packages
Patent number
12,368,093
Issue date
Jul 22, 2025
Samsung Electronics Co., Ltd.
Ju-Il Choi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor chip package having underfill material surrounding a...
Patent number
12,368,127
Issue date
Jul 22, 2025
Taiwan Semiconductor Manufacturing Company Limited
Po-Chen Lai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Double side integration semiconductor package and method of forming...
Patent number
12,368,142
Issue date
Jul 22, 2025
Taiwan Semiconductor Manufacturing Company Limited
Monsen Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing semiconductor device including passivation...
Patent number
12,368,090
Issue date
Jul 22, 2025
Taiwan Semiconductor Manufacturing Company Ltd.
Jing-Cheng Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interposer structure for semiconductor package including peripheral...
Patent number
12,368,109
Issue date
Jul 22, 2025
Taiwan Semiconductor Manufacturing Company Limited
Hsien-Wei Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor die package with ring structure
Patent number
12,362,197
Issue date
Jul 15, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Yu-Sheng Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for manufacturing semiconductor device, semiconductor device...
Patent number
12,362,248
Issue date
Jul 15, 2025
Goki Toshima
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package assembly including package substrate with elongated solder...
Patent number
12,362,268
Issue date
Jul 15, 2025
Taiwan Semiconductor Manufacturing Company Limited
Chin-Hua Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure and method of fabricating the same
Patent number
12,362,270
Issue date
Jul 15, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Kris Lipu Chuang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Basin-shaped underbump plates and methods of forming the same
Patent number
12,362,299
Issue date
Jul 15, 2025
Taiwan Semiconductor Manufacturing Company Limited
Yen-Hao Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for fabricating a chip package
Patent number
12,362,178
Issue date
Jul 15, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Jie Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Apparatus including direct-contact heat paths and methods of manufa...
Patent number
12,362,255
Issue date
Jul 15, 2025
Micron Technology, Inc.
Kelvin Tan Aik Boo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method of fabricating the same
Patent number
12,362,328
Issue date
Jul 15, 2025
Samsung Electronics Co., Ltd.
Jaekyung Yoo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device
Patent number
12,362,339
Issue date
Jul 15, 2025
Kabushiki Kaisha Toshiba
Kenichi Agawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interposer including stepped surfaces and methods of forming the same
Patent number
12,362,246
Issue date
Jul 15, 2025
Taiwan Semiconductor Manufacturing Company Limited
Yu-Sheng Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Protruding SN substrate features for epoxy flow control
Patent number
12,362,250
Issue date
Jul 15, 2025
Intel Corporation
Edvin Cetegen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit (IC) packages employing supplemental metal layer...
Patent number
12,362,269
Issue date
Jul 15, 2025
QUALCOMM Incorporated
Michelle Yejin Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with a nickel comprising layer and method for...
Patent number
12,354,936
Issue date
Jul 8, 2025
Infineon Technologies AG
Oliver Schilling
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and production method thereof
Patent number
12,354,937
Issue date
Jul 8, 2025
Denso Corporation
Takao Kasai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip package structure and storage system
Patent number
12,354,941
Issue date
Jul 8, 2025
CHANGXIN MEMORY TECHNOLOGIES, INC.
Shu-Liang Ning
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure and manufacturing method thereof
Patent number
12,354,929
Issue date
Jul 8, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Kai-Fung Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and methods of manufacturing
Patent number
12,354,938
Issue date
Jul 8, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Hsien-Wei Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Coupled loop and void structure integrated in a redistribution laye...
Patent number
12,354,978
Issue date
Jul 8, 2025
Xilinx, Inc.
Po-Wei Chiu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-role semiconductor device substrates, semiconductor device as...
Patent number
12,354,939
Issue date
Jul 8, 2025
Micron Technology, Inc.
Hong Wan Ng
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
PACKAGE SUBSTRATE WITH EMBEDDED CAPACITOR PACKAGE HAVING REDISTRIBU...
Publication number
20250239518
Publication date
Jul 24, 2025
QUALCOMM Incorporated
Aniket Patil
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGES WITH REINFORCEMENT STRUCTURES
Publication number
20250239514
Publication date
Jul 24, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Cong-Wei Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Publication number
20250239516
Publication date
Jul 24, 2025
Mitsubishi Electric Corporation
Kana ISERI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDED DEVICE STRUCTURES WITH IMPROVED STRESS DISTRIBUTION AND REDU...
Publication number
20250239548
Publication date
Jul 24, 2025
Taiwan Semiconductor Manufacturing Company Limited
Yung Lin Tan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED DEVICE SUBSTRATE INCLUDING EMBEDDED ELECTROMAGNETIC ISOL...
Publication number
20250239513
Publication date
Jul 24, 2025
QUALCOMM Incorporated
Yue LI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT (IC) PACKAGE WITH EMBEDDED POWER MANAGEMENT INTE...
Publication number
20250239522
Publication date
Jul 24, 2025
QUALCOMM Incorporated
Xia LI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE
Publication number
20250239512
Publication date
Jul 24, 2025
Advanced Semiconductor Engineering, Inc.
Che-Neng LIU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FORMING THE SAME
Publication number
20250239517
Publication date
Jul 24, 2025
MEDIATEK INC.
Yi-Chieh LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTERPOSER SUBSTRATE WITH INTEGRATED STEP DIE CAVITY, AND RELATED I...
Publication number
20250239508
Publication date
Jul 24, 2025
QUALCOMM Incorporated
Seongryul Choi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR ASSEMBLY FOR PROVIDING AN ENHANCED MEMORY BANDWIDTH A...
Publication number
20250239509
Publication date
Jul 24, 2025
Taiwan Semiconductor Manufacturing Company Limited
Han-Jong Chia
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20250239515
Publication date
Jul 24, 2025
Samsung Electronics Co., Ltd.
Dohyuk YOO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC ELEMENT MOUNTING SUBSTRATE, ELECTRONIC DEVICE, ELECTRONI...
Publication number
20250233059
Publication date
Jul 17, 2025
Kyocera Corporation
Akihiko FUNAHASHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Interposer
Publication number
20250233062
Publication date
Jul 17, 2025
TE Connecitivity Japan G. K.
Shinichi Hashimoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE WITH CAPPING LAYER AND MANUFACTURING METHOD...
Publication number
20250233034
Publication date
Jul 17, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Hung-Pin Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
Publication number
20250233063
Publication date
Jul 17, 2025
Taiwan Semiconductor Manufacturing company Ltd.
CHUN-HAO LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE COMPONENT AND METHOD FOR FORMING THE SAME
Publication number
20250233082
Publication date
Jul 17, 2025
Taiwan Semiconductor Manufacturing company Ltd.
LIANG-SHIUAN PENG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SYSTEMS AND METHODS FOR EMBEDDING ELECTRONIC COMPONENTS IN SUBSTRATES
Publication number
20250233087
Publication date
Jul 17, 2025
ADVANCED MICRO DEVICES, INC.
Arsalan Alam
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGING STRUCTURE AND PREPARING METHOD THEREOF
Publication number
20250233033
Publication date
Jul 17, 2025
TRIPLE WIN TECHNOLOGY (SHENZHEN) CO.LTD.
HUNG-TA LI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MEMORY DEVICE WITH ENHANCED THERMAL CONDUCTIVITY
Publication number
20250233044
Publication date
Jul 17, 2025
Micron Technology, Inc.
Eiichi Nakano
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE HAVING A SOLDER STOP FEATURE
Publication number
20250233092
Publication date
Jul 17, 2025
INFINEON TECHNOLOGIES AG
Ivan Nikitin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME
Publication number
20250233058
Publication date
Jul 17, 2025
RICHTEK TECHNOLOGY CORPORATION
Shih-Chieh Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Interposer
Publication number
20250233061
Publication date
Jul 17, 2025
TE Connectivity Japan G.K.
Shinichi Hashimoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ANTENNA PACKAGE USING BALL ATTACH ARRAY TO CONNECT ANTENNA AND BASE...
Publication number
20250226583
Publication date
Jul 10, 2025
Intel Corporation
Jimin Yao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THERMAL MISMATCH REDUCTION IN SEMICONDUCTOR DEVICE MODULES
Publication number
20250226284
Publication date
Jul 10, 2025
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Seungwon IM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HYBRID SUBSTRATE WITH EMBEDDED COMPONENT
Publication number
20250226302
Publication date
Jul 10, 2025
QUALCOMM Incorporated
Yeoil PARK
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FAN-OUT WAFER LEVEL PACKAGING OF SEMICONDUCTOR DEVICES
Publication number
20250226264
Publication date
Jul 10, 2025
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
George CHANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE
Publication number
20250226300
Publication date
Jul 10, 2025
Innolux Corporation
Po-Yun Hsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE
Publication number
20250226306
Publication date
Jul 10, 2025
Innolux Corporation
Chia-Ping Tseng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
Publication number
20250226349
Publication date
Jul 10, 2025
Samsung Electronics Co., Ltd.
Minseok Jang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FLEXIBLE CIRCUIT BOARD, COF MODULE, AND ELECTRONIC DEVICE COMPRISIN...
Publication number
20250226303
Publication date
Jul 10, 2025
LG Innotek Co., Ltd.
Ki Tae PARK
H01 - BASIC ELECTRIC ELEMENTS