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H01L23/49838

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

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H01L23/49838Geometry or layout

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Signal routing in integrated circuit packaging
- Patent number 12,255,129
- Issue date Mar 18, 2025
- Google LLC
- Jin Young Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Components for millimeter-wave communication
- Patent number 12,255,158
- Issue date Mar 18, 2025
- Intel Corporation
- Neelam Prabhu Gaunkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Secure semiconductor integration and method for making thereof
- Patent number 12,255,189
- Issue date Mar 18, 2025
- BroadPak Corporation
- Farhang Yazdani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon spacers with improved adhesion and semiconductor device ass...
- Patent number 12,255,128
- Issue date Mar 18, 2025
- Micron Technology, Inc.
- Aibin Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and carrier thereof and method for manufacturing...
- Patent number 12,255,165
- Issue date Mar 18, 2025
- Siliconware Precision Industries Co., Ltd.
- Chi-Ren Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of forming the same
- Patent number 12,255,184
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including heat dissipation layer
- Patent number 12,255,183
- Issue date Mar 18, 2025
- SK hynix Inc.
- Joo Wan Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package including a thermal conductive layer a...
- Patent number 12,249,555
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Chin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pre-mold substrate and method of manufacturing pre-mold substrate
- Patent number 12,249,571
- Issue date Mar 11, 2025
- HAESUNG DS CO., LTD.
- Kwang Jae Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package
- Patent number 12,249,585
- Issue date Mar 11, 2025
- Advanced Semiconductor Engineering, Inc.
- Wen Hung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated structure with bifunctional routing and assembly compris...
- Patent number 12,249,572
- Issue date Mar 11, 2025
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Candice Thomas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure, RDL structure comprising redistribution layer ha...
- Patent number 12,249,564
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien-Hsun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including penetration via structure
- Patent number 12,249,558
- Issue date Mar 11, 2025
- Samsung Electronics Co., Ltd.
- Jubin Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metallization structure
- Patent number 12,249,568
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with uneven electrode surface and method for f...
- Patent number 12,249,569
- Issue date Mar 11, 2025
- NANYA TECHNOLOGY CORPORATION
- Tsu-Chieh Ai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with electromagnetic interference film and met...
- Patent number 12,243,833
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Hsi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device with submount includi...
- Patent number 12,243,796
- Issue date Mar 4, 2025
- Nichia Corporation
- Tadaaki Miyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D stack of split graphics processing logic dies
- Patent number 12,243,797
- Issue date Mar 4, 2025
- Kepler Computing Inc.
- Amrita Mathuriya
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Connection structure and method of forming the same
- Patent number 12,243,813
- Issue date Mar 4, 2025
- Samsung Electronics Co., Ltd.
- Jongyoun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System in a package modifications
- Patent number 12,243,794
- Issue date Mar 4, 2025
- OCTAVO SYSTEMS LLC
- Michael Kenneth Conti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Waferscale physiological characteristic sensor package with integra...
- Patent number 12,232,842
- Issue date Feb 25, 2025
- Medtronic MiniMed, Inc.
- Daniel Hahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,237,252
- Issue date Feb 25, 2025
- Samsung Electronics Co., Ltd.
- Yoonyoung Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and method of manufacturing the same
- Patent number 12,237,272
- Issue date Feb 25, 2025
- Advanced Semiconductor Engineering, Inc.
- Hui-Ping Jian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of forming the same
- Patent number 12,237,320
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deep trench capacitors embedded in package substrate
- Patent number 12,238,940
- Issue date Feb 25, 2025
- Google LLC
- Nam Hoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,237,241
- Issue date Feb 25, 2025
- Samsung Electronics Co., Ltd.
- Yanggyoo Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,237,256
- Issue date Feb 25, 2025
- Samsung Electronics Co, Ltd.
- Kyoung Lim Suk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical interconnects with variable pitch for scalable escape routing
- Patent number 12,237,255
- Issue date Feb 25, 2025
- RAMBUS INC.
- Mark D. Kellam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including connection pad including groove pat...
- Patent number 12,237,251
- Issue date Feb 25, 2025
- SK hynix Inc.
- Si Yun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for fabricating the same
- Patent number 12,237,253
- Issue date Feb 25, 2025
- Samsung Electronics Co., Ltd.
- Jun Hyeong Park
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250096215
- Publication date Mar 20, 2025
- Samsung Electronics Co., Ltd.
- HYUNSOO CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING A SUBSTRATE WITH VIA INTERCONNECT WITH VERTICAL...
- Publication number 20250096091
- Publication date Mar 20, 2025
- QUALCOMM Incorporated
- Chiao-Yi TAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED VIA STRUCTURE DISPOSED ON A CONDUCTIVE PILLAR OF A SEMICOND...
- Publication number 20250096092
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Che-Yu Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Package Molded Vertical Interconnection
- Publication number 20250096096
- Publication date Mar 20, 2025
- Apple Inc.
- Kumar Nagarajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250096099
- Publication date Mar 20, 2025
- Samsung Electronics Co., Ltd.
- JAESUN KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip with Top Metal Pad Pitch Adjustment
- Publication number 20250096100
- Publication date Mar 20, 2025
- Tenstorrent Inc.
- Aydin Nabovati
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-SUBSTRATE COMPOSITE SEMICONDUCTOR DEVICE
- Publication number 20250096101
- Publication date Mar 20, 2025
- INFINEON TECHNOLOGIES AG
- Carsten Joachim von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STORAGE DEVICE AND METHOD OF HEATING SEMICONDUCTOR ST...
- Publication number 20250096102
- Publication date Mar 20, 2025
- KIOXIA Corporation
- Kazuma HASEGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package Substrates with Stiffener Interposers
- Publication number 20250096154
- Publication date Mar 20, 2025
- Intel Corporation
- Chin Mian CHOONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250096175
- Publication date Mar 20, 2025
- Samsung Electronics Co., Ltd.
- YISEUL HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC PACKAGE HIGH BANDWIDTH RF FEEDTHROUGH
- Publication number 20250096448
- Publication date Mar 20, 2025
- Infinera Corporation
- Jiaming Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IO INTERCONNECT CAGE STRUCTURE FOR PACKAGE FORM REDUCTION
- Publication number 20250096094
- Publication date Mar 20, 2025
- QUALCOMM Incorporated
- Aniket PATIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Methods of Making and Using Dummy Vias to...
- Publication number 20250096095
- Publication date Mar 20, 2025
- STATS ChipPAC Pte Ltd.
- Peik Eng Ooi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE AND FABRICATING METHOD THEREOF
- Publication number 20250096105
- Publication date Mar 20, 2025
- AaltoSemi Inc.
- Min-Yao CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREFOR
- Publication number 20250096162
- Publication date Mar 20, 2025
- CXMT Corporation
- You FU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE COMPRISING SILICON SUBSTRATE WITH POROUS PORTION
- Publication number 20250096090
- Publication date Mar 20, 2025
- QUALCOMM Incorporated
- Ranadeep DUTTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250096103
- Publication date Mar 20, 2025
- Samsung Electronics Co., Ltd.
- Sunjun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND SEMICONDUCTOR STRUCTURE
- Publication number 20250096106
- Publication date Mar 20, 2025
- CXMT Corporation
- Hengrong SHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF
- Publication number 20250096107
- Publication date Mar 20, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Michael Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20250096044
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Chung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND ELECTRONIC DEVICE
- Publication number 20250096087
- Publication date Mar 20, 2025
- Sony Semiconductor Solutions Corporation
- Hirohisa YASUKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR SUBSTRATE
- Publication number 20250098348
- Publication date Mar 20, 2025
- LG Innotek Co., Ltd.
- Jung Shik BAIK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING A SUBSTRATE WITH CAVITY, AND AN INTEGRATED DEVIC...
- Publication number 20250096051
- Publication date Mar 20, 2025
- QUALCOMM Incorporated
- Jaehyun YEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250096088
- Publication date Mar 20, 2025
- Samsung Electronics Co., Ltd.
- Aenee Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING SAME
- Publication number 20250096097
- Publication date Mar 20, 2025
- Hana Micron Inc.
- Jae-Sung LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE AND FABRICATING METHOD THEREOF
- Publication number 20250096104
- Publication date Mar 20, 2025
- AaltoSemi Inc.
- Min-Yao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CANTILEVERED POWER PLANES TO PROVIDE A RETURN CURRENT PATH FOR HIGH...
- Publication number 20250096108
- Publication date Mar 20, 2025
- Avago Technologies International Sales Pte. Limited
- Arun Ramakrishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE WITH STACKED STRUCTURE
- Publication number 20250096210
- Publication date Mar 20, 2025
- Monolithic Power Systems, Inc.
- Ting Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDE-COOLING POWER MODULE
- Publication number 20250096209
- Publication date Mar 20, 2025
- Monolithic Power Systems, Inc.
- Ting Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICES COUPLED TO INTERPOSER COMPRISING POROUS PORTION
- Publication number 20250096093
- Publication date Mar 20, 2025
- QUALCOMM Incorporated
- Ranadeep DUTTA
- H01 - BASIC ELECTRIC ELEMENTS

Geometry or layout

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Signal routing in integrated circuit packaging

Components for millimeter-wave communication

Secure semiconductor integration and method for making thereof

Silicon spacers with improved adhesion and semiconductor device ass...

Electronic package and carrier thereof and method for manufacturing...

Semiconductor packages and methods of forming the same

Semiconductor package including heat dissipation layer

Semiconductor device package including a thermal conductive layer a...

Pre-mold substrate and method of manufacturing pre-mold substrate

Semiconductor device package

Integrated structure with bifunctional routing and assembly compris...

Package structure, RDL structure comprising redistribution layer ha...

Semiconductor device including penetration via structure

Metallization structure

Semiconductor device with uneven electrode surface and method for f...

Semiconductor device with electromagnetic interference film and met...

Method for manufacturing semiconductor device with submount includi...

3D stack of split graphics processing logic dies

Connection structure and method of forming the same

System in a package modifications

Waferscale physiological characteristic sensor package with integra...

Semiconductor package

Electronic device and method of manufacturing the same

Package structure and method of forming the same

Deep trench capacitors embedded in package substrate

Semiconductor package

Semiconductor package

Vertical interconnects with variable pitch for scalable escape routing

Semiconductor package including connection pad including groove pat...

Semiconductor package and method for fabricating the same

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

PACKAGE COMPRISING A SUBSTRATE WITH VIA INTERCONNECT WITH VERTICAL...

STACKED VIA STRUCTURE DISPOSED ON A CONDUCTIVE PILLAR OF A SEMICOND...

Electronic Package Molded Vertical Interconnection

SEMICONDUCTOR PACKAGE

Chip with Top Metal Pad Pitch Adjustment

CHIP-SUBSTRATE COMPOSITE SEMICONDUCTOR DEVICE

SEMICONDUCTOR STORAGE DEVICE AND METHOD OF HEATING SEMICONDUCTOR ST...

Package Substrates with Stiffener Interposers

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

CERAMIC PACKAGE HIGH BANDWIDTH RF FEEDTHROUGH

IO INTERCONNECT CAGE STRUCTURE FOR PACKAGE FORM REDUCTION

Semiconductor Device and Methods of Making and Using Dummy Vias to...

PACKAGE SUBSTRATE AND FABRICATING METHOD THEREOF

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREFOR

INTEGRATED DEVICE COMPRISING SILICON SUBSTRATE WITH POROUS PORTION

SEMICONDUCTOR DEVICE

PACKAGE STRUCTURE AND SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR PACKAGE AND ELECTRONIC DEVICE

IMAGE SENSOR SUBSTRATE

PACKAGE COMPRISING A SUBSTRATE WITH CAVITY, AND AN INTEGRATED DEVIC...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING SAME

PACKAGE SUBSTRATE AND FABRICATING METHOD THEREOF

CANTILEVERED POWER PLANES TO PROVIDE A RETURN CURRENT PATH FOR HIGH...

POWER MODULE WITH STACKED STRUCTURE

DOUBLE-SIDE-COOLING POWER MODULE

INTEGRATED DEVICES COUPLED TO INTERPOSER COMPRISING POROUS PORTION