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H01L23/49838

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

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H01L23/49838Geometry or layout

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Signal routing in integrated circuit packaging
- Patent number 12,255,129
- Issue date Mar 18, 2025
- Google LLC
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Components for millimeter-wave communication
- Patent number 12,255,158
- Issue date Mar 18, 2025
- Intel Corporation
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Secure semiconductor integration and method for making thereof
- Patent number 12,255,189
- Issue date Mar 18, 2025
- BroadPak Corporation
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and carrier thereof and method for manufacturing...
- Patent number 12,255,165
- Issue date Mar 18, 2025
- Siliconware Precision Industries Co., Ltd.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of forming the same
- Patent number 12,255,184
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon spacers with improved adhesion and semiconductor device ass...
- Patent number 12,255,128
- Issue date Mar 18, 2025
- Micron Technology, Inc.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including heat dissipation layer
- Patent number 12,255,183
- Issue date Mar 18, 2025
- SK hynix Inc.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package including a thermal conductive layer a...
- Patent number 12,249,555
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Chin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pre-mold substrate and method of manufacturing pre-mold substrate
- Patent number 12,249,571
- Issue date Mar 11, 2025
- HAESUNG DS CO., LTD.
- Kwang Jae Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package
- Patent number 12,249,585
- Issue date Mar 11, 2025
- Advanced Semiconductor Engineering, Inc.
- Wen Hung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated structure with bifunctional routing and assembly compris...
- Patent number 12,249,572
- Issue date Mar 11, 2025
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Candice Thomas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure, RDL structure comprising redistribution layer ha...
- Patent number 12,249,564
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien-Hsun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including penetration via structure
- Patent number 12,249,558
- Issue date Mar 11, 2025
- Samsung Electronics Co., Ltd.
- Jubin Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metallization structure
- Patent number 12,249,568
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with uneven electrode surface and method for f...
- Patent number 12,249,569
- Issue date Mar 11, 2025
- NANYA TECHNOLOGY CORPORATION
- Tsu-Chieh Ai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with electromagnetic interference film and met...
- Patent number 12,243,833
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Hsi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device with submount includi...
- Patent number 12,243,796
- Issue date Mar 4, 2025
- Nichia Corporation
- Tadaaki Miyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D stack of split graphics processing logic dies
- Patent number 12,243,797
- Issue date Mar 4, 2025
- Kepler Computing Inc.
- Amrita Mathuriya
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Connection structure and method of forming the same
- Patent number 12,243,813
- Issue date Mar 4, 2025
- Samsung Electronics Co., Ltd.
- Jongyoun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System in a package modifications
- Patent number 12,243,794
- Issue date Mar 4, 2025
- OCTAVO SYSTEMS LLC
- Michael Kenneth Conti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Waferscale physiological characteristic sensor package with integra...
- Patent number 12,232,842
- Issue date Feb 25, 2025
- Medtronic MiniMed, Inc.
- Daniel Hahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,237,252
- Issue date Feb 25, 2025
- Samsung Electronics Co., Ltd.
- Yoonyoung Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and method of manufacturing the same
- Patent number 12,237,272
- Issue date Feb 25, 2025
- Advanced Semiconductor Engineering, Inc.
- Hui-Ping Jian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of forming the same
- Patent number 12,237,320
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deep trench capacitors embedded in package substrate
- Patent number 12,238,940
- Issue date Feb 25, 2025
- Google LLC
- Nam Hoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,237,241
- Issue date Feb 25, 2025
- Samsung Electronics Co., Ltd.
- Yanggyoo Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,237,256
- Issue date Feb 25, 2025
- Samsung Electronics Co, Ltd.
- Kyoung Lim Suk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical interconnects with variable pitch for scalable escape routing
- Patent number 12,237,255
- Issue date Feb 25, 2025
- RAMBUS INC.
- Mark D. Kellam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including connection pad including groove pat...
- Patent number 12,237,251
- Issue date Feb 25, 2025
- SK hynix Inc.
- Si Yun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for fabricating the same
- Patent number 12,237,253
- Issue date Feb 25, 2025
- Samsung Electronics Co., Ltd.
- Jun Hyeong Park
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF FABRICATING PACKAGE STRUCTURE HAVING HOLLOW CYLINDERS
- Publication number 20250087615
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PREPARING FCBGA PACKAGE SUBSTRATE
- Publication number 20250087500
- Publication date Mar 13, 2025
- Shanghai Meadville Science & Technology Co., Ltd.
- Wei YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20250089171
- Publication date Mar 13, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Seung Min Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PAD FOR REDUCED CONTACT RESISTANCE
- Publication number 20250087609
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching Ju Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER STRUCTURE AND PACKAGE STRUCTURE
- Publication number 20250087621
- Publication date Mar 13, 2025
- Advanced Semiconductor Engineering, Inc.
- Chih-Jing HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250087637
- Publication date Mar 13, 2025
- Samsung Electronics Co., Ltd.
- Myungsam KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package Substrates with Corner Stiffeners Extensions
- Publication number 20250087542
- Publication date Mar 13, 2025
- Intel Corporation
- Man Chun OOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING WIR...
- Publication number 20250087574
- Publication date Mar 13, 2025
- Shinko Electric Industries Co., Ltd.
- Keiichi Hirabayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING ELECTROMAGNETIC INTERFERENCE (EMI) S...
- Publication number 20250087598
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Yao Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Advanced Substrates for Large, High Performance Power Packages
- Publication number 20250087566
- Publication date Mar 13, 2025
- Google LLC
- Ilyas Mohammed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER SUBSTRATE
- Publication number 20250087568
- Publication date Mar 13, 2025
- Murata Manufacturing Co., Ltd.
- Issei YAMAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND MATERIAL SYSTEM FOR TUNABLE HYBRID BOND INTERCONNECT RES...
- Publication number 20250087573
- Publication date Mar 13, 2025
- Applied Materials, Inc.
- Tyler Sherwood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20250087633
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Chia Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING PACKAGE STRUCTURE
- Publication number 20250087648
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jing-Cheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250087541
- Publication date Mar 13, 2025
- Samsung Electronics Co., Ltd.
- Youngbae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH THERMAL DISSIPATION
- Publication number 20250079261
- Publication date Mar 6, 2025
- UTAC Headquarters Pte. Ltd.
- IL Kwon SHIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ARCHITECTURES HAVING VERTICALLY STACKED DIES WITH A COOLING...
- Publication number 20250079263
- Publication date Mar 6, 2025
- Intel Corporation
- Sagar Suthram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device with Uneven Electrode Surface and Method for F...
- Publication number 20250079288
- Publication date Mar 6, 2025
- NANYA TECHNOLOGY CORPORATION
- Tsu-Chieh AI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20250079289
- Publication date Mar 6, 2025
- ABSOLICS INC.
- Jincheol KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE INCLUDING A SEMICONDUCTOR PACKAGE AND A METHOD OF...
- Publication number 20250079279
- Publication date Mar 6, 2025
- Samsung Electronics Co., Ltd.
- Geunwoo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE
- Publication number 20250079285
- Publication date Mar 6, 2025
- Hyundai Motor Company
- Jin Myeong YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20250079287
- Publication date Mar 6, 2025
- Samsung Electronics Co., Ltd.
- Junghoon KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250079326
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Hsun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED CHIP-PACKAGE, SEMICONDUCTOR PACKAGE, METHOD OF FORMING AN...
- Publication number 20250079330
- Publication date Mar 6, 2025
- INFINEON TECHNOLOGIES AG
- Mahadi-Ul HASSAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20250079190
- Publication date Mar 6, 2025
- ABSOLICS INC.
- Jincheol KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH TRANSISTOR CHIP BETWEEN CARRIER AND CONDUCTIVE STRUCTU...
- Publication number 20250079275
- Publication date Mar 6, 2025
- INFINEON TECHNOLOGIES AG
- Wolfgang SCHOLZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250079280
- Publication date Mar 6, 2025
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- WEI-CHUNG CHAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE
- Publication number 20250079290
- Publication date Mar 6, 2025
- Shinko Electric Industries Co., Ltd.
- Yuki KOBAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250079418
- Publication date Mar 6, 2025
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Takuma MORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250079421
- Publication date Mar 6, 2025
- Samsung Electronics Co., Ltd.
- Jihyun Lim
- H01 - BASIC ELECTRIC ELEMENTS

Geometry or layout

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Signal routing in integrated circuit packaging

Components for millimeter-wave communication

Secure semiconductor integration and method for making thereof

Electronic package and carrier thereof and method for manufacturing...

Semiconductor packages and methods of forming the same

Silicon spacers with improved adhesion and semiconductor device ass...

Semiconductor package including heat dissipation layer

Semiconductor device package including a thermal conductive layer a...

Pre-mold substrate and method of manufacturing pre-mold substrate

Semiconductor device package

Integrated structure with bifunctional routing and assembly compris...

Package structure, RDL structure comprising redistribution layer ha...

Semiconductor device including penetration via structure

Metallization structure

Semiconductor device with uneven electrode surface and method for f...

Semiconductor device with electromagnetic interference film and met...

Method for manufacturing semiconductor device with submount includi...

3D stack of split graphics processing logic dies

Connection structure and method of forming the same

System in a package modifications

Waferscale physiological characteristic sensor package with integra...

Semiconductor package

Electronic device and method of manufacturing the same

Package structure and method of forming the same

Deep trench capacitors embedded in package substrate

Semiconductor package

Semiconductor package

Vertical interconnects with variable pitch for scalable escape routing

Semiconductor package including connection pad including groove pat...

Semiconductor package and method for fabricating the same

Patents Applicationslast 30 patents

METHOD OF FABRICATING PACKAGE STRUCTURE HAVING HOLLOW CYLINDERS

METHOD FOR PREPARING FCBGA PACKAGE SUBSTRATE

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

BOND PAD FOR REDUCED CONTACT RESISTANCE

INTERPOSER STRUCTURE AND PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE

Package Substrates with Corner Stiffeners Extensions

WIRING BOARD, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING WIR...

SEMICONDUCTOR DEVICE INCLUDING ELECTROMAGNETIC INTERFERENCE (EMI) S...

Advanced Substrates for Large, High Performance Power Packages

MULTILAYER SUBSTRATE

METHOD AND MATERIAL SYSTEM FOR TUNABLE HYBRID BOND INTERCONNECT RES...

SEMICONDUCTOR PACKAGE AND METHOD FOR FORMING THE SAME

METHOD FOR FORMING PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGES WITH THERMAL DISSIPATION

PACKAGE ARCHITECTURES HAVING VERTICALLY STACKED DIES WITH A COOLING...

Semiconductor Device with Uneven Electrode Surface and Method for F...

SUBSTRATE AND MANUFACTURING METHOD FOR THE SAME

ELECTRONIC DEVICE INCLUDING A SEMICONDUCTOR PACKAGE AND A METHOD OF...

POWER MODULE

SEMICONDUCTOR PACKAGES

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

EMBEDDED CHIP-PACKAGE, SEMICONDUCTOR PACKAGE, METHOD OF FORMING AN...

SUBSTRATE AND MANUFACTURING METHOD FOR THE SAME

PACKAGE WITH TRANSISTOR CHIP BETWEEN CARRIER AND CONDUCTIVE STRUCTU...

CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE