Power Unit with Conductive Slats

Abstract

In one implementation, a power unit for plugging into a mother board includes a power module situated on a substrate. The substrate is situated on conductive slats, each having an extended end away from the power module. Each of the conductive slats provides a mounting contact of the power unit. Each mounting contact is electrically coupled to the power module by electrical routing in the substrate. The mounting contacts are configured to provide electrical connection between the power module and the mother board.

Description

BACKGROUND

The present application claims the benefit of and priority to a provisional application entitled “Module Card Structures,” Ser. No. 62/061,967 filed on Oct. 9, 2014. The disclosure in this provisional application is hereby incorporated fully by reference into the present application.

DEFINITION

As used herein, “III-Nitride” or “III-N” refers to a compound semiconductor that includes nitrogen and at least one group III element such as aluminum (Al), gallium (Ga), indium (In), and boron (B), and including but not limited to any of its alloys, such as aluminum gallium nitride (Al_xGa_(1-x)N), indium gallium nitride (In_yGa_(1-y)N, aluminum indium gallium nitride (Al_xIn_yGa_(1-x-y)N), gallium arsenide phosphide nitride (GaAs_aP_bN_(1-a-b)), aluminum indium gallium arsenide phosphide nitride (Al_xIn_yGa_(1-x-y)As_aP_bN_(1-a-b)), for example. III-N also refers generally to any polarity including but not limited to Ga-polar, N-polar, semi-polar, or non-polar crystal orientations. A III-N material may also include either the Wurtzitic, Zincblende, or mixed polytypes, and may include single-crystal, monocrystalline, polycrystalline, or amorphous structures. Gallium nitride or GaN, as used herein, refers to a III-N compound semiconductor wherein the group III element or elements include some or a substantial amount of gallium, but may also include other group III elements in addition to gallium. A III-N or a GaN transistor may also refer to a composite high-voltage enhancement mode transistor that is formed by connecting the III-N or the GaN transistor in cascode with a lower voltage group IV transistor.

In addition, as used herein, the phrase “group IV” refers to a semiconductor that includes at least one group IV element such as silicon (Si), germanium (Ge), and carbon (C), and may also include compound semiconductors such as silicon germanium (SiGe) and silicon carbide (SiC), for example. Group IV also refers to semiconductor materials which include more than one layer of group IV elements, or doping of group IV elements to produce strained group IV materials, and may also include group IV based composite substrates such as silicon on insulator (SOI), separation by implantation of oxygen (SIMOX) process substrates, and silicon on sapphire (SOS), for example.

BACKGROUND ART

Voltage converters are used in a variety of electronic circuits and systems. Many integrated circuit (IC) applications, for instance, require conversion of a direct current (DC) input to a lower, or higher, DC output. For example, a buck converter may be implemented to convert a higher voltage DC input to a lower voltage DC output for use in low voltage applications in which relatively large output currents are required.

The output of a voltage converter is typically provided by a power stage including a high side control transistor and a low side synchronous (sync) transistor, and may utilize relatively large passive devices, such as an output inductor and output capacitor. In addition, voltage converter circuitry typically includes a driver IC designed to drive the control and sync transistors of the power stage. Consequently, packaging solutions for mounting a voltage converter on a mother board typically require mother board surface area sufficient to accommodate a side-by-side layout including not only the control and sync transistors of the voltage converter power stage, but the output inductor, the output capacitor, and the driver IC for the power stage as well.

SUMMARY

The present disclosure is directed to a power unit with conductive slats, substantially as shown in and/or described in connection with at least one of the figures, and as set forth in the claims.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 shows a diagram of a power unit, according to one exemplary implementation.

FIG. 2A shows a top view of a power unit with conductive slats providing mounting contacts for plugging into a mother board, according to one exemplary implementation.

FIG. 2B shows a top view of a power unit with conductive slats providing mounting contacts for plugging into a mother board, according to another exemplary implementation.

FIG. 3A shows a cross-sectional view of the exemplary power unit shown in FIG. 2A.

FIG. 3B shows a cross-sectional view of the exemplary power unit shown in FIG. 2A prior to being plugged into a mother board.

FIG. 3C shows a cross-sectional view of the exemplary power unit shown in FIG. 2A plugged into the mother board shown in FIG. 3B.

DETAILED DESCRIPTION

The following description contains specific information pertaining to implementations in the present disclosure. One skilled in the art will recognize that the present disclosure may be implemented in a manner different from that specifically discussed herein. The drawings in the present application and their accompanying detailed description are directed to merely exemplary implementations. Unless noted otherwise, like or corresponding elements among the figures may be indicated by like or corresponding reference numerals. Moreover, the drawings and illustrations in the present application are generally not to scale, and are not intended to correspond to actual relative dimensions.

As stated above, voltage converters are used in a variety of electronic circuits and systems. For instance, and as noted above, integrated circuit (IC) applications may require conversion of a direct current (DC) input to a lower, or higher, DC output. As a specific example, a buck converter may be implemented to convert a higher voltage DC input to a lower voltage DC output for use in low voltage applications in which relatively large output currents are required.

FIG. 1 shows a diagram of a power unit including a voltage converter, according to one exemplary implementation. Power unit 100 includes power module 170 containing a voltage converter provided by power stage 130 and driver IC 140 for driving power stage 130. According to the exemplary implementation shown in FIG. 1, power stage 130 includes control transistor 110 (Q₁), synchronous (sync) transistor 120 (Q₂), output inductor 134, and output capacitor 136. As shown in FIG. 1, power module 170 of power unit 100 is configured to receive an input voltage V_IN, and to provide a converted voltage, e.g., a rectified and/or stepped down voltage, as V_OUT.

Power stage 130 maybe implemented using two power transistors in the form of metal-oxide-semiconductor field-effect transistors (MOSFETs) configured as a half bridge, for example. That is to say, power stage 130 may include high side or control transistor 110 having drain 112, source 114, and gate 116, as well as low side or sync transistor 120 having drain 122, source 124, and gate 126. Control transistor 110 is coupled with sync transistor 120 at switch node 132, which, in turn, is coupled to output inductor 134. Respective control and sync transistors 110 and 120 may be implemented as group IV based power transistors, such as silicon power MOSFETs having a vertical design, for example. Power module 170 may be advantageously utilized as a voltage converter, for example a buck converter, in a variety of automotive, industrial, appliance, and lighting applications.

It is noted that in the interests of ease and conciseness of description, the present inventive principles will in some instances be described by reference to specific implementations of a buck converter including one or more silicon based power FETs. However, it is emphasized that such implementations are merely exemplary, and the inventive principles disclosed herein are broadly applicable to a wide range of applications, including buck and boost converters, implemented using other group IV material based, or group III-V semiconductor based, power transistors. By way of example, control transistor 110 and sync transistor 120 may be implemented as III-Nitride power transistors in the form of heterostructure FETs (HFETs) such as gallium nitride (GaN) or other III-Nitride high electron mobility transistors (HEMTs).

As shown in FIG. 1, the voltage converter packaged by power unit 100 utilizes power stage 130 including control transistor 110, sync transistor 120, output inductor 134, and output capacitor 136 to provide output voltage V_OUT. In addition, the voltage converter packaged by power unit 100 includes driver IC 140. As a result, conventional packaging solutions for mounting such a voltage converter on a mother board would typically require mother board surface area sufficient to accommodate a side-by-side layout including not only control transistor 110 and sync transistor 120, but output inductor 134, output capacitor 136, and driver IC 140 as well.

The present application discloses a packaging solution in the form of a power unit with conductive slats providing mounting contacts for plugging into a mother board, that provides a highly compact design for packaging power stage 130, alone, or in combination with driver IC 140, as power module 170. As discussed below, power unit 100 may be configured for edge-mounting on a mother board, thereby substantially reducing the mother board surface area required to implement the voltage converter. Alternatively, and as further discussed below, power unit 100 may be configured for end-mounting on the mother board, thereby advantageously further reducing use of mother board surface area. FIG. 2A shows an exemplary representation of such a packaging solution.

FIG. 2A shows a top view of power unit 200A, according to one exemplary implementation. Power unit 200A includes power module 270 situated on a substrate (not visible from the perspective of FIG. 2A). According to the exemplary implementation shown in FIG. 2A, power module 270 includes control transistor 210 (Q₁), sync transistor 220 (Q₂), switch node 232, output inductor 234, output capacitor 236, driver IC 240, electrical connectors 260, and encapsulant material 280. Also shown in

FIG. 2A are perspective lines 3A-3A corresponding to the cross-sectional view of power unit 200A shown by FIG. 3A and discussed below.

It is noted that encapsulant material 280 may be any suitable electrically insulating material used as overmolding or encapsulation in semiconductor packaging. It is further noted that although, in practice, encapsulant material 280 is formed over and covers control transistor 210, sync transistor 220, switch node 232, output inductor 234, output capacitor 236, driver IC 240, and electrical connectors 280, FIG. 2A depicts those features as though “seen through” encapsulant material 280 for the purposes of conceptual clarity.

The substrate on which power module 270 is situated has length 252 determined by first and second ends 254a and 254b of the substrate, as well as width 256 determined by first and second edges 258a and 258b of the substrate. For the purposes of the present application, the substrate length 252 is greater than the substrate width 256.

The substrate on which power module 270 is situated, is itself situated on conductive slats each having an extended end away from power module 270, and each being one of mounting contacts 204. Mounting contacts 204 are electrically coupled to power module 270 by electrical routing within the substrate. Mounting contacts 204 are configured to provide electrical connections between power module 270 and a mother board into which power unit 200A is plugged (mother board not shown in FIG. 2A). Thus, power unit 200A is configured for end-mounting on the mother board.

Power unit 200A including power module 270 corresponds in general to power unit 100 including power module 170, in FIG. 1, and may share any of the characteristics attributed to that corresponding feature in the present application. Control transistor 210, sync transistor 220, switch node 232, output inductor 234, and output capacitor 236, in FIG. 2A correspond respectively in general to control transistor 110, sync transistor 120, switch node 132, output inductor 134, and output capacitor 136, in FIG. 1, and may share any of the characteristics attributed to those corresponding features in the present application.

Control transistor 210, in FIG. 2A, is shown to include top side source 214 and top side gate 216 corresponding respectively to source 114 and gate 116 of control transistor 110, in FIG. 1, while sync transistor 220 is shown to include top side source 224 and top side gate 226 corresponding respectively to source 124 and gate 126 of sync transistor 120. Although not visible in the perspective shown in FIG. 2A, it is to be understood that, according to the present exemplary implementation, control transistor 210 is implemented as a vertical power FET having a bottom side drain opposite top side source 214 and top side gate 216 and corresponding to drain 112 of control transistor 110, in FIG. 1. Moreover, exemplary sync transistor 220 is also implemented as a vertical power FET having a bottom side drain opposite top side source 224 and top side gate 226 and corresponding to drain 122 of sync transistor 120, in FIG. 1.

According to the exemplary implementation shown in FIG. 2A, power module 270 includes driver IC 240, as well as all of the features included in power stage 130 of FIG. 1. However, in some implementations, it may be advantageous or desirable to omit driver IC 240 from power module 270. In those implementations, power unit 200A may be configured to package control transistor 210, sync transistor 220, and one or both of output inductor 234 and output capacitor 236, but to omit driver IC 240.

Mounting contacts 204 may be implemented using any suitable electrically conductive material or materials, and are collectively configured to provide power module 270 with electrical connections to ground, V_IN, and V_OUT, shown in FIG. 1. For example, in some implementations, mounting contacts 204 may be extended ends of conductive slats that are part of a lead frame.

With respect to electrical connections among the features contained by power module 270, it is noted that the bottom side drain of sync transistor 220 corresponding to drain 122, in FIG. 1, may be electrically connected to top side source 214 of control transistor 210 at switch node 232 by electrical routing within the substrate on which power module 270 is situated, as well as by electrical connectors 260. It is further noted that although electrical connectors 260 are depicted as wire bond in FIG. 2A, that representation is merely for the purposes of conceptual clarity.

More generally, electrical connectors 260 may be implemented as conductive clips, ribbons, strips, or vias, such as through-substrate vias, or as conductive traces on a printed circuit board (PCB). In other words, control transistor 210 may be coupled to sync transistor 220 by an electronic connector selected from the group consisting of a clip, a ribbon, a strip, a through-substrate via, a trace of a PCB, and a wire bond. In addition, driver IC 240 may be coupled to one or both of control transistor 210 and sync transistor 220 by an electrical connector selected from the group consisting of a clip, a ribbon, a strip, a through-substrate via, a trace of a PCB, and a wire bond.

Moving to FIG. 2B, FIG. 2B shows a top view of power unit 200B for plugging into a mother board, according to another exemplary implementation. It is noted that all features in FIG. 2B identified by reference numbers shown in and described by reference to FIG. 2A, above, correspond respectively to those features and may share any of the characteristics attributed to those corresponding features in the present application.

In contrast to power unit 200A, in FIG. 2A, however, mounting contacts 204 of power unit 200B extend away from power module 270 at first edge 258a of the substrate on which power module 270 is situated. As described previously by reference to FIG. 2A, mounting contacts 204 are electrically coupled to power module 270 by electrical routing within the substrate. Mounting contacts 204 are configured to provide electrical connections between power module 270 and a mother board into which power unit 200B is plugged (mother board not shown in FIG. 2B). Thus, power unit 200B is configured for edge-mounting on the mother board.

Referring to FIG. 3A, FIG. 3A shows a cross-sectional view of exemplary power unit 200A, in FIG. 2A, according to one implementation, along perspective lines 3A-3A in FIG. 2A. Power unit 300 includes substrate 302 having back surface 308b situated on conductive slats including conductive slat 390, and power module 370 situated on front surface 308a of substrate 302 opposite back surface 308b. Substrate 302 has length 352 determined by first and second ends 354a and 354b of substrate 302. As shown in FIG. 3A, power module 370 includes control transistor 310, driver IC 340 for driving control transistor 310, and output inductor 334, all situated on front surface 308a of substrate 302. As further shown in FIG. 3A, power module 370 includes electrical connectors 360 and encapsulation material 380, and has exterior wall 372 situated adjacent mounting contacts 304 of power unit 300. Also shown in FIG. 3A are drain 312, source 314, and gate 316 of control transistor 310.

Power unit 300 including power module 370 corresponds in general to power unit 200A including power module 270, in FIG. 2A, and may share any of the characteristics attributed to that corresponding feature in the present application. That is to say, substrate 302 having length 352 determined by first and second ends 354a and 354b of substrate 302 corresponds in general to the substrate having length 252 determined by first and second ends 254a and 254b, discussed by reference to FIG. 2A, and may share any of the characteristics attributed to that corresponding feature in the present application. In addition, conductive slat 390 having an extended end away from power module 370 so as to be mounting contact 304 corresponds in general to the conductive slats serving as mounting contacts 204, discussed by reference to FIG. 2A, and may share any of the characteristics attributed to those corresponding features, above. Thus, mounting contact 304 is electrically coupled to power module 370 by electrical routing in substrate 302.

As noted above, conductive slat 390 serving as mounting contact 304, as well as the conductive slats serving as mounting contacts 204, in FIGS. 2A and 2B, may be part of a lead frame. Alternatively, conductive slat 390, in FIG. 3A, as well as the conductive slats serving as mounting contacts 204, in FIGS. 2A and 2B, may be formed of any suitable conductive material such as a metal or metal alloy, for example.

In one implementation, substrate 302 may be a PCB configured as a daughter board for plugging into a mother board, for example. In that implementation, mounting contacts 304 can be electrically coupled to power module 370 by routing traces within the PCB of substrate 302. In another implementation, for example, substrate 302 may include a molded interconnect system (MIS) as known in the art, and mounting contacts 304 can be electrically coupled to power module 370 by electrical connections produced in the MIS.

It is noted that although not visible from the perspective shown by FIG. 3A, due to being obscured by control transistor 310, driver IC 340, and encapsulation material 380, power module 370 of power unit 300 also includes a sync transistor and output capacitor corresponding respectively to sync transistor 220 and output capacitor 236, in FIG. 2A. In addition to the features previously attributed to power unit 100/200A/200B/300, it is noted that exterior wall 372 of power module 370 adjacent mounting contacts 304 may be substantially perpendicular to front surface 308a of substrate 302.

Continuing to FIGS. 3B and 3C, FIG. 3B shows a cross-sectional view of exemplary power unit 300 prior to being plugged into a mother board, while Figure shows power unit 300 plugged into the mother board. It is noted that all features in FIGS. 3B and 3C identified by reference numbers shown in and described by reference to FIG. 3A, above, correspond respectively to those features and may share any of the characteristics attributed to those corresponding features in the present application.

In addition to power unit 300, FIG. 3B shows mother board 364 having major surface 368 including slot 366, while FIG. 3C shows mounting contact 304 extending away from power module 370 at first end 354a of substrate 302 being plugged into slot 366. Consequently, mounting contacts 304 are placed into contact with electrical routing contained within mother board 364, which may be implemented as a PCB, so as to provide electrical connection between power module 370 and mother board 364.

Thus, according to the implementation shown by FIGS. 3A, 3B, and 3C power unit 300 may be advantageously configured for end-mounting on mother board 364. According to the implementation shown in FIGS. 3A, 3B, and 3C, end-mounting of power unit 300 on mother board 364 results in front surface 308a and back surface 308b of substrate 302 being substantially perpendicular to major surface 368 of mother board 364.

It is noted that power unit 200B, in FIG. 2B, may be analogously configured for edge-mounting on mother board 364. In that implementation, however, slot 366 would be configured to receive mounting contacts 204 extending away from power module 270 at first edge 258a of substrate 302. It is noted that edge-mounting of power unit 200B on mother board 364 would also result in front surface 308a and back surface 308b of substrate 202/302 being substantially perpendicular to major surface 368 of mother board 364.

Thus, the present application discloses a packaging solution in the form of a power unit with conductive slats providing mounting contacts for plugging into a mother board, that provides a highly compact design for packaging a voltage converter. The power unit with conductive slats disclosed in the present application may be configured for edge-mounting on a mother board, thereby substantially reducing the mother board surface area required to implement the voltage converter. Alternatively, such a power unit may be configured for end-mounting on the mother board, thereby advantageously further reducing use of mother board surface area.

From the above description it is manifest that various techniques can be used for implementing the concepts described in the present application without departing from the scope of those concepts. Moreover, while the concepts have been described with specific reference to certain implementations, a person of ordinary skill in the art would recognize that changes can be made in form and detail without departing from the scope of those concepts. As such, the described implementations are to be considered in all respects as illustrative and not restrictive. It should also be understood that the present application is not limited to the particular implementations described herein, but many rearrangements, modifications, and substitutions are possible without departing from the scope of the present disclosure.

Claims

1. A power unit for plugging into a mother board, said power unit comprising: a power module situated on a substrate;said substrate being situated on a plurality of conductive slats each having an extended end away from said power module;each said extended end of said plurality of conductive slats being a mounting contact;each said mounting contact being electrically coupled to said power module by an electrical routing in said substrate;each said mounting contact configured to provide electrical connection between said power module and said mother board.

2. The power unit of claim 1, wherein said substrate comprises a printed circuit board (PCB) configured as a daughter board.

3. The power unit of claim 1, wherein said substrate comprises a molded interconnect system (MIS).

4. The power unit of claim 1, wherein each said mounting contact is at an end of said substrate for end-mounting on said mother board.

5. The power unit of claim 1, wherein each said mounting contact is at an edge of said substrate for edge-mounting on said mother board.

6. The power unit of claim 1, wherein said plurality of conductive slats are part of a lead frame.

7. The power unit of claim 1, wherein said power module comprises a voltage converter including at least one silicon power transistor.

8. The power unit of claim 1, wherein said power module comprises a voltage converter including at least one III-Nitride power transistor.

9. The power unit of claim 1, wherein said power module comprises a buck converter.

10. A power unit for plugging into a mother board, said power unit comprising: a power module including a control transistor and a sync transistor of a power stage situated on a substrate;said substrate being situated on a plurality of conductive slats each having an extended end away from said power module;each said extended end of said plurality of conductive slats being a mounting contact;each said mounting contact being electrically coupled to said power module by an electrical routing in said substrate;each said mounting contact configured to provide electrical connection between said power module and said mother board.

11. The power unit of claim 10, wherein said substrate comprises a printed circuit board (PCB) configured as a daughter board.

12. The power unit of claim 10, wherein said substrate comprises a molded interconnect system (MIS).

13. The power unit of claim 10, wherein each said mounting contact is at an end of said substrate for end-mounting on said mother board.

14. The power unit of claim 10, wherein each said mounting contact is at an edge of said substrate for edge-mounting on said mother board.

15. The power unit of claim 10, wherein said plurality of conductive slats are part of a lead frame.

16. The power unit of claim 10, wherein said control transistor is coupled to said sync transistor by an electrical connector selected from the group consisting of a clip, a ribbon, a strip, a through-substrate via, a trace of a printed circuit board, and a wire bond.

17. The power unit of claim 10, wherein said power module comprises a driver integrated circuit.

18. The power unit of claim 17, wherein said driver integrated circuit is coupled to at least one of said control transistor and said sync transistor by an electrical connector selected from the group consisting of a clip, a ribbon, a strip, a through-substrate via, a trace of a printed circuit board, and a wire bond.

19. The power unit of claim 10, wherein at least one of said control transistor and said sync transistor is a silicon transistor.

20. The power unit of claim 10, wherein at least one of said control transistor and said sync transistor is a III-Nitride transistor.