Patent Application
20230108010
The present invention relates to circuit boards, and more particularly to a preparation method for a spherical silica powder filler, powder filler obtained thereby and use.
In the field of 5G communication, equipments assembled by the radio frequency devices and circuit boards such as high-density interconnect boards (HDI), high-frequency high-speed boards and motherboards, etc. are required. These circuit boards are generally composed of fillers and organic polymers such as epoxy resin, aromatic polyether and fluororesin, etc. The fillers are mainly angular or spherical silica whose main function is to reduce the thermal expansion coefficient of organic polymers. The spherical or angular silica is tightly packed and graded in the existing fillers.
On the one hand, with the advancement of technology, the signal frequency used by semiconductors is getting higher and higher, and the high-speed and low-loss signal transmission speed requires fillers with low dielectric loss and low dielectric constant. The dielectric constant of material basically depends on its chemical composition and structure, and silica has its inherent dielectric constant. On the other hand, the dielectric loss is related to the polar groups, such as hydroxyl groups of the filler, the more the hydroxyl groups, the greater the dielectric loss. The high-temperature flame heating method is commonly used for the traditional spherical silica, wherein the physical melting or chemical oxidation is used to prepare the spherical silica. The flame is generally formed by the combustion of LPG, NG and other hydrocarbon fuels with oxygen, and a large amount of water molecules are produced in the flame. Therefore, there are a large number of polar hydroxyl groups inside and on the surface of the obtained silicon oxide powder, resulting in increased dielectric loss, which cannot meet the requirement for the dielectric properties of high-frequency and high-speed circuit boards in the 5G communication era. Another disadvantage of the flame method is that the flame temperature is generally higher than the boiling point of silica at 2230 degrees, causing the generation of silica below tens of nanometers (such as below 50 nm) by condensed after gasification. The specific surface area and diameter of spherical silica have a reciprocal function relationship: specific surface area = constant / particle diameter. That is, a decrease in diameter leads to a sharp increase in specific surface area. For example, the calculated specific surface area of spherical silica with a diameter of 0.5 µm is 5.6 m2/g, and the calculated specific surface area of spherical silica with a diameter of 50 nm is 54.5 m2/g. The increase in the specific surface area leads to an increase in the amount of adsorbed water. A water molecule can be understood as containing two hydroxyl groups, which will cause the dielectric loss of silicon oxide powder to deteriorate sharply.
In order to solve the problem that the silica powder filler has a relatively high hydroxyl content in the prior art, the present invention provides a preparation method for a spherical silica powder filler, powder filler obtained thereby and use.
The present invention provides a preparation method for a spherical silica powder filler, comprising: S1, providing spherical polysiloxane comprising T units by means of a hydrolysis condensation reaction of RiSiX3, wherein R1 is hydrogen atom or an independently selectable organic group having 1 to 18 carbon atoms, X is a hydrolyzable group, and the T unit is R1SiO3—; S2, calcining the spherical polysiloxane under the condition of a dry oxidizing gas atmosphere at a calcining temperature between 850 degrees and 1200 degrees, so as to obtain a spherical silica powder filler having a low hydroxyl content, wherein the spherical silica powder filler is composed of at least one selected from Q1 unit, Q2 unit, Q3 unit and Q4 unit, wherein Q1 unit is Si(OH)3O—, Q2 unit is Si(OH)2O2—,Q3 unit is SiOHO3—, Q4 unit is SiO4—, and the content of Q4 unit is greater than or equal to 95%.
Preferably, the hydrolyzable group X is an alkoxy group such as a methoxy group, an ethoxy group, and a propoxy group, etc, or a halogen atom such as a chlorine atom, etc. The catalyst for the hydrolysis condensation reaction may be a base and/or an acid.
Preferably, the oxidizing gas contains oxygen to oxidize all the organics in the polysiloxane. For saving cost, the oxidizing gas is the air. In order to reduce the hydroxyl content of the calcined silica, the less moisture content in the air, the better. For saving cost, the compressed air after removing water by a freeze dryer is suitable for the calcination atmosphere of the present invention. Specifically, the step S2 comprises that the spherical polysiloxane powder is put into a muffle furnace and dry air is introduced for calcination.
Preferably, the calcination of the spherical polysiloxane is achieved by electric heating or indirect heating with combustion gas. It should be understood that the present invention has no particular limitation on the heating method. However, since the burning gas contains moisture, the direct heating by the gas flame should be avoided as much as possible in the present invention. The temperature can be gradually increased during calcination. Slow heating at a temperature lower than 850 degrees and room temperature is beneficial to the slow decomposition of organic groups, in order to reduce the residual carbon in the final silica after the calcination. When the amount of residual carbon is high, the whiteness of silica decreases.
Preferably, the calcining temperature is between 850 degrees and 1100 degrees, and the calcining time is between 6 hours and 12 hours.
Preferably, the spherical polysiloxane further comprises a Q unit, a D unit, and/or a M unit, wherein Q unit is SiO4—, D unit is R2R3SiO2—, M unit is R4R5R6SiO—, wherein each of R2, R3, R4, R5, R6 is a hydrogen atom or an independently selectable hydrocarbon group having 1 to 18 carbon atoms. For example, in a preferred embodiment, Si(OC2C3)4, CH3CH3Si(OCH3)2 can be combined with CH3Si(OCH3)3.
Preferably, the preparation method further comprises adding a treatment agent to perform surface treatment on the spherical silica powder filler, and the treatment agent comprises a silane coupling agent and/or disilazane; the silane coupling agent is (R7)a(R8)bSi(M)4-a-b, wherein each of R7, R8 is a hydrogen atom, an independently selectable hydrocarbon group having 1 to 18 carbon atoms, or an independently selectable hydrocarbon group having 1 to 18 carbon atoms replaced by a functional group, wherein the functional group is selected from at least one of the following organic functional groups: vinyl, allyl, styryl, epoxy group, aliphatic amino, aromatic amino, methacryloxypropyl, acryloyloxypropyl, ureidopropyl, chloropropyl, mercaptopropyl, polysulfide group, isocyanate propyl; M is an alkoxy group with 1 to 18 carbon atoms or a halogen atom, a is 0, 1, 2 or 3, b is 0, 1, 2 or 3, a+b is 1, 2 or 3; the disilazane is (R9R10R11)SiNHSi(R12R13R14), wherein each of R9, R10, R11, R12, R13, R14 is a hydrogen atom or an independently selectable hydrocarbon group having 1 to 18 carbon atoms.
The present invention also provides a spherical silica powder filler obtained according to the above-mentioned preparation method, wherein the spherical silica powder filler has a low hydroxyl content, and an average particle size of the spherical silica powder filler is between 0.1 µm and 5 µm. More preferably, the average particle size of the spherical silica powder filler is between 0.15 µm and 4.5 µm.
The present invention also provides a use of the spherical silica powder filler, wherein the spherical silica powder filler of different particle sizes is tightly packed and graded in resin to form a composite material, which is suitable for circuit board material and semiconductor packaging material. Preferably, the spherical silica powder filler is suitable for high-frequency high-speed circuit boards, prepregs, copper clad boards and other semiconductor packaging materials that require low dielectric loss.
Preferably, coarse particles above 1 µm, 3 µm, 5 µm, 10 µm, or 20 µm in the spherical silica powder filler are removed by a dry or wet sieving or inertial classification.
The spherical silica powder filler according to the present invention has a low hydroxyl content, a low dielectric loss and a low thermal expansion coefficient, and is suitable for high-frequency high-speed circuit boards, prepregs or copper clad boards, etc.
The preferred embodiments of the present invention are given below and described in detail.
The detection methods involved in the following embodiments are listed as follows.
The average particle size is measured with HORIBA’s laser particle size distribution analyzer LA-700.
The contents of Q1 unit, Q2 unit, Q3 unit and Q4 unit of the spherical silica powder filler are analyzed by 29Si solid-state NMR nuclear magnetic resonance spectroscopy and calculated based on the nuclear magnetic resonance absorption peak area of Q1 unit, Q2 unit, Q3 unit and Q4 unit. Q4 unit content (%) = (Q4 unit peak area / (Qi unit peak area+Q2 unit peak area+Q3 unit peak area+Q4 unit peak area)) × 100.
The dielectric loss test method comprises: mixing different volume fractions of sample powders and paraffin to make test samples, and using a commercially available high-frequency dielectric loss meter to measure the dielectric loss under the condition of 10 GHz. Then the dielectric loss of the sample is obtained from the slope in the coordinate, wherein the ordinate represents the dielectric loss, and the abscissa represents the volume fraction. The dielectric losses of the Examples and Comparative Examples of the present invention at least can be relatively compared although it is generally difficult to obtain the absolute value of the dielectric loss.
In this text, “degrees” refers to Celsius degrees, i.e., °C.
In this text, the average particle size refers to the volume average diameter of the particles.
Deionized water of a certain weight at room temperature was added into a reactor with a stirrer. While stirring, methyltrimethoxysilane of 80 by weight was added and a small amount of acetic acid was added to adjust the pH to about 5. After the methyltrimethoxysilane was dissolved, 5% ammonia water of 25 by weight was added and stirred for 10 seconds, and then the stirring was stopped. After standing for 1 hour, it was filtered and dried to obtain spherical polysiloxane. The polysiloxane powder was put into a muffle furnace and dry air was introduced for calcination. The final calcining temperature was 850 degrees, 1000 degrees or 1100 degrees, and the calcining time was 12 hours. The analysis results of the samples were listed in following Table 1.
Deionized water of 1100 by weight at room temperature was added into a reactor with a stirrer. While stirring, propyltrimethoxysilane of 80 by weight was added and a small amount of acetic acid was added to adjust the pH to about 5. After the propyltrimethoxysilane was dissolved, 5% ammonia water of 25 by weight was added and stirred for 10 seconds, and then the stirring was stopped. After standing for 1 hour, it was filtered and dried to obtain spherical polysiloxane. The polysiloxane powder was put into a muffle furnace and dry air was introduced for calcination. The final calcining temperature was 950 degrees, and the calcining time was 6 hours. The analysis result of the sample was listed in following Table 2.
Deionized water of 2500 by weight at 40° C. was added into a reactor with a stirrer. While stirring, methyltrimethoxysilane of 80 by weight was added and a small amount of acetic acid was added to adjust the pH to about 5. After the methyltrimethoxysilane was dissolved, 5% ammonia water of 60 by weight was added and stirred for 10 seconds, and then the stirring was stopped. After standing for 1 hour, it was filtered and dried to obtain spherical polysiloxane. The polysiloxane powder was put into a muffle furnace and dry air was introduced for calcination. The final calcining temperature was 1000 degrees, and the calcining time was 12 hours. The heating method was changed to natural gas combustion (comparative example 2) with the direct combustion gas heating. The final calcining temperature was 1000 degrees, and the calcining time was 12 hours. The analysis results of the sample were listed in following Table 3. Obviously, the hydroxyl group in the silica was increase due to the moisture contained in the hot gas after natural gas combustion.
The crushed silica with an average particle size of 2 µm was sent to a spheroidizing furnace with a flame temperature of 2500 degrees for melting and spheroidizing. All the spheroidized powders were collected as sample of Comparative Example 3. The analysis result of the sample was listed in following Table 4.
It should be understood that the samples obtained in the Examples 1-6 may be surface-treated. Specifically, vinyl silane coupling agent, epoxy silane coupling, disilazane, etc. can be used to treat the samples as required. Also, at least two treatment agents can be used to treat the samples as required.
It should be understood that coarse particles above 1 µm, 3 µm, 5 µm, 10 µm, or 20 µm in the spherical silica powder filler are removed by a dry or wet sieving or inertial classification.
It should be understood that the spherical silica powder filler of different particle sizes is tightly packed and graded in resin to form a composite material.
The foregoing description refers to preferred embodiments of the present invention and is not intended to limit the scope of the present invention. Various changes can be made to the foregoing embodiments of the present invention. That is to say, all simple and equivalent changes and modifications made in accordance with the claims of the present invention and the content of the description fall into the protection scope of the patent of the present invention. What is not described in detail in the present invention is conventional technical content.
| Number | Date | Country | Kind |
|---|---|---|---|
| PCT/CN2020/075559 | Feb 2020 | WO | international |
| Filing Document | Filing Date | Country | Kind |
|---|---|---|---|
| PCT/CN2020/086980 | 4/26/2020 | WO |
