Number | Name | Date | Kind |
---|---|---|---|
4106958 | Stayner | Aug 1978 | |
4504007 | Anderson et al. | Mar 1985 | |
4963401 | Kaspaul | Oct 1990 | |
5045128 | Landreth et al. | Sep 1991 | |
5090651 | Mittag | Feb 1992 | |
5104494 | Tench et al. | Apr 1992 | |
5121875 | Hagerty et al. | Jun 1992 | |
5240169 | Gileta | Aug 1993 |
Entry |
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Frear et al., Fluxless Soldering Using Actuated Acid Vapors, pp. 1704-1715. |
Bakszt M., Providing Solderability Retention By Means of Chemical Inhibitors, Printed Circuit World, pp. 2-8, Convention III. |
Dry Soldering Process Using Halogenated Gas, IBM Technical Disclosure Bulletin, vol. 27, No. II, Apr. 1985, p. 6513. |
Goldman et al., Proprietary Treatments for Copper Pads, PC FAB, Oct. 1990, pp. 60-66. |