Patent Application
20150351244
This application is based upon and claims the benefit of priority of the prior Japanese Patent Application No. 2014-110245, filed on May 28, 2014, the entire contents of which are incorporated herein by reference.
The embodiments discussed herein are related to a printed board unit, a printed board, and an information processing apparatus.
There is a technology in which a dam material having an annular dam shape and made of a material repelling a conductive connection material is formed on a land in advance, the conductive connection material is supplied onto the land in an opening part of the dam material, and the thickness of the conductive connection material is controlled by changing an area of the opening part.
Moreover, there is a technology in which an electrode of a substrate and an electrode of a component are connected to each other with a conductive adhesive, and a Sn-based metal in a surface plated layer of the electrode of the component is reformed by thermal treatment.
In the structure where a connection terminal of a component is electrically bonded to an electrode on a base material by soldering and thereafter with a bonding material, for example, thereby allowing the connection terminal to be firmly bonded to the electrode.
However, further executing the bonding process with the bonding material or the like after executing the bonding process by solder increases the number of processes.
The following are reference documents.
[Document 1] Japanese Laid-open Patent Publications No. 2013-179351 and
[Document 2] Japanese Laid-open Patent Publications No. 2006-324629.
According to an aspect of the invention, a printed board unit includes: a base material; an electrode formed on the base material; a resist film formed on the base material, the resist film has an opening to expose the electrode; a recess part formed on an inner wall of the resist film; an electronic component including a lead terminal electrically coupled to the electrode; and a bonding material which bonds the lead terminal to the electrode in the opening, a portion of the bonding material being mounted on the lead terminal at an inner side of the opening opposite to the recess part.
The object and advantages of the invention will be realized and attained by means of the elements and combinations particularly pointed out in the claims.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory and are not restrictive of the invention, as claimed.
A first embodiment will be described in details based on the drawings.
A printed board unit 12 according to the first embodiment includes, as illustrated in
The printed board unit 12 is formed, for example, in the interior of a mobile telephone 20 illustrated in
The mobile telephone 20 is an example of an information processing apparatus. Another example of the information processing apparatus may include, for example, a smartphone 26 illustrated in
As illustrated in detail in
The base material 28 is formed in a plate shape of a material having a flexural rigidity and an insulation property, for example, a glass epoxy. Hereinafter, a plan view indicates that the base material 28 is seen in a normal direction (direction of an arrow A1).
The foot pattern 30 is formed on the base material 28. The foot pattern 30 is formed in a predetermined pattern shape of a material having conductivity. A lead terminal 34 of the electronic component 16 is electrically connected to a part of the foot pattern 30. The foot pattern 30 is an example of an electrode.
The solder resist 32 is formed on the base material 28. An opening part 36 is formed in the solder resist 32. The opening part 36 is formed a rectangular shape larger than the foot pattern 30 in the plan view.
As illustrated in
The solder resist 32 excluding the opening part 36 covers the base material 28 and the foot pattern 30. This protects the base material 28 and the solder resist 32 from an outside environment, and restricts deterioration or corrosion of the base material 28 and the solder resist 32.
In the opening part 36, a lead bonding part 38 at the tip of the lead terminal 34 and the foot pattern 30 are bonded and electrically connected to each other with the conductive adhesive 18. In the example illustrated in
As illustrated in
A back surface 42B of the recess part 42 has a curved shape in which a center of the back surface 42B in the width direction is farther from the foot pattern 30 than both sides of the back surface 42B in the width direction. In particular, the shape of the back surface 42B is designed to allow a mounted part 44 to be effectively formed, as described later.
Although the conductive adhesive 18 is housed inside the opening part 36, a part of the conductive adhesive 18 is mounted on the lead bonding part 38 in a given area TA (see
In the embodiment, specially, the two opposed recess parts 42 are formed to form a continuous part 46 in which the two mounted parts 44 are continuous while traversing the lead bonding part 38.
Next, a method of mounting the electronic component 16 on the printed board 14, and an effect by the embodiment will be described.
The printed board 14 is manufactured in accordance with an example of a procedure illustrated in a manufacturing flow
As illustrated in
Note that, the board 50 before being cut may preferably be, for example, as illustrated in
Firstly, drilling is performed on the base material 28 at Step S102. Subsequently, at Step S104 to Step S108, plating treatment, circuit pattern formation, and roughening treatment are sequentially performed.
In addition, at Step S110, the solder resist 32 is formed on the base material 28. In this process, the opening part 36 is formed in the solder resist 32, and the recess parts 42 are further formed.
Subsequently, at Step S112, predetermined information display is formed (printed) on the solder resist 32 using a coating material. At Step S114, the foot pattern 30 is subjected to rustproofing treatment. In this manner, the printed board 14 is manufactured.
The printed board 14 includes the base material 28, and a circuit pattern (the foot pattern 30) and the solder resist 32 which are on the base material 28. At this stage, as mentioned above, the opening part 36 surrounding the foot pattern 30 in the plan view is formed in the solder resist 32, and the recess parts 42 are further formed.
Next, the printed board unit 12 is manufactured in accordance with an example of a procedure illustrated in
Subsequently, at Step S124, components are mounted on the base material 28. The “components” include the electronic component 16. In other words, as illustrated in
In this process, when the electronic component 16 is pushed to the printed board 14 side, a force from the lead bonding part 38 acts on the conductive adhesive 18. This force causes the conductive adhesive 18 to flow, as illustrated in
The conductive adhesive 18 which flows to the outer circumference side in this manner are reflected by the solder resist 32, and tends to return to the foot pattern 30 side as illustrated in
In addition, at Step S126, the conductive adhesive 18 is heated to lower the viscosity. A heating method of the conductive adhesive 18 is not specially limited, however, for example, it may be implemented by a reflow of the printed board 14.
In this manner, in the embodiment, a part of the conductive adhesive 18 is positioned on the lead bonding part 38 to achieve a lager bonded area with the conductive adhesive 18 than a structure in which no part of the conductive adhesive 18 is position on the lead bonding part 38. In addition, the part of the cured conductive adhesive 18 covers the lead bonding part 38. This increases a contact area of the conductive adhesive 18 with respect to the lead bonding part 38, in other words, a bonded area of the conductive adhesive 18 in the embodiment to achieve a higher bonding strength of the lead bonding part 38 with respect to the foot pattern 30.
Note that, from the viewpoint of enhancing the bonding strength by the conductive adhesive 18, it is considered that a large amount of the conductive adhesive 18 is supplied to the opening part 36, for example, in the structure in which no recess part 42 is formed in the solder resist 32. However, simply increasing the amount of the conductive adhesive 18 may not contribute increase in the bonded area in some cases because a phenomenon (wicking phenomenon) in which a part of the conductive adhesive 18 is raised along the lead terminal 34 occurs at a certain surface tension of the conductive adhesive 18.
Another method of enhancing the bonding strength may include, for example, a method of connecting a portion expected to have a higher bonding strength after the lead bonding part 38 is bonded to the foot pattern 30 using solder, with a bonding material other than the solder. However, this results in the increased processes because two types of materials of the solder and the bonding material other than the solder are supplied. For example, in the flow illustrated in
Still another method of enhancing the bonding strength may include a method in which a solder resist having a lager thickness is formed to increase the height of an opening part, so that a bonding material of a larger amount is supplied into the opening part to cause a lead bonding part to be embedded into the bonding material. However, forming a solder resist having a lager thickness may lower a mounting performance of component with respect to components other than a component which is expected to have a high bonding strength (the components may be difficult to be mounted).
In the embodiment, it is neither desired to increase the amount of the conductive adhesive 18 nor to use several types of bonding materials (solder and a bonding material other than the solder). Further, it is possible to enhance the bonding strength between the lead bonding part 38 and the foot pattern 30 by reducing dependence of the conductive adhesive 18 on the physical properties (wettability) and the strength characteristics and without adding new processes. For example, as illustrated in
The structure in which the bonding strength of the lead bonding part 38 with respect to the foot pattern 30 is high may be implemented also in an electronic apparatus formed with the printed board unit 12.
Next, a second embodiment will be described. In the second embodiment, the same reference numerals are given to the same elements, members, and the like as those in the first embodiment in the drawings, and the detailed explanation thereof may be omitted.
In a printed board unit 62 in the second embodiment, as illustrated in
Accordingly, in the second embodiment, the conductive adhesive 18 of a larger amount may be supplied into the opening part 36. For example, even when the lead bonding part 38 has a thickness larger than that in the case illustrated in the first embodiment (
Note that, a method of forming the wall part 66 is not specially limited. For example, the wall part 66 may be formed simultaneously with the printing when an information display, a name of the component or an arrangement of the components, is printed on the solder resist 32, using a printing material (which is referred to as silk in some cases) such as a coating material or ink. In this manner, forming the wall part 66 when the predetermined information is printed on the solder resist 32 reduces an additional process of forming the wall part 66.
The height of the wall part 66 is not specially limited. For example, the height T1 from the upper surface 32T of the solder resist 32 may be set within the range of 10 to 30 μm. The height of the solder resist 32 may be set to 50 μm, so that the level difference G1 becomes 60 to 80 μm.
Next, a third embodiment will be described. Also in the third embodiment, the same reference numerals are given to the same elements, members, and the like as those in the first embodiment in the drawings, and the detailed explanation thereof may be omitted.
In a printed board unit 72 in the third embodiment, as illustrated in
Accordingly, in the third embodiment, the protrusion parts 76 guide the conductive adhesive 18 reflected by the recess parts 42 into the given areas TA. In other words, the conductive adhesive 18 may be guided into the given area TA, so that the mounted part 44 may be efficiently formed.
In the respective embodiments mentioned above, the mounted part 44 does not have to cover the whole area of the upper surface of the lead bonding part 38. For example, as illustrated in
In the examples illustrated in
The number of the recess parts 42 is not limited. When multiple recess parts 42 are formed, multiple mounted parts 44 corresponding to the recess parts 42 are also formed.
In a structure in which multiple recess parts 42 are formed, the presence of a pair of the recess parts 42 which are opposed to each other makes easy to form the mounted parts 44 continuous with each other on the lead bonding part 38, as mentioned above.
The recess part 42 may preferably be formed at a short side 36S of the opening part 36. However, forming the recess part 42 at the long side 36L makes it easy to form the mounted part 44 on the lead bonding part 38 because of a short distance from the recess part 42 to the lead bonding part 38.
The shape of the recess part 42 is not limited as long as the conductive adhesive 18 may be reflected to cause the conductive adhesive 18 to be concentrated into the given area TA. In the embodiments mentioned above, the back surface 42B of the recess part 42 has a shape in which the center of the back surface 42B in the width direction is farther from the foot pattern 30 than both sides thereof in the width direction. This allows the conductive adhesive 18 to be effectively concentrated into the given area TA, compared with a structure of the flat back surface 42B of the recess part 42.
The shape of the back surface 42B viewed in the plan view may preferably be a shape in which the back surface 42B is linearly slanted from the both sides in the width direction toward the center in the width direction so that the center in the width direction is farther from the foot pattern 30 at the center, for example. Moreover, the shape of the back surface 42B may preferably be a parabolic shape of which focal point is a target position P (point in the given area TA) on which the conductive adhesive 18 is intended to be concentrated. This allows the conductive adhesive 18 which contacts the wall part 66 from the front surface to be effectively concentrated on the given area TA.
The following method may be employed to determine a specific shape of the back surface 42B.
Firstly, a depth L1 is determined in a portion at an end portion in the width direction of the recess part 42, in other words, a portion where the recess part 42 has a shortest depth.
Next, within a range W1 in the width direction of the recess part 42, multiple flows (in the example illustrated in
A tangent line La is firstly drawn such that the flow a of the conductive adhesive 18 reflects from the back surface 42B, the conductive adhesive 18 after being reflected passes the target position P. Subsequently, a tangent line Lb is determined such that at an intersection point between the adjacent flow b and the tangent line La, the flow b reflects from a reflection position Ra of the back surface 42B and the conductive adhesive 18 after being reflected passes the target position P.
In addition, a tangent line Lc is determined such that at an intersection point between the adjacent flow c and the tangent line Lb, the flow c reflects from the back surface 42B and the conductive adhesive 18 after being reflected passes the target position P. The similar operation is repeated thereafter sequentially up to the flow i to determine the shape of the back surface 42B. In the example illustrated in
As illustrated in
In this case, tan θ=A/B
in other words, θ=tan−1(A/B) is obtained.
Moreover, y=(180−θ)/2 is obtained.
Accordingly, x=90−y=θ/2=tan−1(A/B)/2 is obtained.
In this manner, the slope angle x of the tangent line in the back surface 42B may be obtained.
The number of the recess parts 42 is not limited. For example, one recess part 42 may preferably be formed per one opening part 36. Further, when multiple recess parts 42 are formed for one opening part 36, multiple mounted parts 44 of the conductive adhesive 18 reflected from the recess part 42 are formed. In particular, the presence of the two recess parts 42, out of the multiple recess parts 42, which are opposed to each other with the foot pattern 30 interposed therebetween allows the continuous part 46 in which the mounted parts 44 are continuous with each other on the lead bonding part 38 to be formed. Further, the continuous part 46 may enhance the bonding strength between the lead bonding part 38 and the foot pattern 30.
The recess part 42 may preferably be formed on the inner wall 40 at short side 36S of the opening part 36. However, forming the recess part 42 on the inner wall at the long side 36L makes it easy to mount the conductive adhesive 18 on the lead bonding part 38 because of a short distance with the lead bonding part 38, in the plan view.
The opening part 36 is formed to have the depth D1 higher than the height T1 of the foot pattern 30 from the upper surface of the base material 28, as mentioned above, to allow a larger amount of the conductive adhesive 18 to be stored inside the opening part 36. This may contribute to a reliable formation of the mounted part 44.
The use of the conductive adhesive 18 mentioned above as a bonding material allows the foot pattern 30 and the lead bonding part 38 to be bonded, and the foot pattern 30 and the lead bonding part 38 to be conducted with the conductive adhesive 18.
Moreover, compared with the solder, a material having a desired viscosity may be used in the conductive adhesive 18 so as to be mounted on the lead bonding part 38 by waves generated due to the pushing pressure of the lead bonding part 38.
In the respective embodiments mentioned above, the electronic component 16 may include various kinds of semiconductor chips to be mounted on the base material 28. In addition, the electronic component 16 may be a connection component formed with an insertion-removal part 23. The insertion-removal part 23 is, for example, a terminal, a connector, or a slot for a card such as a memory card, or the like, for electrically connecting to an external member. Insertion or removal of an external apparatus into and from the insertion-removal part 23 in such a connection component may apply a stress between the lead bonding part 38 and the foot pattern 30 in some cases. In the embodiments mentioned above, the high bonding strength between the lead bonding part 38 and the foot pattern 30 may inhibit the electronic component 16 from being detached when such a stress is applied thereto.
All examples and conditional language recited herein are intended for pedagogical purposes to aid the reader in understanding the invention and the concepts contributed by the inventor to furthering the art, and are to be construed as being without limitation to such specifically recited examples and conditions, nor does the organization of such examples in the specification relate to a showing of the superiority and inferiority of the invention. Although the embodiments of the present invention have been described in detail, it should be understood that the various changes, substitutions, and alterations could be made hereto without departing from the spirit and scope of the invention.
| Number | Date | Country | Kind |
|---|---|---|---|
| 2014-110245 | May 2014 | JP | national |
