Patent Application
20110090647
1. Technical Field
The disclosure generally relates to printed circuit board assemblies, especially to a printed circuit board assembly having heat dissipating modules.
2. Description of Related Art
Electronic devices, such as central processing units (CPUs), in computers generate a lot of heat that can affect operation and may cause damages if the heat is not removed from the electronic devices efficiently.
Many aspects of the embodiments can be better understood with references to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the embodiments. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
The disclosure is illustrated by way of example and not by way of limitation in the figures of the accompanying drawings in which like references indicate similar elements. It should be noted that references to “an” or “one” embodiment in this disclosure are not necessarily to the same embodiment, and such references mean at least one.
Referring to
The first heat dissipating module 10 includes a fan 11 and a heat sink 12. The fan 11 is mounted at a top side of the heat sink 12. The heat sink 12 is disposed between the fan 11 and the printed circuit board 30. The fan 11 defines two through holes 111. The heat sink 12 includes a first base 121, a plurality of first fins 122, and two L-shaped first heat pipes 123. Each first heat pipe 123 includes a pipe body 1231 and an extending portion 1232 bent from the pipe body 1231. Pipe bodies 1231 of the two first heat pipes 123 are secured to the plurality of first fins 122.
The second heat dissipating module 20 includes a second base 21, a plurality of second fins 22, and a U-shaped second heat pipe 23 mounted on the second base 21. The second base 21 includes four securing portions 211. Each securing portion 211 defines an assembly hole 213. The extending portion 1232 of the first heat pipe 123 is secured to the second base 21 of the second heat dissipating module 20.
The printed circuit board 30 includes a first heat generating element 31 and a second heat generating element 32. In one embodiment, the first heat generating element 31 is a CPU, and the second heat generating element 32 is a north bridge chip. The printed circuit board 30 includes two protrusions 311. Each protrusion 311 defines a fastening hole 313 corresponding to the through hole 111 of the fan 11. The printed circuit board 30 defines four securing holes 321 corresponding to the assembly holes 213 of the second heat dissipating module 20.
Referring to
The first heat dissipating module 10 channels some of the heat generated by the first heat generating element 31 to the second heat dissipating module 20 via the extending portion 1232 of the first heat pipe 123 when the temperature of the first heat dissipating module 10 is higher than that of the second heat dissipating module 20.
It is to be understood, however, that even though numerous characteristics and advantages have been set forth in the foregoing description of preferred embodiments, together with details of the structures and functions of the preferred embodiments, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the disclosure to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
| Number | Date | Country | Kind |
|---|---|---|---|
| 200920312976.7 | Oct 2009 | CN | national |
