Printhead nozzle arrangement having interleaved heater elements

Information

  • Patent Grant
  • 7997687
  • Patent Number
    7,997,687
  • Date Filed
    Monday, May 3, 2010
    14 years ago
  • Date Issued
    Tuesday, August 16, 2011
    13 years ago
Abstract
A printhead nozzle arrangement is provided having a wafer defining a chamber for holding ejection fluid, an ejection port supported by a plurality of bridge members which extend from the ejection port to sides of the chamber, and a plurality of heater elements interleaved between the bridge members for causing ejection of fluid held in the chamber through the ejection port.
Description

The following Australian provisional patent applications are hereby incorporated by cross-reference. For the purposes of location and identification, US patents/patent applications identified by their US patent/patent application serial numbers are listed alongside the Australian applications from which the US patents/patent applications claim the right of priority.
















CROSS-REFERENCED
U.S. Pat. No./patent application



AUSTRALIAN
(CLAIMING RIGHT OF PRIORITY



PROVISIONAL PATENT
FROM AUSTRALIAN



APPLICATION NO.
PROVISIONAL APPLICATION)









PO7991
6,750,901



PO8505
6,476,863



PO7988
6,788,336



PO9395
6,322,181



PO8017
6,597,817



PO8014
6,227,648



PO8025
6,727,948



PO8032
6,690,419



PO7999
6,727,951



PO8030
6,196,541



PO7997
6,195,150



PO7979
6,362,868



PO7978
6,831,681



PO7982
6,431,669



PO7989
6,362,869



PO8019
6,472,052



PO7980
6,356,715



PO8018
6,894,694



PO7938
6,636,216



PO8016
6,366,693



PO8024
6,329,990



PO7939
6,459,495



PO8501
6,137,500



PO8500
6,690,416



PO7987
7,050,143



PO8022
6,398,328



PO8497
7,110,024



PO8020
6,431,704



PO8504
6,879,341



PO8000
6,415,054



PO7934
6,665,454



PO7990
6,542,645



PO8499
6,486,886



PO8502
6,381,361



PO7981
6,317,192



PO7986
6,850,274



PO8026
6,646,757



PO8028
6,624,848



PO9394
6,357,135



PO9397
6,271,931



PO9398
6,353,772



PO9399
6,106,147



PO9400
6,665,008



PO9401
6,304,291



PO9403
6,305,770



PO9405
6,289,262



PP0959
6,315,200



PP1397
6,217,165



PP2370
6,786,420



PO8003
6,350,023



PO8005
6,318,849



PO8066
6,227,652



PO8072
6,213,588



PO8040
6,213,589



PO8071
6,231,163



PO8047
6,247,795



PO8035
6,394,581



PO8044
6,244,691



PO8063
6,257,704



PO8057
6,416,168



PO8056
6,220,694



PO8069
6,257,705



PO8049
6,247,794



PO8036
6,234,610



PO8048
6,247,793



PO8070
6,264,306



PO8067
6,241,342



PO8001
6,247,792



PO8038
6,264,307



PO8033
6,254,220



PO8002
6,234,611



PO8068
6,302,528



PO8062
6,283,582



PO8034
6,239,821



PO8039
6,338,547



PO8041
6,247,796



PO8004
6,557,977



PO8037
6,390,603



PO8043
6,362,843



PO8042
6,293,653



PO8064
6,312,107



PO9389
6,227,653



PO9391
6,234,609



PP0888
6,238,040



PP0891
6,188,415



PP0890
6,227,654



PP0873
6,209,989



PP0993
6,247,791



PP0890
6,336,710



PP1398
6,217,153



PP2592
6,416,167



PP2593
6,243,113



PP3991
6,283,581



PP3987
6,247,790



PP3985
6,260,953



PP3983
6,267,469



PO7935
6,224,780



PO7936
6,235,212



PO7937
6,280,643



PO8061
6,284,147



PO8054
6,214,244



PO8065
6,071,750



PO8055
6,267,905



PO8053
6,251,298



PO8078
6,258,285



PO7933
6,225,138



PO7950
6,241,904



PO7949
6,299,786



PO8060
6,866,789



PO8059
6,231,773



PO8073
6,190,931



PO8076
6,248,249



PO8075
6,290,862



PO8079
6,241,906



PO8050
6,565,762



PO8052
6,241,905



PO7948
6,451,216



PO7951
6,231,772



PO8074
6,274,056



PO7941
6,290,861



PO8077
6,248,248



PO8058
6,306,671



PO8051
6,331,258



PO8045
6,110,754



PO7952
6,294,101



PO8046
6,416,679



PO9390
6,264,849



PO9392
6,254,793



PP0889
6,235,211



PP0887
6,491,833



PP0882
6,264,850



PP0874
6,258,284



PP1396
6,312,615



PP3989
6,228,668



PP2591
6,180,427



PP3990
6,171,875



PP3986
6,267,904



PP3984
6,245,247



PP3982
6,315,914



PP0895
6,231,148



PP0869
6,293,658



PP0887
6,614,560



PP0885
6,238,033



PP0884
6,312,070



PP0886
6,238,111



PP0877
6,378,970



PP0878
6,196,739



PP0883
6,270,182



PP0880
6,152,619



PO8006
6,087,638



PO8007
6,340,222



PO8010
6,041,600



PO8011
6,299,300



PO7947
6,067,797



PO7944
6,286,935



PO7946
6,044,646



PP0894
6,382,769










STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT

Not applicable.


FIELD OF THE INVENTION

The present invention relates to the field of fluid ejection and, in particular, discloses a fluid ejection chip.


BACKGROUND OF THE INVENTION

Many different types of printing mechanisms have been invented, a large number of which are presently in use. The known forms of printers have a variety of methods for marking the print media with a relevant marking media. Commonly used forms of printing include offset printing, laser printing and copying devices, dot matrix type impact printers, thermal paper printers, film recorders, thermal wax printers, dye sublimation printers and ink jet printers both of the drop on demand and continuous flow type. Each type of printer has its own advantages and problems when considering cost, speed, quality, reliability, simplicity of construction and operation etc.


In recent years the field of ink jet printing, wherein each individual pixel of ink is derived from one or more ink nozzles, has become increasingly popular primarily due to its inexpensive and versatile nature.


Many different techniques of ink jet printing have been invented. For a survey of the field, reference is made to an article by J Moore, “Non-Impact Printing: Introduction and Historical Perspective”, Output Hard Copy Devices, Editors R Dubeck and S Sherr, pages 207-220 (1988).


Ink Jet printers themselves come in many different forms. The utilization of a continuous stream of ink in ink jet printing appears to date back to at least 1929 wherein U.S. Pat. No. 1,941,001 by Hansell discloses a simple form of continuous stream electro-static ink jet printing.


U.S. Pat. No. 3,596,275 by Sweet also discloses a process of a continuous ink jet printing including a step wherein the ink jet stream is modulated by a high frequency electro-static field so as to cause drop separation. This technique is still utilized by several manufacturers including Elmjet and Scitex (see also U.S. Pat. No. 3,373,437 by Sweet et al).


Piezoelectric ink jet printers are also one form of commonly utilized ink jet printing device. Piezoelectric systems are disclosed by Kyser et. al. in U.S. Pat. No. 3,946,398 (1970) which utilizes a diaphragm mode of operation, by Zolten in U.S. Pat. No. 3,683,212 (1970) which discloses a squeeze mode form of operation of a piezoelectric crystal, Stemme in U.S. Pat. No. 3,747,120 (1972) which discloses a bend mode of piezoelectric operation, Howkins in U.S. Pat. No. 4,459,601 which discloses a piezoelectric push mode actuation of the ink jet stream and Fischbeck in U.S. Pat. No. 4,584,590 which discloses a shear mode type of piezoelectric transducer element.


Recently, thermal ink jet printing has become an extremely popular form of ink jet printing. The ink jet printing techniques include those disclosed by Endo et al in GB 2007162 (1979) and Vaught et al in U.S. Pat. No. 4,490,728. Both the aforementioned references disclose ink jet printing techniques which rely on the activation of an electrothermal actuator which results in the creation of a bubble in a constricted space, such as a nozzle, which thereby causes the ejection of ink from an aperture connected to the confined space onto a relevant print media. Manufacturers such as Canon and Hewlett Packard manufacture printing devices utilizing the electro-thermal actuator.


As can be seen from the foregoing, many different types of printing technologies are available. Ideally, a printing technology should have a number of desirable attributes. These include inexpensive construction and operation, high-speed operation, safe and continuous long-term operation etc. Each technology may have its own advantages and disadvantages in the areas of cost, speed, quality, reliability, power usage, simplicity of construction and operation, durability and consumables.


Applicant has developed a substantial amount of technology in the field of micro-electromechanical inkjet printing. The parent application is indeed directed to a particular aspect in this field. In this application, the Applicant has applied the technology to the more general field of fluid ejection.


SUMMARY OF THE INVENTION

In accordance with a first aspect of the present invention, there is provided a nozzle arrangement for an ink jet printhead, the arrangement comprising a nozzle chamber defined in a wafer substrate for the storage of ink to be ejected; an ink ejection port having a rim formed on one wall of the chamber; and a series of actuators attached to the wafer substrate, and forming a portion of the wall of the nozzle chamber adjacent the rim, the actuator paddles further being actuated in unison so as to eject ink from the nozzle chamber via the ink ejection nozzle.


The actuators can include a surface which bends inwards away from the center of the nozzle chamber upon actuation. The actuators are preferably actuated by means of a thermal actuator device. The thermal actuator device may comprise a conductive resistive heating element encased within a material having a high coefficient of thermal expansion. The element can be serpentine to allow for substantially unhindered expansion of the material. The actuators are preferably arranged radially around the nozzle rim.


The actuators can form a membrane between the nozzle chamber and an external atmosphere of the arrangement and the actuators bend away from the external atmosphere to cause an increase in pressure within the nozzle chamber thereby initiating a consequential ejection of ink from the nozzle chamber. The actuators can bend away from a central axis of the nozzle chamber.


The nozzle arrangement can be formed on the wafer substrate utilizing micro-electro mechanical techniques and further can comprise an ink supply channel in communication with the nozzle chamber. The ink supply channel may be etched through the wafer. The nozzle arrangement may include a series of struts which support the nozzle rim.


The arrangement can be formed adjacent to neighbouring arrangements so as to form a pagewidth printhead.


In this application, the invention extends to a fluid ejection chip that comprises


a substrate; and


a plurality of nozzle arrangements positioned on the substrate, each nozzle arrangement comprising

    • a nozzle chamber defining structure which defines a nozzle chamber and which includes a wall in which a fluid ejection port is defined; and
    • at least one actuator for ejecting fluid from the nozzle chamber through the fluid ejection port, the, or each, actuator being displaceable with respect to the substrate on receipt of an electrical signal, wherein
    • the, or each, actuator is formed in said wall of the nozzle chamber defining structure, so that displacement of the, or each, actuator results in a change in volume of the nozzle chamber so that fluid is ejected from the fluid ejection port.


Each nozzle arrangement may include a plurality of actuators, each actuator including an actuating portion and a paddle positioned on the actuating portion, the actuating portion being anchored to the substrate and being displaceable on receipt of an electrical signal to displace the paddle, in turn, the paddles and the wall being substantially coplanar and the actuating portions being configured so that, upon receipt of said electrical signal, the actuating portions displace the paddles into the nozzle chamber to reduce a volume of the nozzle chamber, thereby ejecting fluid from the fluid ejection port.


A periphery of each paddle may be shaped to define a fluidic seal when the nozzle chamber is filled with fluid.





BRIEF DESCRIPTION OF THE DRAWINGS

Notwithstanding any other forms which may fall within the scope of the present invention, preferred forms of the invention will now be described, by way of example only, with reference to the accompanying drawings in which:



FIGS. 1-3 are schematic sectional views illustrating the operational principles of the preferred embodiment;



FIG. 4(
a) and FIG. 4(b) are again schematic sections illustrating the operational principles of the thermal actuator device;



FIG. 5 is a side perspective view, partly in section, of a single nozzle arrangement constructed in accordance with the preferred embodiments;



FIGS. 6-13 are side perspective views, partly in section, illustrating the manufacturing steps of the preferred embodiments;



FIG. 14 illustrates an array of ink jet nozzles formed in accordance with the manufacturing procedures of the preferred embodiment;



FIG. 15 provides a legend of the materials indicated in FIGS. 16 to 23; and



FIG. 16 to FIG. 23 illustrate sectional views of the manufacturing steps in one form of construction of a nozzle arrangement in accordance with the invention.





DESCRIPTION OF PREFERRED AND OTHER EMBODIMENTS

In the following description, reference is made to the ejection of ink for application to ink jet printing. However, it will readily be appreciated that the present application can be applied to any situation where fluid ejection is required.


In the preferred embodiment, ink is ejected out of a nozzle chamber via an ink ejection port using a series of radially positioned thermal actuator devices that are arranged about the ink ejection port and are activated to pressurize the ink within the nozzle chamber thereby causing the ejection of ink through the ejection port.


Turning now to FIGS. 1, 2 and 3, there is illustrated the basic operational principles of the preferred embodiment. FIG. 1 illustrates a single nozzle arrangement 1 in its quiescent state. The arrangement 1 includes a nozzle chamber 2 which is normally filled with ink so as to form a meniscus 3 in an ink ejection port 4. The nozzle chamber 2 is formed within a wafer 5. The nozzle chamber 2 is supplied with ink via an ink supply channel 6 which is etched through the wafer 5 with a highly isotropic plasma etching system. A suitable etcher can be the Advance Silicon Etch (ASE) system available from Surface Technology Systems of the United Kingdom.


A top of the nozzle arrangement 1 includes a series of radially positioned actuators 8, 9. These actuators comprise a polytetrafluoroethylene (PTFE) layer and an internal serpentine copper core 17. Upon heating of the copper core 17, the surrounding PTFE expands rapidly resulting in a generally downward movement of the actuators 8, 9. Hence, when it is desired to eject ink from the ink ejection port 4, a current is passed through the actuators 8, 9 which results in them bending generally downwards as illustrated in FIG. 2. The downward bending movement of the actuators 8, 9 results in a substantial increase in pressure within the nozzle chamber 2. The increase in pressure in the nozzle chamber 2 results in an expansion of the meniscus 3 as illustrated in FIG. 2.


The actuators 8, 9 are activated only briefly and subsequently deactivated. Consequently, the situation is as illustrated in FIG. 3 with the actuators 8, 9 returning to their original positions. This results in a general inflow of ink back into the nozzle chamber 2 and a necking and breaking of the meniscus 3 resulting in the ejection of a drop 12. The necking and breaking of the meniscus 3 is a consequence of the forward momentum of the ink associated with drop 12 and the backward pressure experienced as a result of the return of the actuators 8, 9 to their original positions. The return of the actuators 8,9 also results in a general inflow of ink from the channel 6 as a result of surface tension effects and, eventually, the state returns to the quiescent position as illustrated in FIG. 1.



FIGS. 4(
a) and 4(b) illustrate the principle of operation of the thermal actuator. The thermal actuator is preferably constructed from a material 14 having a high coefficient of thermal expansion. Embedded within the material 14 are a series of heater elements 15 which can be a series of conductive elements designed to carry a current. The conductive elements 15 are heated by passing a current through the elements 15 with the heating resulting in a general increase in temperature in the area around the heating elements 15. The position of the elements 15 is such that uneven heating of the material 14 occurs. The uneven increase in temperature causes a corresponding uneven expansion of the material 14. Hence, as illustrated in FIG. 4(b), the PTFE is bent generally in the direction shown.


In FIG. 5, there is illustrated a side perspective view of one embodiment of a nozzle arrangement constructed in accordance with the principles previously outlined. The nozzle chamber 2 is formed with an isotropic surface etch of the wafer 5. The wafer 5 can include a CMOS layer including all the required power and drive circuits. Further, the actuators 8, 9 each have a leaf or petal formation which extends towards a nozzle rim 28 defining the ejection port 4. The normally inner end of each leaf or petal formation is displaceable with respect to the nozzle rim 28. Each activator 8, 9 has an internal copper core 17 defining the element 15. The core 17 winds in a serpentine manner to provide for substantially unhindered expansion of the actuators 8, 9. The operation of the actuators 8, 9 is as illustrated in FIG. 4(a) and FIG. 4(b) such that, upon activation, the actuators 8 bend as previously described resulting in a displacement of each petal formation away from the nozzle rim 28 and into the nozzle chamber 2. The ink supply channel 6 can be created via a deep silicon back edge of the wafer 5 utilizing a plasma etcher or the like. The copper or aluminum core 17 can provide a complete circuit. A central arm 18 which can include both metal and PTFE portions provides the main structural support for the actuators 8, 9.


Turning now to FIG. 6 to FIG. 13, one form of manufacture of the nozzle arrangement 1 in accordance with the principles of the preferred embodiment is shown. The nozzle arrangement 1 is preferably manufactured using micro-electromechanical (MEMS) techniques and can include the following construction techniques:


As shown initially in FIG. 6, the initial processing starting material is a standard semi-conductor wafer 20 having a complete CMOS level 21 to a first level of metal. The first level of metal includes portions 22 which are utilized for providing power to the thermal actuators 8, 9.


The first step, as illustrated in FIG. 7, is to etch a nozzle region down to the silicon wafer 20 utilizing an appropriate mask.


Next, as illustrated in FIG. 8, a 2 μm layer of polytetrafluoroethylene (PTFE) is deposited and etched so as to define vias 24 for interconnecting multiple levels.


Next, as illustrated in FIG. 9, the second level metal layer is deposited, masked and etched to define a heater structure 25. The heater structure 25 includes via 26 interconnected with a lower aluminum layer.


Next, as illustrated in FIG. 10, a further 2 μm layer of PTFE is deposited and etched to the depth of 1 μm utilizing a nozzle rim mask to define the nozzle rim 28 in addition to ink flow guide rails 29 which generally restrain any wicking along the surface of the PTFE layer. The guide rails 29 surround small thin slots and, as such, surface tension effects are a lot higher around these slots which in turn results in minimal outflow of ink during operation.


Next, as illustrated in FIG. 11, the PTFE is etched utilizing a nozzle and actuator mask to define a port portion 30 and slots 31 and 32.


Next, as illustrated in FIG. 12, the wafer is crystallographically etched on a <111> plane utilizing a standard crystallographic etchant such as KOH. The etching forms a chamber 33, directly below the port portion 30.


In FIG. 13, the ink supply channel 34 can be etched from the back of the wafer utilizing a highly anisotropic etcher such as the STS etcher from Silicon Technology Systems of United Kingdom. An array of ink jet nozzles can be formed simultaneously with a portion of an array 36 being illustrated in FIG. 14. A portion of the printhead is formed simultaneously and diced by the STS etching process. The array 36 shown provides for four column printing with each separate column attached to a different color ink supply channel being supplied from the back of the wafer. Bond pads 37 provide for electrical control of the ejection mechanism.


In this manner, large pagewidth printheads can be fabricated so as to provide for a drop-on-demand ink ejection mechanism.


One form of detailed manufacturing process which can be used to fabricate monolithic ink jet printheads operating in accordance with the principles taught by the present embodiment can proceed utilizing the following steps:


1. Using a double-sided polished wafer 60, complete a 0.5 micron, one poly, 2 metal CMOS process 61. This step is shown in FIG. 16. For clarity, these diagrams may not be to scale, and may not represent a cross section though any single plane of the nozzle. FIG. 15 is a key to representations of various materials in these manufacturing diagrams, and those of other cross-referenced ink jet configurations.


2. Etch the CMOS oxide layers down to silicon or second level metal using Mask 1. This mask defines the nozzle cavity and the edge of the chips. This step is shown in FIG. 16.


3. Deposit a thin layer (not shown) of a hydrophilic polymer, and treat the surface of this polymer for PTFE adherence.


4. Deposit 1.5 microns of polytetrafluoroethylene (PTFE) 62.


5. Etch the PTFE and CMOS oxide layers to second level metal using Mask 2. This mask defines the contact vias for the heater electrodes. This step is shown in FIG. 17.


6. Deposit and pattern 0.5 microns of gold 63 using a lift-off process using Mask 3. This mask defines the heater pattern. This step is shown in FIG. 18.


7. Deposit 1.5 microns of PTFE 64.


8. Etch 1 micron of PTFE using Mask 4. This mask defines the nozzle rim 65 and the rim at the edge 66 of the nozzle chamber. This step is shown in FIG. 19.


9. Etch both layers of PTFE and the thin hydrophilic layer down to silicon using Mask 5. This mask defines a gap 67 at inner edges of the actuators, and the edge of the chips. It also forms the mask for a subsequent crystallographic etch. This step is shown in FIG. 20.


10. Crystallographically etch the exposed silicon using KOH. This etch stops on <111> crystallographic planes 68, forming an inverted square pyramid with sidewall angles of 54.74 degrees. This step is shown in FIG. 21.


11. Back-etch through the silicon wafer (with, for example, an ASE Advanced Silicon Etcher from Surface Technology Systems) using Mask 6. This mask defines the ink inlets 69 which are etched through the wafer. The wafer is also diced by this etch. This step is shown in FIG. 22.


12. Mount the printheads in their packaging, which may be a molded plastic former incorporating ink channels which supply the appropriate color ink to the ink inlets 69 at the back of the wafer.


13. Connect the printheads to their interconnect systems. For a low profile connection with minimum disruption of airflow, TAB may be used. Wire bonding may also be used if the printer is to be operated with sufficient clearance to the paper.


14. Fill the completed print heads with ink 70 and test them. A filled nozzle is shown in FIG. 23.


The presently disclosed ink jet printing technology is potentially suited to a wide range of printing systems including: color and monochrome office printers, short run digital printers, high speed digital printers, offset press supplemental printers, low cost scanning printers high speed pagewidth printers, notebook computers with inbuilt pagewidth printers, portable color and monochrome printers, color and monochrome copiers, color and monochrome facsimile machines, combined printer, facsimile and copying machines, label printers, large format plotters, photograph copiers, printers for digital photographic “minilabs”, video printers, PHOTO CD (PHOTO CD is a registered trade mark of the Eastman Kodak Company) printers, portable printers for PDAs, wallpaper printers, indoor sign printers, billboard printers, fabric printers, camera printers and fault tolerant commercial printer arrays.


It would be appreciated by a person skilled in the art that numerous variations and/or modifications may be made to the present invention as shown in the specific embodiments without departing from the spirit or scope of the invention as broadly described. The present embodiments are, therefore, to be considered in all respects to be illustrative and not restrictive.


Ink Jet Technologies


The embodiments of the invention use an ink jet printer type device. Of course many different devices could be used. However, presently popular ink jet printing technologies are unlikely to be suitable.


The most significant problem with thermal ink jet is power consumption. This is approximately 100 times that required for high speed, and stems from the energy-inefficient means of drop ejection. This involves the rapid boiling of water to produce a vapor bubble which expels the ink. Water has a very high heat capacity, and must be superheated in thermal ink jet applications. This leads to an efficiency of around 0.02%, from electricity input to drop momentum (and increased surface area) out.


The most significant problem with piezoelectric ink jet is size and cost. Piezoelectric crystals have a very small deflection at reasonable drive voltages, and therefore require a large area for each nozzle. Also, each piezoelectric actuator must be connected to its drive circuit on a separate substrate. This is not a significant problem at the current limit of around 300 nozzles per printhead, but is a major impediment to the fabrication of pagewidth printheads with 19,200 nozzles.


Ideally, the ink jet technologies used meet the stringent requirements of in-camera digital color printing and other high quality, high speed, low cost printing applications. To meet the requirements of digital photography, new ink jet technologies have been created. The target features include:


low power (less than 10 Watts)


High-resolution capability (1,600 dpi or more)


photographic quality output


low manufacturing cost


small size (pagewidth times minimum cross section)


high speed (<2 seconds per page).


All of these features can be met or exceeded by the ink jet systems described below with differing levels of difficulty. Forty-five different ink jet technologies have been developed by the Assignee to give a wide range of choices for high volume manufacture. These technologies form part of separate applications assigned to the present Assignee as set out in the table below under the heading Cross References to Related Applications.


The ink jet designs shown here are suitable for a wide range of digital printing systems, from battery powered one-time use digital cameras, through to desktop and network printers, and through to commercial printing systems.


For ease of manufacture using standard process equipment, the printhead is designed to be a monolithic 0.5-micron CMOS chip with MEMS post processing. For color photographic applications, the printhead is 100 mm long, with a width which depends upon the ink jet type. The smallest printhead designed is IJ38, which is 0.35 mm wide, giving a chip area of 35 square mm. The printheads each contain 19,200 nozzles plus data and control circuitry.


Ink is supplied to the back of the printhead by injection molded plastic ink channels. The molding requires 50 micron features, which can be created using a lithographically micromachined insert in a standard injection molding tool. Ink flows through holes etched through the wafer to the nozzle chambers fabricated on the front surface of the wafer. The printhead is connected to the camera circuitry by tape automated bonding.


Tables of Drop-on-Demand Ink Jets


Eleven important characteristics of the fundamental operation of individual ink jet nozzles have been identified. These characteristics are largely orthogonal, and so can be elucidated as an eleven dimensional matrix. Most of the eleven axes of this matrix include entries developed by the present assignee.


The following tables form the axes of an eleven dimensional table of ink jet types.


Actuator mechanism (18 types)


Basic operation mode (7 types)


Auxiliary mechanism (8 types)


Actuator amplification or modification method (17 types)


Actuator motion (19 types)


Nozzle refill method (4 types)


Method of restricting back-flow through inlet (10 types)


Nozzle clearing method (9 types)


Nozzle plate construction (9 types)


Drop ejection direction (5 types)


Ink type (7 types)


The complete eleven dimensional table represented by these axes contains 36.9 billion possible configurations of ink jet nozzle. While not all of the possible combinations result in a viable ink jet technology, many million configurations are viable. It is clearly impractical to elucidate all of the possible configurations. Instead, certain ink jet types have been investigated in detail. These are designated IJ01 to IJ45 above which matches the docket numbers in the table under the heading Cross References to Related Applications.


Other ink jet configurations can readily be derived from these forty-five examples by substituting alternative configurations along one or more of the 11 axes. Most of the IJ01 to IJ45 examples can be made into ink jet printheads with characteristics superior to any currently available ink jet technology.


Where there are prior art examples known to the inventor, one or more of these examples are listed in the examples column of the tables below. The IJ01 to IJ45 series are also listed in the examples column. In some cases, print technology may be listed more than once in a table, where it shares characteristics with more than one entry.


Suitable applications for the ink jet technologies include: Home printers, Office network printers, Short run digital printers, Commercial print systems, Fabric printers, Pocket printers, Internet WWW printers, Video printers, Medical imaging, Wide format printers, Notebook PC printers, Fax machines, Industrial printing systems, Photocopiers, Photographic minilabs etc.


The information associated with the aforementioned 11 dimensional matrix is set out in the following tables.












ACTUATOR MECHANISM (APPLIED ONLY TO SELECTED INK DROPS)












Description
Advantages
Disadvantages
Examples





Thermal
An electrothermal
Large
High
Canon


bubble
heater heats the
force generated
power
Bubblejet 1979



ink to above
Simple
Ink carrier
Endo et al GB



boiling point,
construction
limited to water
patent 2,007,162



transferring
No
Low
Xerox



significant heat to
moving parts
efficiency
heater-in-pit



the aqueous ink. A
Fast
High
1990 Hawkins et



bubble nucleates
operation
temperatures
al U.S. Pat. No.



and quickly forms,
Small chip
required
4,899,181



expelling the ink.
area required for
High
Hewlett-



The efficiency of
actuator
mechanical
Packard TIJ



the process is low,

stress
1982 Vaught et



with typically less

Unusual
al U.S. Pat. No.



than 0.05% of the

materials
4,490,728



electrical energy

required




being transformed

Large




into kinetic energy

drive transistors




of the drop.

Cavitation






causes actuator






failure






Kogation






reduces bubble






formation






Large






print heads are






difficult to






fabricate



Piezo-
A piezoelectric
Low
Very large
Kyser et al


electric
crystal such as
power
area required for
U.S. Pat. No. 3,946,398



lead lanthanum
consumption
actuator
Zoltan



zirconate (PZT) is
Many ink
Difficult
U.S. Pat. No. 3,683,212



electrically
types can be
to integrate with
1973



activated, and
used
electronics
Stemme U.S. Pat. No.



either expands,
Fast
High
3,747,120



shears, or bends to
operation
voltage drive
Epson



apply pressure to
High
transistors
Stylus



the ink, ejecting
efficiency
required
Tektronix



drops.

Full
IJ04





pagewidth print






heads






impractical due






to actuator size






Requires






electrical poling






in high field






strengths during






manufacture



Electro-
An electric field is
Low
Low
Seiko


strictive
used to activate
power
maximum strain
Epson, Usui et



electrostriction in
consumption
(approx. 0.01%)
all JP 253401/96



relaxor materials
Many ink
Large area
IJ04



such as lead
types can be
required for




lanthanum
used
actuator due to




zirconate titanate
Low
low strain




(PLZT) or lead
thermal
Response




magnesium
expansion
speed is




niobate (PMN).
Electric
marginal (~10 μs)





field strength
High





required
voltage drive





(approx. 3.5 V/μm)
transistors





can be
required





generated
Full





without
pagewidth print





difficulty
heads





Does not
impractical due





require electrical
to actuator size





poling




Ferro-
An electric field is
Low
Difficult
IJ04


electric
used to induce a
power
to integrate with




phase transition
consumption
electronics




between the
Many ink
Unusual




antiferroelectric
types can be
materials such as




(AFE) and
used
PLZSnT are




ferroelectric (FE)
Fast
required




phase. Perovskite
operation (<1 μs)
Actuators




materials such as
Relatively
require a large




tin modified lead
high longitudinal
area




lanthanum
strain





zirconate titanate
High





(PLZSnT) exhibit
efficiency





large strains of up
Electric





to 1% associated
field strength of





with the AFE to
around 3 V/μm





FE phase
can be readily





transition.
provided




Electro-
Conductive plates
Low
Difficult
IJ02, IJ04


static
are separated by a
power
to operate



plates
compressible or
consumption
electrostatic




fluid dielectric
Many ink
devices in an




(usually air). Upon
types can be
aqueous




application of a
used
environment




voltage, the plates
Fast
The




attract each other
operation
electrostatic




and displace ink,

actuator will




causing drop

normally need to




ejection. The

be separated




conductive plates

from the ink




may be in a comb

Very large




or honeycomb

area required to




structure, or

achieve high




stacked to increase

forces




the surface area

High




and therefore the

voltage drive




force.

transistors may






be required






Full






pagewidth print






heads are not






competitive due






to actuator size



Electro-
A strong electric
Low
High
1989 Saito


static pull
field is applied to
current
voltage required
et al, U.S. Pat. No.


on ink
the ink, whereupon
consumption
May be
4,799,068



electrostatic
Low
damaged by
1989



attraction
temperature
sparks due to air
Miura et al, U.S. Pat. No.



accelerates the ink

breakdown
4,810,954



towards the print

Required
Tone-jet



medium.

field strength






increases as the






drop size






decreases






High






voltage drive






transistors






required






Electrostatic






field attracts






dust



Permanent
An electromagnet
Low
Complex
IJ07, IJ10


magnet
directly attracts a
power
fabrication



electro-
permanent magnet,
consumption
Permanent



magnetic
displacing ink and
Many ink
magnetic




causing drop
types can be
material such as




ejection. Rare
used
Neodymium Iron




earth magnets with
Fast
Boron (NdFeB)




a field strength
operation
required.




around 1 Tesla can
High
High local




be used. Examples
efficiency
currents required




are: Samarium
Easy
Copper




Cobalt (SaCo) and
extension from
metalization




magnetic materials
single nozzles to
should be used




in the neodymium
pagewidth print
for long




iron boron family
heads
electromigration




(NdFeB,

lifetime and low




NdDyFeBNb,

resistivity




NdDyFeB, etc)

Pigmented






inks are usually






infeasible






Operating






temperature






limited to the






Curie






temperature






(around 540 K)



Soft
A solenoid
Low
Complex
IJ01, IJ05,


magnetic
induced a
power
fabrication
IJ08, IJ10, IJ12,


core
magnetic field in a
consumption
Materials
IJ14, IJ15, IJ17


electro-
soft magnetic core
Many ink
not usually



magnetic
or yoke fabricated
types can be
present in a




from a ferrous
used
CMOS fab such




material such as
Fast
as NiFe,




electroplated iron
operation
CoNiFe, or CoFe




alloys such as
High
are required




CoNiFe [1], CoFe,
efficiency
High local




or NiFe alloys.
Easy
currents required




Typically, the soft
extension from
Copper




magnetic material
single nozzles to
metalization




is in two parts,
pagewidth print
should be used




which are
heads
for long




normally held

electromigration




apart by a spring.

lifetime and low




When the solenoid

resistivity




is actuated, the two

Electroplating




parts attract,

is required




displacing the ink.

High






saturation flux






density is






required (2.0-2.1






T is achievable






with CoNiFe






[1])



Lorenz
The Lorenz force
Low
Force acts
IJ06, IJ11,


force
acting on a current
power
as a twisting
IJ13, IJ16



carrying wire in a
consumption
motion




magnetic field is
Many ink
Typically,




utilized.
types can be
only a quarter of




This allows the
used
the solenoid




magnetic field to
Fast
length provides




be supplied
operation
force in a useful




externally to the
High
direction




print head, for
efficiency
High local




example with rare
Easy
currents required




earth permanent
extension from
Copper




magnets.
single nozzles to
metalization




Only the current
pagewidth print
should be used




carrying wire need
heads
for long




be fabricated on

electromigration




the print head,

lifetime and low




simplifying

resistivity




materials

Pigmented




requirements.

inks are usually






infeasible



Magneto-
The actuator uses
Many ink
Force acts
Fischenbeck,


striction
the giant
types can be
as a twisting
U.S. Pat. No.



magnetostrictive
used
motion
4,032,929



effect of materials
Fast
Unusual
IJ25



such as Terfenol-D
operation
materials such as




(an alloy of
Easy
Terfenol-D are




terbium,
extension from
required




dysprosium and
single nozzles to
High local




iron developed at
pagewidth print
currents required




the Naval
heads
Copper




Ordnance
High force
metalization




Laboratory, hence
is available
should be used




Ter-Fe-NOL). For

for long




best efficiency, the

electromigration




actuator should be

lifetime and low




pre-stressed to

resistivity




approx. 8 MPa.

Pre-






stressing may be






required



Surface
Ink under positive
Low
Requires
Silverbrook,


tension
pressure is held in
power
supplementary
EP 0771 658


reduction
a nozzle by surface
consumption
force to effect
A2 and related



tension. The
Simple
drop separation
patent



surface tension of
construction
Requires
applications



the ink is reduced
No
special ink




below the bubble
unusual
surfactants




threshold, causing
materials
Speed may




the ink to egress
required in
be limited by




from the nozzle.
fabrication
surfactant





High
properties





efficiency






Easy






extension from






single nozzles to






pagewidth print






heads




Viscosity
The ink viscosity
Simple
Requires
Silverbrook,


reduction
is locally reduced
construction
supplementary
EP 0771 658



to select which
No
force to effect
A2 and related



drops are to be
unusual
drop separation
patent



ejected. A
materials
Requires
applications



viscosity reduction
required in
special ink




can be achieved
fabrication
viscosity




electrothermally
Easy
properties




with most inks, but
extension from
High




special inks can be
single nozzles to
speed is difficult




engineered for a
pagewidth print
to achieve




100:1 viscosity
heads
Requires




reduction.

oscillating ink






pressure






A high






temperature






difference






(typically 80






degrees) is






required



Acoustic
An acoustic wave
Can
Complex
1993



is generated and
operate without
drive circuitry
Hadimioglu et



focussed upon the
a nozzle plate
Complex
al, EUP 550,192



drop ejection

fabrication
1993



region.

Low
Elrod et al, EUP





efficiency
572,220





Poor






control of drop






position






Poor






control of drop






volume



Thermo-
An actuator which
Low
Efficient
IJ03, IJ09,


elastic
relies upon
power
aqueous
IJ17, IJ18, IJ19,


bend
differential
consumption
operation
IJ20, IJ21, IJ22,


actuator
thermal expansion
Many ink
requires a
IJ23, IJ24, IJ27,



upon Joule heating
types can be
thermal insulator
IJ28, IJ29, IJ30,



is used.
used
on the hot side
IJ31, IJ32, IJ33,




Simple
Corrosion
IJ34, IJ35, IJ36,




planar
prevention can
IJ37, IJ38, IJ39,




fabrication
be difficult
IJ40, IJ41




Small chip
Pigmented





area required for
inks may be





each actuator
infeasible, as





Fast
pigment particles





operation
may jam the





High
bend actuator





efficiency






CMOS






compatible






voltages and






currents






Standard






MEMS






processes can be






used






Easy






extension from






single nozzles to






pagewidth print






heads




High CTE
A material with a
High force
Requires
IJ09, IJ17,


thermo-
very high
can be generated
special material
IJ18, IJ20, IJ21,


elastic
coefficient of
Three
(e.g. PTFE)
IJ22, IJ23, IJ24,


actuator
thermal expansion
methods of
Requires a
IJ27, IJ28, IJ29,



(CTE) such as
PTFE deposition
PTFE deposition
IJ30, IJ31, IJ42,



polytetrafluoroethylene
are under
process, which is
IJ43, IJ44



(PTFE) is
development:
not yet standard




used. As high CTE
chemical vapor
in ULSI fabs




materials are
deposition
PTFE




usually non-
(CVD), spin
deposition




conductive, a
coating, and
cannot be




heater fabricated
evaporation
followed with




from a conductive
PTFE is a
high temperature




material is
candidate for
(above 350° C.)




incorporated. A 50 μm
low dielectric
processing




long PTFE
constant
Pigmented




bend actuator with
insulation in
inks may be




polysilicon heater
ULSI
infeasible, as




and 15 mW power
Very low
pigment particles




input can provide
power
may jam the




180 μN force and
consumption
bend actuator




10 μm deflection.
Many ink





Actuator motions
types can be





include:
used





Bend
Simple





Push
planar





Buckle
fabrication





Rotate
Small chip






area required for






each actuator






Fast operation






High efficiency






CMOS compatible






voltages and






currents






Easy extension






from single






nozzles to






pagewidth print






head




Conductive
A polymer with a
High force
Requires
IJ24


polymer
high coefficient of
can be generated
special materials



thermo-
thermal expansion
Very low
development



elastic
(such as PTFE) is
power
(High CTE



actuator
doped with
consumption
conductive




conducting
Many ink
polymer)




substances to
types can be
Requires a




increase its
used
PTFE deposition




conductivity to
Simple
process, which is




about 3 orders of
planar
not yet standard




magnitude below
fabrication
in ULSI fabs




that of copper. The
Small chip
PTFE




conducting
area required for
deposition




polymer expands
each actuator
cannot be




when resistively
Fast
followed with




heated.
operation
high temperature




Examples of
High
(above 350° C.)




conducting
efficiency
processing




dopants include:
CMOS
Evaporation




Carbon nanotubes
compatible
and CVD




Metal fibers
voltages and
deposition




Conductive
currents
techniques




polymers such as
Easy
cannot be used




doped
extension from
Pigmented




polythiophene
single nozzles to
inks may be




Carbon granules
pagewidth print
infeasible, as





heads
pigment particles






may jam the






bend actuator



Shape
A shape memory
High force
Fatigue
IJ26


memory
alloy such as TiNi
is available
limits maximum



alloy
(also known as
(stresses of
number of cycles




Nitinol - Nickel
hundreds of
Low strain




Titanium alloy
MPa)
(1%) is required




developed at the
Large
to extend fatigue




Naval Ordnance
strain is
resistance




Laboratory) is
available (more
Cycle rate




thermally switched
than 3%)
limited by heat




between its weak
High
removal




martensitic state
corrosion
Requires




and its high
resistance
unusual




stiffness austenitic
Simple
materials (TiNi)




state. The shape of
construction
The latent




the actuator in its
Easy
heat of




martensitic state is
extension from
transformation




deformed relative
single nozzles to
must be




to the austenitic
pagewidth print
provided




shape. The shape
heads
High




change causes
Low
current operation




ejection of a drop.
voltage
Requires





operation
pre-stressing to






distort the






martensitic state



Linear
Linear magnetic
Linear
Requires
IJ12


Magnetic
actuators include
Magnetic
unusual



Actuator
the Linear
actuators can be
semiconductor




Induction Actuator
constructed with
materials such as




(LIA), Linear
high thrust, long
soft magnetic




Permanent Magnet
travel, and high
alloys (e.g.




Synchronous
efficiency using
CoNiFe)




Actuator
planar
Some




(LPMSA), Linear
semiconductor
varieties also




Reluctance
fabrication
require




Synchronous
techniques
permanent




Actuator (LRSA),
Long
magnetic




Linear Switched
actuator travel is
materials such as




Reluctance
available
Neodymium iron




Actuator (LSRA),
Medium
boron (NdFeB)




and the Linear
force is available
Requires




Stepper Actuator
Low
complex multi-




(LSA).
voltage
phase drive





operation
circuitry






High






current operation



















BASIC OPERATION MODE












Description
Advantages
Disadvantages
Examples





Actuator
This is the
Simple
Drop
Thermal


directly
simplest mode of
operation
repetition rate is
ink jet


pushes
operation: the
No
usually limited
Piezoelectric


ink
actuator directly
external fields
to around 10 kHz.
ink jet



supplies sufficient
required
However,
IJ01, IJ02,



kinetic energy to
Satellite
this is not
IJ03, IJ04, IJ05,



expel the drop.
drops can be
fundamental to
IJ06, IJ07, IJ09,



The drop must
avoided if drop
the method, but
IJ11, IJ12, IJ14,



have a sufficient
velocity is less
is related to the
IJ16, IJ20, IJ22,



velocity to
than 4 m/s
refill method
IJ23, IJ24, IJ25,



overcome the
Can be
normally used
IJ26, IJ27, IJ28,



surface tension.
efficient,
All of the
IJ29, IJ30, IJ31,




depending upon
drop kinetic
IJ32, IJ33, IJ34,




the actuator used
energy must be
IJ35, IJ36, IJ37,





provided by the
IJ38, IJ39, IJ40,





actuator
IJ41, IJ42, IJ43,





Satellite
IJ44





drops usually






form if drop






velocity is






greater than 4.5 m/s



Proximity
The drops to be
Very
Requires
Silverbrook,



printed are
simple print
close proximity
EP 0771 658



selected by some
head fabrication
between the
A2 and related



manner (e.g.
can be used
print head and
patent



thermally induced
The drop
the print media
applications



surface tension
selection means
or transfer roller




reduction of
does not need to
May




pressurized ink).
provide the
require two print




Selected drops are
energy required
heads printing




separated from the
to separate the
alternate rows of




ink in the nozzle
drop from the
the image




by contact with the
nozzle
Monolithic




print medium or a

color print




transfer roller.

heads are






difficult



Electro-
The drops to be
Very
Requires
Silverbrook,


static pull
printed are
simple print
very high
EP 0771 658


on ink
selected by some
head fabrication
electrostatic field
A2 and related



manner (e.g.
can be used
Electrostatic
patent



thermally induced
The drop
field for small
applications



surface tension
selection means
nozzle sizes is
Tone-Jet



reduction of
does not need to
above air




pressurized ink).
provide the
breakdown




Selected drops are
energy required
Electrostatic




separated from the
to separate the
field may




ink in the nozzle
drop from the
attract dust




by a strong electric
nozzle





field.





Magnetic
The drops to be
Very
Requires
Silverbrook,


pull on
printed are
simple print
magnetic ink
EP 0771 658


ink
selected by some
head fabrication
Ink colors
A2 and related



manner (e.g.
can be used
other than black
patent



thermally induced
The drop
are difficult
applications



surface tension
selection means
Requires




reduction of
does not need to
very high




pressurized ink).
provide the
magnetic fields




Selected drops are
energy required





separated from the
to separate the





ink in the nozzle
drop from the





by a strong
nozzle





magnetic field






acting on the






magnetic ink.





Shutter
The actuator
High
Moving
IJ13, IJ17,



moves a shutter to
speed (>50 kHz)
parts are
IJ21



block ink flow to
operation can be
required




the nozzle. The ink
achieved due to
Requires




pressure is pulsed
reduced refill
ink pressure




at a multiple of the
time
modulator




drop ejection
Drop
Friction




frequency.
timing can be
and wear must





very accurate
be considered





The
Stiction is





actuator energy
possible





can be very low




Shuttered
The actuator
Actuators
Moving
IJ08, IJ15,


grill
moves a shutter to
with small travel
parts are
IJ18, IJ19



block ink flow
can be used
required




through a grill to
Actuators
Requires




the nozzle. The
with small force
ink pressure




shutter movement
can be used
modulator




need only be equal
High
Friction




to the width of the
speed (>50 kHz)
and wear must




grill holes.
operation can be
be considered





achieved
Stiction is






possible



Pulsed
A pulsed magnetic
Extremely
Requires
IJ10


magnetic
field attracts an
low energy
an external



pull on
‘ink pusher’ at the
operation is
pulsed magnetic



ink
drop ejection
possible
field



pusher
frequency. An
No heat
Requires




actuator controls a
dissipation
special materials




catch, which
problems
for both the




prevents the ink

actuator and the




pusher from

ink pusher




moving when a

Complex




drop is not to be

construction




ejected.



















AUXILIARY MECHANISM (APPLIED TO ALL NOZZLES)












Description
Advantages
Disadvantages
Examples





None
The actuator
Simplicity
Drop
Most ink



directly fires the
of construction
ejection energy
jets, including



ink drop, and there
Simplicity
must be supplied
piezoelectric and



is no external field
of operation
by individual
thermal bubble.



or other
Small
nozzle actuator
IJ01, IJ02,



mechanism
physical size

IJ03, IJ04, IJ05,



required.


IJ07, IJ09, IJ11,






IJ12, IJ14, IJ20,






IJ22, IJ23, IJ24,






IJ25, IJ26, IJ27,






IJ28, IJ29, IJ30,






IJ31, IJ32, IJ33,






IJ34, IJ35, IJ36,






IJ37, IJ38, IJ39,






IJ40, IJ41, IJ42,






IJ43, IJ44


Oscillating
The ink pressure
Oscillating
Requires
Silverbrook,


ink
oscillates,
ink pressure can
external ink
EP 0771 658


pressure
providing much of
provide a refill
pressure
A2 and related


(including
the drop ejection
pulse, allowing
oscillator
patent


acoustic
energy. The
higher operating
Ink
applications


stimulation)
actuator selects
speed
pressure phase
IJ08, IJ13,



which drops are to
The
and amplitude
IJ15, IJ17, IJ18,



be fired by
actuators may
must be
IJ19, IJ21



selectively
operate with
carefully




blocking or
much lower
controlled




enabling nozzles.
energy
Acoustic




The ink pressure
Acoustic
reflections in the




oscillation may be
lenses can be
ink chamber




achieved by
used to focus the
must be




vibrating the print
sound on the
designed for




head, or preferably
nozzles





by an actuator in






the ink supply.





Media
The print head is
Low
Precision
Silverbrook,


proximity
placed in close
power
assembly
EP 0771 658



proximity to the
High
required
A2 and related



print medium.
accuracy
Paper
patent



Selected drops
Simple
fibers may cause
applications



protrude from the
print head
problems




print head further
construction
Cannot




than unselected

print on rough




drops, and contact

substrates




the print medium.






The drop soaks






into the medium






fast enough to






cause drop






separation.





Transfer
Drops are printed
High
Bulky
Silverbrook,


roller
to a transfer roller
accuracy
Expensive
EP 0771 658



instead of straight
Wide
Complex
A2 and related



to the print
range of print
construction
patent



medium. A
substrates can be

applications



transfer roller can
used

Tektronix



also be used for
Ink can be

hot melt



proximity drop
dried on the

piezoelectric ink



separation.
transfer roller

jet






Any of the






IJ series


Electro-
An electric field is
Low
Field
Silverbrook,


static
used to accelerate
power
strength required
EP 0771 658



selected drops
Simple
for separation of
A2 and related



towards the print
print head
small drops is
patent



medium.
construction
near or above air
applications





breakdown
Tone-Jet


Direct
A magnetic field is
Low
Requires
Silverbrook,


magnetic
used to accelerate
power
magnetic ink
EP 0771 658


field
selected drops of
Simple
Requires
A2 and related



magnetic ink
print head
strong magnetic
patent



towards the print
construction
field
applications



medium.





Cross
The print head is
Does not
Requires
IJ06, IJ16


magnetic
placed in a
require magnetic
external magnet



field
constant magnetic
materials to be
Current




field. The Lorenz
integrated in the
densities may be




force in a current
print head
high, resulting in




carrying wire is
manufacturing
electromigration




used to move the
process
problems




actuator.





Pulsed
A pulsed magnetic
Very low
Complex
IJ10


magnetic
field is used to
power operation
print head



field
cyclically attract a
is possible
construction




paddle, which
Small
Magnetic




pushes on the ink.
print head size
materials




A small actuator

required in print




moves a catch,

head




which selectively






prevents the






paddle from






moving.



















ACTUATOR AMPLIFICATION OR MODIFICATION METHOD












Description
Advantages
Disadvantages
Examples





None
No actuator
Operational
Many
Thermal



mechanical
simplicity
actuator
Bubble Ink jet



amplification is

mechanisms
IJ01, IJ02,



used. The actuator

have insufficient
IJ06, IJ07, IJ16,



directly drives the

travel, or
IJ25, IJ26



drop ejection

insufficient




process.

force, to






efficiently drive






the drop ejection






process



Differential
An actuator
Provides
High
Piezoelectric


expansion
material expands
greater travel in
stresses are
IJ03, IJ09,


bend
more on one side
a reduced print
involved
IJ17, IJ18, IJ19,


actuator
than on the other.
head area
Care must
IJ20, IJ21, IJ22,



The expansion

be taken that the
IJ23, IJ24, IJ27,



may be thermal,

materials do not
IJ29, IJ30, IJ31,



piezoelectric,

delaminate
IJ32, IJ33, IJ34,



magnetostrictive,

Residual
IJ35, IJ36, IJ37,



or other

bend resulting
IJ38, IJ39, IJ42,



mechanism. The

from high
IJ43, IJ44



bend actuator

temperature or




converts a high

high stress




force low travel

during formation




actuator






mechanism to high






travel, lower force






mechanism.





Transient
A trilayer bend
Very good
High
IJ40, IJ41


bend
actuator where the
temperature
stresses are



actuator
two outside layers
stability
involved




are identical. This
High
Care must




cancels bend due
speed, as a new
be taken that the




to ambient
drop can be fired
materials do not




temperature and
before heat
delaminate




residual stress. The
dissipates





actuator only
Cancels





responds to
residual stress of





transient heating of
formation





one side or the






other.





Reverse
The actuator loads
Better
Fabrication
IJ05, IJ11


spring
a spring. When the
coupling to the
complexity




actuator is turned
ink
High




off, the spring

stress in the




releases. This can

spring




reverse the






force/distance






curve of the






actuator to make it






compatible with






the force/time






requirements of






the drop ejection.





Actuator
A series of thin
Increased
Increased
Some


stack
actuators are
travel
fabrication
piezoelectric ink



stacked. This can
Reduced
complexity
jets



be appropriate
drive voltage
Increased
IJ04



where actuators

possibility of




require high

short circuits due




electric field

to pinholes




strength, such as






electrostatic and






piezoelectric






actuators.





Multiple
Multiple smaller
Increases
Actuator
IJ12, IJ13,


actuators
actuators are used
the force
forces may not
IJ18, IJ20, IJ22,



simultaneously to
available from
add linearly,
IJ28, IJ42, IJ43



move the ink. Each
an actuator
reducing




actuator need
Multiple
efficiency




provide only a
actuators can be





portion of the
positioned to





force required.
control ink flow






accurately




Linear
A linear spring is
Matches
Requires
IJ15


Spring
used to transform a
low travel
print head area




motion with small
actuator with
for the spring




travel and high
higher travel





force into a longer
requirements





travel, lower force
Non-





motion.
contact method






of motion






transformation




Coiled
A bend actuator is
Increases
Generally
IJ17, IJ21,


actuator
coiled to provide
travel
restricted to
IJ34, IJ35



greater travel in a
Reduces
planar




reduced chip area.
chip area
implementations





Planar
due to extreme





implementations
fabrication





are relatively
difficulty in





easy to fabricate.
other






orientations.



Flexure
A bend actuator
Simple
Care must
IJ10, IJ19,


bend
has a small region
means of
be taken not to
IJ33


actuator
near the fixture
increasing travel
exceed the




point, which flexes
of a bend
elastic limit in




much more readily
actuator
the flexure area




than the remainder

Stress




of the actuator.

distribution is




The actuator

very uneven




flexing is

Difficult




effectively

to accurately




converted from an

model with finite




even coiling to an

element analysis




angular bend,






resulting in greater






travel of the






actuator tip.





Catch
The actuator
Very low
Complex
IJ10



controls a small
actuator energy
construction




catch. The catch
Very small
Requires




either enables or
actuator size
external force




disables movement

Unsuitable




of an ink pusher

for pigmented




that is controlled

inks




in a bulk manner.





Gears
Gears can be used
Low force,
Moving
IJ13



to increase travel
low travel
parts are




at the expense of
actuators can be
required




duration. Circular
used
Several




gears, rack and
Can be
actuator cycles




pinion, ratchets,
fabricated using
are required




and other gearing
standard surface
More




methods can be
MEMS
complex drive




used.
processes
electronics






Complex






construction






Friction,






friction, and






wear are






possible



Buckle
A buckle plate can
Very fast
Must stay
S. Hirata


plate
be used to change
movement
within elastic
et al, “An Ink-jet



a slow actuator
achievable
limits of the
Head Using



into a fast motion.

materials for
Diaphragm



It can also convert

long device life
Microactuator”,



a high force, low

High
Proc. IEEE



travel actuator into

stresses involved
MEMS, February



a high travel,

Generally
1996, pp 418-423.



medium force

high power
IJ18, IJ27



motion.

requirement



Tapered
A tapered
Linearizes
Complex
IJ14


magnetic
magnetic pole can
the magnetic
construction



pole
increase travel at
force/distance





the expense of
curve





force.





Lever
A lever and
Matches
High
IJ32, IJ36,



fulcrum is used to
low travel
stress around the
IJ37



transform a motion
actuator with
fulcrum




with small travel
higher travel





and high force into
requirements





a motion with
Fulcrum





longer travel and
area has no





lower force. The
linear





lever can also
movement, and





reverse the
can be used for a





direction of travel.
fluid seal




Rotary
The actuator is
High
Complex
IJ28


impeller
connected to a
mechanical
construction




rotary impeller. A
advantage
Unsuitable




small angular
The ratio
for pigmented




deflection of the
of force to travel
inks




actuator results in
of the actuator





a rotation of the
can be matched





impeller vanes,
to the nozzle





which push the ink
requirements by





against stationary
varying the





vanes and out of
number of





the nozzle.
impeller vanes




Acoustic
A refractive or
No
Large area
1993


lens
diffractive (e.g.
moving parts
required
Hadimioglu et



zone plate)

Only
al, EUP 550,192



acoustic lens is

relevant for
1993



used to concentrate

acoustic ink jets
Elrod et al, EUP



sound waves.


572,220


Sharp
A sharp point is
Simple
Difficult
Tone-jet


conductive
used to concentrate
construction
to fabricate



point
an electrostatic

using standard




field.

VLSI processes






for a surface






ejecting ink-jet






Only relevant for






electrostatic ink






jets








Actuator motion











Volume
The volume of the
Simple
High
Hewlett-


expansion
actuator changes,
construction in
energy is
Packard Thermal



pushing the ink in
the case of
typically
Inkjet



all directions.
thermal ink jet
required to
Canon





achieve volume
Bubblejet





expansion. This






leads to thermal






stress, cavitation.






and kogation in






thermal ink jet






implementations



Linear,
The actuator
Efficient
High
IJ01, IJ02,


normal to
moves in a
coupling to ink
fabrication
IJ04, IJ07, Mil,


chip
direction normal to
drops ejected
complexity may
IJI4


surface
the print head
normal to the
be required to




surface. The
surface
achieve




nozzle is typically

perpendicular




in the line of

motion




movement.





Parallel to
The actuator
Suitable
Fabrication
IJ12, IJ13,


chip
moves parallel to
for planar
complexity
IJ15, IJ33, IJ34,


surface
the print head
fabrication
Friction
IJ35, U36



surface. Drop

Stiction




ejection may still






be normal to the






surface.





Membrane
An actuator with a
The
Fabrication
1982


push
high force but
effective area of
complexity
Howkins U.S. Pat.



small area is used
the actuator
Actuator
No. 4,459,601



to push a stiff
becomes the
size




membrane that is
membrane area
Difficulty




in contact with the

of integration in




ink.

a VLSI process



Rotary
The actuator
Rotary
Device
IJ05, IJ08,



causes the rotation
levers may be
complexity
IJ13, IJ28



of some element.
used to increase
May have




such a grill or
travel
friction at a pivot




impeller
Small chip
point





area requirements




Bend
The actuator bends
A very
Requires
1970



when energized.
small change in
the actuator to be
Kyser ct al U.S. Pat.



This may be due to
dimensions can
made from at
No. 3,946,398



differential
be converted to a
least two distinct
1973



thermal expansion,
large motion.
layers, or to have
Stemme U.S. Pat.



piezoelectric

a thermal
No. 3,747,120



expansion.

difference across
IJ03, IJ09,



magnetostriction.

the actuator
IJ10, IJ19, IJ23,



or other form of


IJ24, IJ25, IJ29,



relative


IJ30, IJ31, IJ33,



dimensional


IJ34, IJ35



change.





Swivel
The acluator
Allows
Inefficient
IJ06



swivels around a
operation where
coupling to the




central pivot. This
the net linear
ink motion




motion is suitable
force on the





where there are
paddle is zero





opposite forces
Small chip





applied to opposite
area





sides of the paddle,
requirements





e.g. Lorenz force.





Straighten
The actuator is
Can be
Requires
IJ26, IJ32



normally bent, and
used with shape
careful balance




straightens when
memory alloys
of stresses to




energized.
where the
ensure ihai the





austenitic phase
quiescent bend is





is planar
accurate



Double
The actuator bends
One
Difficult
IJ36, 1J37, IJ38


bend
in one direction
actuator can be
to make the




when one element
used to power
drops ejected by




is energized, and
two nozzles.
both bend




bends the other
Reduced
directions




way when another
chip size.
identical.




element is
Not
A small




energized.
sensitive to
efficiency loss





ambient
compared to





temperature
equivalent single






bend actuators.



Shear
Energizing the
Can
Not
1985



actuator causes a
increase the
readily
Fishbeck U.S. Pat.



shear motion in the
effective travel
applicable to
No. 4,584,590



actuator material.
of piezoelectric
other actuator





actuators
mechanisms



Radial
The actuator
Relatively
High force
1970


constriction
squeezes an ink
easy to fabricate
required
Zoltan U.S. Pat.



reservoir, forcing
single nozzles
Inefficient
No. 3,683,212



ink from a
from glass
Difficult




constricted nozzle.
tubing as
to integrate with





macroscopic
VLSI processes





structures




Coil/
A coiled actuator
Easy to
Difficult
IJ17, IJ21,


uncoil
uncoils or coils
fabricate as a
to fabricate for
IJ34, IJ35



more tightly. The
planar VLSI
non-planar




motion of the free
process
devices




end of the actuator
Small area
Poor out-




ejects the ink.
required,
of-plane stiffness





therefore low






cost




Bow
The actuator bows
Can
Maximum
IJ16, IJ18,



(or buckles) in the
increase the
travel is
IJ27



middle when
speed of travel
constrained




energized.
Mechanically
High force





rigid
required



Push-Pull
Two actuators
The
Not
IJ18



control a shutter.
structure is
readily suitable




One actuator pulls
pinned at both
for ink jets




the shutter, and the
ends, so has a
which directly




other pushes it.
high out-of-
push the ink





plane rigidity




Curl
A set of actuators
Good fluid
Design
IJ20, IJ42


inwards
curl inwards to
flow to the
complexity




reduce the volume
region behind





of ink that they
the actuator





enclose.
increases






efficiency




Curl
A set of actuators
Relatively
Relatively
IJ43


outwards
curl outwards,
simple
large chip area




pressurizing ink in
construction





a chamber






surrounding the






actuators, and






expelling ink from






a nozzle in the






chamber.





Iris
Multiple vanes
High
High
IJ22



enclose a volume
efficiency
fabrication




of ink. These
Small chip
complexity




simultaneously
area
Not




rotate, reducing

suitable for




the volume

pigmented inks




between the vanes.





Acoustic
The actuator vibrates
The actuator can
Large area
1993


vibration
at a high frequency.
be physically
required for
Hadimioglu et




distant from the
efficient operation
al, EUP 550,192




ink
at useful
1993





frequencies
Elrod et al, EUP





Acoustic coupling
572,220





and crosstalk






Complex drive






circuitry






Poor control of






drop volume and






position



None
In various ink jet
No
Various
Silverbrook,



designs the
moving parts
other tradeoffs
EP 0771 658



actuator does not

are required to
A2 and related



move.

eliminate
patent





moving parts
applications






Tone-jet



















NOZZLE REFILL METHOD












Description
Advantages
Disadvantages
Examples















Surface
This is the normal
Fabrication
Low speed
Thermal


tension
way that ink jets
simplicity
Surface
ink jet



are refilled. After
Operational
tension force
Piezoelectric



the actuator is
simplicity
relatively small
ink jet



energized, it

compared to
IJ01-IJ07,



typically returns

actuator force
IJ10-IJ14, IJ16,



rapidly to its

Long refill
IJ20, IJ22-IJ45



normal position.

time usually



This rapid return

dominates the



sucks in air

total repetition



through the nozzle

rate



opening. The ink



surface tension at



the nozzle then



exerts a small



force restoring the



meniscus to a



minimum area.



This force refills



the nozzle.


Shuttered
Ink to the nozzle
High
Requires
IJ08, IJ13,


oscillating
chamber is
speed
common ink
IJ15, IJ17, IJ18,


ink
provided at a
Low
pressure
IJ19, IJ21


pressure
pressure that
actuator energy,
oscillator



oscillates at twice
as the actuator
May not



the drop ejection
need only open
be suitable for



frequency. When a
or close the
pigmented inks



drop is to be
shutter, instead



ejected, the shutter
of ejecting the



is opened for 3
ink drop



half cycles: drop



ejection, actuator



return, and refill.



The shutter is then



closed to prevent



the nozzle



chamber emptying



during the next



negative pressure



cycle.


Refill
After the main
High
Requires
IJ09


actuator
actuator has
speed, as the
two independent



ejected a drop a
nozzle is
actuators per



second (refill)
actively refilled
nozzle



actuator is



energized. The



refill actuator



pushes ink into the



nozzle chamber.



The refill actuator



returns slowly, to



prevent its return



from emptying the



chamber again.


Positive
The ink is held a
High refill
Surface
Silverbrook,


ink
slight positive
rate, therefore a
spill must be
EP 0771 658


pressure
pressure. After the
high drop
prevented
A2 and related



ink drop is ejected,
repetition rate is
Highly
patent



the nozzle
possible
hydrophobic
applications



chamber fills

print head
Alternative



quickly as surface

surfaces are
for:, IJ01-IJ07,



tension and ink

required
IJ10-IJ14, IJ16,



pressure both


IJ20, IJ22-IJ45



operate to refill the



nozzle.



















METHOD OF RESTRICTING BACK-FLOW THROUGH INLET












Description
Advantages
Disadvantages
Examples















Long inlet
The ink inlet
Design
Restricts
Thermal


channel
channel to the
simplicity
refill rate
ink jet



nozzle chamber is
Operational
May result
Piezoelectric



made long and
simplicity
in a relatively
ink jet



relatively narrow,
Reduces
large chip area
IJ42, IJ43



relying on viscous
crosstalk
Only



drag to reduce

partially



inlet back-flow.

effective


Positive
The ink is under a
Drop
Requires a
Silverbrook,


ink
positive pressure,
selection and
method (such as
EP 0771 658


pressure
so that in the
separation forces
a nozzle rim or
A2 and related



quiescent state
can be reduced
effective
patent



some of the ink
Fast refill
hydrophobizing,
applications



drop already
time
or both) to
Possible



protrudes from the

prevent flooding
operation of the



nozzle.

of the ejection
following: IJ01-IJ07,



This reduces the

surface of the
IJ09-IJ12,



pressure in the

print head.
IJ14, IJ16, IJ20,



nozzle chamber


IJ22,, IJ23-IJ34,



which is required


IJ36-IJ41, IJ44



to eject a certain



volume of ink. The



reduction in



chamber pressure



results in a



reduction in ink



pushed out through



the inlet.


Baffle
One or more
The refill
Design
HP



baffles are placed
rate is not as
complexity
Thermal Ink Jet



in the inlet ink
restricted as the
May
Tektronix



flow. When the
long inlet
increase
piezoelectric ink



actuator is
method.
fabrication
jet



energized, the
Reduces
complexity (e.g.



rapid ink
crosstalk
Tektronix hot



movement creates

melt



eddies which

Piezoelectric



restrict the flow

print heads).



through the inlet.



The slower refill



process is



unrestricted, and



does not result in



eddies.


Flexible
In this method
Significantly
Not
Canon


flap
recently disclosed
reduces back-
applicable to


restricts
by Canon, the
flow for edge-
most ink jet


inlet
expanding actuator
shooter thermal
configurations



(bubble) pushes on
ink jet devices
Increased



a flexible flap that

fabrication



restricts the inlet.

complexity





Inelastic





deformation of





polymer flap





results in creep





over extended





use


Inlet filter
A filter is located
Additional
Restricts
IJ04, IJ12,



between the ink
advantage of ink
refill rate
IJ24, IJ27, IJ29,



inlet and the
filtration
May result
IJ30



nozzle chamber.
Ink filter
in complex



The filter has a
may be
construction



multitude of small
fabricated with



holes or slots,
no additional



restricting ink
process steps



flow. The filter



also removes



particles which



may block the



nozzle.


Small
The ink inlet
Design
Restricts
IJ02, IJ37,


inlet
channel to the
simplicity
refill rate
IJ44


compared
nozzle chamber

May result


to nozzle
has a substantially

in a relatively



smaller cross

large chip area



section than that of

Only



the nozzle,

partially



resulting in easier

effective



ink egress out of



the nozzle than out



of the inlet.


Inlet
A secondary
Increases
Requires
IJ09


shutter
actuator controls
speed of the ink-
separate refill



the position of a
jet print head
actuator and



shutter, closing off
operation
drive circuit



the ink inlet when



the main actuator



is energized.


The inlet
The method avoids
Back-flow
Requires
IJ01, IJ03,


is located
the problem of
problem is
careful design to
1J05, IJ06, IJ07,


behind
inlet back-flow by
eliminated
minimize the
IJ10, IJ11, IJ14,


the ink-
arranging the ink-

negative
IJ16, IJ22, IJ23,


pushing
pushing surface of

pressure behind
IJ25, IJ28, IJ31,


surface
the actuator

the paddle
IJ32, IJ33, IJ34,



between the inlet


IJ35, IJ36, IJ39,



and the nozzle.


IJ40, IJ41


Part of
The actuator and a
Significant
Small
IJ07, IJ20,


the
wall of the ink
reductions in
increase in
IJ26, IJ38


actuator
chamber are
back-flow can be
fabrication


moves to
arranged so that
achieved
complexity


shut off
the motion of the
Compact


the inlet
actuator closes off
designs possible



the inlet.


Nozzle
In some
Ink back-
None
Silverbrook,


actuator
configurations of
flow problem is
related to ink
EP 0771 658


does not
ink jet, there is no
eliminated
back-flow on
A2 and related


result in
expansion or

actuation
patent


ink back-
movement of an


applications


flow
actuator which


Valve-jet



may cause ink


Tone-jet



back-flow through



the inlet.



















NOZZLE CLEARING METHOD












Description
Advantages
Disadvantages
Examples















Normal
All of the nozzles
No added
May not
Most ink


nozzle
are fired
complexity on
be sufficient to
jet systems


firing
periodically,
the print head
displace dried
IJ01, IJ02,



before the ink has

ink
IJ03, IJ04, IJ05,



a chance to dry.


IJ06, IJ07, IJ09,



When not in use


IJ10, IJ11, IJ12,



the nozzles are


IJ14, IJ16, IJ20,



sealed (capped)


IJ22, IJ23, IJ24,



against air.


IJ25, IJ26, IJ27,



The nozzle firing


IJ28, IJ29, IJ30,



is usually


IJ31, IJ32, IJ33,



performed during a


IJ34, IJ36, IJ37,



special clearing


IJ38, IJ39, IJ40,,



cycle, after first


IJ41, IJ42, IJ43,



moving the print


IJ44,, IJ45



head to a cleaning



station.


Extra
In systems which
Can be
Requires
Silverbrook,


power to
heat the ink, but do
highly effective
higher drive
EP 0771 658


ink heater
not boil it under
if the heater is
voltage for
A2 and related



normal situations,
adjacent to the
clearing
patent



nozzle clearing can
nozzle
May
applications



be achieved by

require larger



over-powering the

drive transistors



heater and boiling



ink at the nozzle.


Rapid
The actuator is
Does not
Effectiveness
May be


succession
fired in rapid
require extra
depends
used with: IJ01,


of
succession. In
drive circuits on
substantially
IJ02, IJ03, IJ04,


actuator
some
the print head
upon the
IJ05, IJ06, IJ07,


pulses
configurations, this
Can be
configuration of
IJ09, IJ10, IJ11,



may cause heat
readily
the ink jet nozzle
IJ14, IJ16, IJ20,



build-up at the
controlled and

IJ22, IJ23, IJ24,



nozzle which boils
initiated by

IJ25, IJ27, IJ28,



the ink, clearing
digital logic

IJ29, IJ30, IJ31,



the nozzle. In other


IJ32, IJ33, IJ34,



situations, it may


IJ36, IJ37, IJ38,



cause sufficient


IJ39, IJ40, IJ41,



vibrations to


IJ42, IJ43, IJ44,



dislodge clogged


IJ45



nozzles.


Extra
Where an actuator
A simple
Not
May be


power to
is not normally
solution where
suitable where
used with: IJ03,


ink
driven to the limit
applicable
there is a hard
IJ09, IJ16, IJ20,


pushing
of its motion,

limit to actuator
IJ23, IJ24, IJ25,


actuator
nozzle clearing

movement
IJ27, IJ29, IJ30,



may be assisted by


IJ31, IJ32, IJ39,



providing an


IJ40, IJ41, IJ42,



enhanced drive


IJ43, IJ44, IJ45



signal to the



actuator.


Acoustic
An ultrasonic
A high
High
IJ08, IJ13,


resonance
wave is applied to
nozzle clearing
implementation
IJ15, IJ17, IJ18,



the ink chamber.
capability can be
cost if system
IJ19, IJ21



This wave is of an
achieved
does not already



appropriate
May be
include an



amplitude and
implemented at
acoustic actuator



frequency to cause
very low cost in



sufficient force at
systems which



the nozzle to clear
already include



blockages. This is
acoustic



easiest to achieve
actuators



if the ultrasonic



wave is at a



resonant frequency



of the ink cavity.


Nozzle
A microfabricated
Can clear
Accurate
Silverbrook,


clearing
plate is pushed
severely clogged
mechanical
EP 0771 658


plate
against the
nozzles
alignment is
A2 and related



nozzles. The plate

required
patent



has a post for

Moving
applications



every nozzle. A

parts are



post moves

required



through each

There is



nozzle, displacing

risk of damage



dried ink.

to the nozzles





Accurate





fabrication is





required


Ink
The pressure of the
May be
Requires
May be


pressure
ink is temporarily
effective where
pressure pump
used with all IJ


pulse
increased so that
other methods
or other pressure
series ink jets



ink streams from
cannot be used
actuator



all of the nozzles.

Expensive



This may be used

Wasteful



in conjunction

of ink



with actuator



energizing.


Print
A flexible ‘blade’
Effective
Difficult
Many ink


head
is wiped across the
for planar print
to use if print
jet systems


wiper
print head surface.
head surfaces
head surface is



The blade is
Low cost
non-planar or



usually fabricated

very fragile



from a flexible

Requires



polymer, e.g.

mechanical parts



rubber or synthetic

Blade can



elastomer.

wear out in high





volume print





systems


Separate
A separate heater
Can be
Fabrication
Can be


ink
is provided at the
effective where
complexity
used with many


boiling
nozzle although
other nozzle

IJ series ink jets


heater
the normal drop
clearing methods



ejection
cannot be used



mechanism does
Can be



not require it. The
implemented at



heaters do not
no additional



require individual
cost in some ink



drive circuits, as
jet



many nozzles can
configurations



be cleared



simultaneously,



and no imaging is



required.



















NOZZLE PLATE CONSTRUCTION












Description
Advantages
Disadvantages
Examples















Electro-
A nozzle plate is
Fabrication
High
Hewlett


formed
separately
simplicity
temperatures and
Packard Thermal


nickel
fabricated from

pressures are
Ink jet



electroformed

required to bond



nickel, and bonded

nozzle plate



to the print head

Minimum



chip.

thickness





constraints





Differential





thermal





expansion


Laser
Individual nozzle
No masks
Each hole
Canon


ablated or
holes are ablated
required
must be
Bubblejet


drilled
by an intense UV
Can be
individually
1988


polymer
laser in a nozzle
quite fast
formed
Sercel et al.,



plate, which is
Some
Special
SPIE, Vol. 998



typically a
control over
equipment
Excimer Beam



polymer such as
nozzle profile is
required
Applications, pp.



polyimide or
possible
Slow
76-83



polysulphone
Equipment
where there are
1993




required is
many thousands
Watanabe et al.,




relatively low
of nozzles per
U.S. Pat. No. 5,208,604




cost
print head





May





produce thin





burrs at exit





holes


Silicon
A separate nozzle
High
Two part
K. Bean,


micro-
plate is
accuracy is
construction
IEEE


machined
micromachined
attainable
High cost
Transactions on



from single crystal

Requires
Electron



silicon, and

precision
Devices, Vol.



bonded to the print

alignment
ED-25, No. 10,



head wafer.

Nozzles
1978, pp 1185-1195





may be clogged
Xerox





by adhesive
1990 Hawkins et






al., U.S. Pat. No.






4,899,181


Glass
Fine glass
No
Very small
1970


capillaries
capillaries are
expensive
nozzle sizes are
Zoltan U.S. Pat. No.



drawn from glass
equipment
difficult to form
3,683,212



tubing. This
required
Not suited



method has been
Simple to
for mass



used for making
make single
production



individual nozzles,
nozzles



but is difficult to



use for bulk



manufacturing of



print heads with



thousands of



nozzles.


Monolithic,
The nozzle plate is
High
Requires
Silverbrook,


surface
deposited as a
accuracy (<1 μm)
sacrificial layer
EP 0771 658


micro-
layer using
Monolithic
under the nozzle
A2 and related


machined
standard VLSI
Low cost
plate to form the
patent


using
deposition
Existing
nozzle chamber
applications


VLSI
techniques.
processes can be
Surface
IJ01, IJ02,


litho-
Nozzles are etched
used
may be fragile to
IJ04, IJ11, IJ12,


graphic
in the nozzle plate

the touch
IJ17, IJ18, IJ20,


processes
using VLSI


IJ22, IJ24, IJ27,



lithography and


IJ28, IJ29, IJ30,



etching.


IJ31, IJ32, IJ33,






IJ34, IJ36, IJ37,






IJ38, IJ39, IJ40,






IJ41, IJ42, IJ43,






IJ44


Monolithic,
The nozzle plate is
High
Requires
IJ03, IJ05,


etched
a buried etch stop
accuracy (<1 μm)
long etch times
IJ06, IJ07, IJ08,


through
in the wafer.
Monolithic
Requires a
IJ09, IJ10, IJ13,


substrate
Nozzle chambers
Low cost
support wafer
IJ14, IJ15, IJ16,



are etched in the
No

IJ19, IJ21, IJ23,



front of the wafer,
differential

IJ25, IJ26



and the wafer is
expansion



thinned from the



backside. Nozzles



are then etched in



the etch stop layer.


No nozzle
Various methods
No
Difficult
Ricoh


plate
have been tried to
nozzles to
to control drop
1995 Sekiya et al



eliminate the
become clogged
position
U.S. Pat. No. 5,412,413



nozzles entirely, to

accurately
1993



prevent nozzle

Crosstalk
Hadimioglu et al



clogging. These

problems
EUP 550,192



include thermal


1993



bubble


Elrod et al EUP



mechanisms and


572,220



acoustic lens



mechanisms


Trough
Each drop ejector
Reduced
Drop
IJ35



has a trough
manufacturing
firing direction



through which a
complexity
is sensitive to



paddle moves.
Monolithic
wicking.



There is no nozzle



plate.


Nozzle slit
The elimination of
No
Difficult
1989 Saito


instead of
nozzle holes and
nozzles to
to control drop
et al U.S. Pat. No.


individual
replacement by a
become clogged
position
4,799,068


nozzles
slit encompassing

accurately



many actuator

Crosstalk



positions reduces

problems



nozzle clogging,



but increases



crosstalk due to



ink surface waves



















DROP EJECTION DIRECTION












Description
Advantages
Disadvantages
Examples















Edge
Ink flow is along
Simple
Nozzles
Canon


(‘edge
the surface of the
construction
limited to edge
Bubblejet 1979


shooter’)
chip, and ink drops
No silicon
High
Endo et al GB



are ejected from
etching required
resolution is
patent 2,007,162



the chip edge.
Good heat
difficult
Xerox




sinking via
Fast color
heater-in-pit




substrate
printing requires
1990 Hawkins et




Mechanically
one print head
al U.S. Pat. No.




strong
per color
4,899,181




Ease of

Tone-jet




chip handing


Surface
Ink flow is along
No bulk
Maximum
Hewlett-


(‘roof
the surface of the
silicon etching
ink flow is
Packard TIJ


shooter’)
chip, and ink drops
required
severely
1982 Vaught et



are ejected from
Silicon
restricted
al U.S. Pat. No.



the chip surface,
can make an

4,490,728



normal to the
effective heat

IJ02, IJ11,



plane of the chip.
sink

IJ12, IJ20, IJ22




Mechanical




strength


Through
Ink flow is through
High ink
Requires
Silverbrook,


chip,
the chip, and ink
flow
bulk silicon
EP 0771 658


forward
drops are ejected
Suitable
etching
A2 and related


(‘up
from the front
for pagewidth

patent


shooter’)
surface of the chip.
print heads

applications




High

IJ04, IJ17,




nozzle packing

IJ18, IJ24, IJ27-IJ45




density therefore




low




manufacturing




cost


Through
Ink flow is through
High ink
Requires
IJ01, IJ03,


chip,
the chip, and ink
flow
wafer thinning
IJ05, IJ06, IJ07,


reverse
drops are ejected
Suitable
Requires
IJ08, IJ09, IJ10,


(‘down
from the rear
for pagewidth
special handling
IJ13, IJ14, IJ15,


shooter’)
surface of the chip.
print heads
during
IJ16, IJ19, IJ21,




High
manufacture
IJ23, IJ25, IJ26




nozzle packing




density therefore




low




manufacturing




cost


Through
Ink flow is through
Suitable
Pagewidth
Epson


actuator
the actuator, which
for piezoelectric
print heads
Stylus



is not fabricated as
print heads
require several
Tektronix



part of the same

thousand
hot melt



substrate as the

connections to
piezoelectric ink



drive transistors.

drive circuits
jets





Cannot be





manufactured in





standard CMOS





fabs





Complex





assembly





required



















INK TYPE












Description
Advantages
Disadvantages
Examples















Aqueous,
Water based ink
Environmentally
Slow
Most


dye
which typically
friendly
drying
existing ink jets



contains: water,
No odor
Corrosive
All IJ



dye, surfactant,

Bleeds on
series ink jets



humectant, and

paper
Silverbrook,



biocide.

May
EP 0771 658



Modern ink dyes

strikethrough
A2 and related



have high water-

Cockles
patent



fastness, light

paper
applications



fastness


Aqueous,
Water based ink
Environmentally
Slow
IJ02, IJ04,


pigment
which typically
friendly
drying
IJ21, IJ26, IJ27,



contains: water,
No odor
Corrosive
IJ30



pigment,
Reduced
Pigment
Silverbrook,



surfactant,
bleed
may clog
EP 0771 658



humectant, and
Reduced
nozzles
A2 and related



biocide.
wicking
Pigment
patent



Pigments have an
Reduced
may clog
applications



advantage in
strikethrough
actuator
Piezoelectric



reduced bleed,

mechanisms
ink-jets



wicking and

Cockles
Thermal



strikethrough.

paper
ink jets (with






significant






restrictions)


Methyl
MEK is a highly
Very fast
Odorous
All IJ


Ethyl
volatile solvent
drying
Flammable
series ink jets


Ketone
used for industrial
Prints on


(MEK)
printing on
various



difficult surfaces
substrates such



such as aluminum
as metals and



cans.
plastics


Alcohol
Alcohol based inks
Fast
Slight
All IJ


(ethanol,
can be used where
drying
odor
series ink jets


2-butanol,
the printer must
Operates
Flammable


and
operate at
at sub-freezing


others)
temperatures
temperatures



below the freezing
Reduced



point of water. An
paper cockle



example of this is
Low cost



in-camera



consumer



photographic



printing.


Phase
The ink is solid at
No drying
High
Tektronix


change
room temperature,
time-ink
viscosity
hot melt


(hot melt)
and is melted in
instantly freezes
Printed ink
piezoelectric ink



the print head
on the print
typically has a
jets



before jetting. Hot
medium
‘waxy’ feel
1989



melt inks are
Almost
Printed
Nowak U.S. Pat. No.



usually wax based,
any print
pages may
4,820,346



with a melting
medium can be
‘block’
All IJ



point around 80° C.
used
Ink
series ink jets



After jetting
No paper
temperature may



the ink freezes
cockle occurs
be above the



almost instantly
No
curie point of



upon contacting
wicking occurs
permanent



the print medium
No bleed
magnets



or a transfer roller.
occurs
Ink heaters




No
consume power




strikethrough
Long




occurs
warm-up time


Oil
Oil based inks are
High
High
All IJ



extensively used in
solubility
viscosity: this is
series ink jets



offset printing.
medium for
a significant



They have
some dyes
limitation for use



advantages in
Does not
in ink jets, which



improved
cockle paper
usually require a



characteristics on
Does not
low viscosity.



paper (especially
wick through
Some short



no wicking or
paper
chain and multi-



cockle). Oil

branched oils



soluble dies and

have a



pigments are

sufficiently low



required.

viscosity.





Slow





drying


Micro-
A microemulsion
Stops ink
Viscosity
All IJ


emulsion
is a stable, self
bleed
higher than
series ink jets



forming emulsion
High dye
water



of oil, water, and
solubility
Cost is



surfactant. The
Water, oil,
slightly higher



characteristic drop
and amphiphilic
than water based



size is less than
soluble dies can
ink



100 nm, and is
be used
High



determined by the
Can
surfactant



preferred curvature
stabilize pigment
concentration



of the surfactant.
suspensions
required (around 5%)








Claims
  • 1. A printhead nozzle arrangement comprising: a wafer defining a chamber for holding ejection fluid;an ejection port supported by a plurality of bridge members which extend from the ejection port to sides of the chamber; anda plurality of heater elements interleaved between the bridge members for causing ejection of fluid held in the chamber through the ejection port.
  • 2. A nozzle arrangement as claimed in claim 1, wherein the heater elements are arranged to be generally circular and comprises a plurality of spaced apart serpentine stations which extend radially inward.
  • 3. A nozzle arrangement as claimed in claim 2, wherein each serpentine station is symmetric and comprises a mirrored pair of serpentine portions.
  • 4. A nozzle arrangement as claimed in claim 1, wherein the ends of the heater elements terminate in a pair of vias which are connected to a metal layer of the wafer.
  • 5. A nozzle arrangement as claimed in claim 1, wherein the chamber is generally funnel-shaped and tapers inwardly away from the ejection port.
  • 6. A nozzle arrangement as claimed in claim 5, wherein the wafer further defines a fluid supply inlet at an apex of the tapered chamber, the supply inlet being substantially aligned with the ejection port.
  • 7. A nozzle arrangement as claimed in claim 1, wherein each bridge member defines a fluid flow guide rail.
Priority Claims (1)
Number Date Country Kind
PP3987 Jun 1998 AU national
CROSS REFERENCES TO RELATED APPLICATIONS

This application is a continuation of U.S. application Ser. No. 12/422,936 filed Apr. 13, 2009, now issued U.S. Pat. No. 7,708,386, which is a continuation of U.S. application Ser. No. 11/706,379 filed Feb. 15, 2007, now issued U.S. Pat. No. 7,520,593, which is a continuation application of U.S. application Ser. No. 11/026,136 filed Jan. 3, 2005, now issued U.S. Pat. No. 7,188,933, which is a continuation application of U.S. application Ser. No. 10/309,036 filed Dec. 4, 2002, now issued U.S. Pat. No. 7,284,833, which is a Continuation Application of U.S. application Ser. No. 09/855,093 filed May 14, 2001, now issued U.S. Pat. No. 6,505,912, which is a Continuation Application of U.S. application Ser. No. 09/112,806 filed Jul. 10, 1998, now issued U.S. Pat. No. 6,247,790 all of which are herein incorporated by reference.

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Related Publications (1)
Number Date Country
20100207997 A1 Aug 2010 US
Continuations (6)
Number Date Country
Parent 12422936 Apr 2009 US
Child 12772825 US
Parent 11706379 Feb 2007 US
Child 12422936 US
Parent 11026136 Jan 2005 US
Child 11706379 US
Parent 10309036 Dec 2002 US
Child 11026136 US
Parent 09855093 May 2001 US
Child 10309036 US
Parent 09112806 Jul 1998 US
Child 09855093 US