This application claims benefit of the Japanese Patent Application No. 2007-128087 filed on May 14, 2007, which is hereby incorporated by reference.
1. Field of the Invention
The present invention relates to a probe card and a method of producing the same. In particular, the present invention relates to a probe card that can be suitable for use as a probe card having a three-dimensional spiral contactor and a method of producing the same.
2. Description of the Related Art
In general, in order to check the presence or absence of defects in semiconductor components such as an integrated circuit (IC) and a large-scale integrated circuit (LSI), a probe card is frequently used.
In a general probe card, a continuity test of a semiconductor component is performed by bringing electrodes of a wafer used for the semiconductor component into contact with corresponding contactors of the probe card to check whether the semiconductor component is non-defective or defective. The pitch of the electrode formed on a semiconductor component to be tested has been decreasing year by year. Accordingly, a small contactor pitch has also been desired year by year. Therefore, as shown in
However, the aspect ratio (the ratio of the height to the diameter) of the three-dimensional spiral contactor 104 depends on the aspect ratio of a resist cone (not shown) that is used as an inner core for forming the contactor 104 in the formation of the contactor 104. Here, it is difficult to change the aspect ratio of the resist cone so as to increase the height of the resist cone from the standpoint of the step of formation. Accordingly, when the diameter of the resist cone is decreased in order to decrease the pitch of the contactor 104, the height of the resist cone is also decreased. More specifically, when the pitch of the contactor 104 is reduced by decreasing the diameter of the resist cone, the amount of movement of the contactor 104 becomes insufficient.
If the amount of movement of the contactor 104 is insufficient, the contactor 104 remains fully contracted without appropriately exerting an elastic force. As a result, a large amount of force is applied to an object to be tested through the contactor 104. Furthermore, when the probe card 101 is pressed onto the object to be tested at an angle, the object contacts an area of a wiring board 102 where no contactors are provided. In such a case, the object to be tested or the wiring board 102 of the probe card 101 may be damaged.
Accordingly, the present invention has been made in view of the above points. The present invention provides a probe card in which a large amount of movement of a contactor can be realized even when the diameter of the contactor is decreased, and a method of producing the same.
In addition, the present invention provides a probe card in which damage of an object to be tested and the probe card can be prevented even when a contactor remains fully contracted, and a method of producing the same.
A probe card of a first aspect of the present invention includes a wiring board having a wiring pattern, a columnar base portion made of a conductive material and provided on a surface of the wiring pattern, and a three-dimensional spiral contactor the bottom of which is connected to the surface of the base portion.
According to the probe card of the first aspect of the present invention, the amount of movement can be increased by forming the base portion without changing the diameter or the height of the contactor.
According to a probe card of a second aspect of the present invention, the probe card of the first aspect of the present invention may further include an elastic film, wherein the elastic film is provided on the surface of the wiring board and below the contactor in the form of an elastic material film, and the upper limit of the thickness of the elastic film is the same as the height of the base portion.
According to the probe card of the second aspect of the present invention, by forming the elastic film, when the contactor contacts the elastic film, the elastic film exerts an elastic force on the contactor, thus reducing an impact force applied to an object to be tested or the probe card.
A method of producing a probe card of a first aspect of the present invention includes Step a of forming a resist film using a resin on a surface of a wiring board having a wiring pattern; Step b of forming a columnar through-hole in the resist film to expose the wiring pattern of the wiring board; Step c of forming a columnar base portion using a conductive material on the surface of the wiring pattern exposed in the through-hole of the resist film; Step d of forming a resist cone using a resin without covering the entire surface of the base portion on the surface of the resist film; Step e of forming a seed film on the side face of the resist cone; Step f of applying a resin on the side face of the resist cone having the seed film thereon and on the surface of the base portion, and exposing and developing the resin to form a resist pattern having a spiral groove extending from the base portion; Step g of forming a three-dimensional spiral contactor on the side face of the resist cone which is exposed in the groove of the resist pattern and on which the seed film is provided and on the surface of the base portion such that the base portion serves as the bottom of the contactor; and Step h of removing the resist pattern, a part of the seed film, the part being unnecessary for forming the contactor, the resist cone, and the resist film.
According to the method of producing a probe card of the first aspect of the present invention, the base portion can be easily interposed between the wiring pattern and the contactor without significantly changing a known method of producing a probe card. Accordingly, a probe card in which the amount of movement of a contactor is increased without changing the diameter or the height of the contactor can be easily produced. Consequently, the probe card and the method of producing a probe card according to the first aspect of the present invention are advantageous in that the amount of movement of a contactor can be increased even when the diameter of the contactor is decreased, as compared with a probe card not having a base portion.
A method of producing a probe card of a second aspect of the present invention includes Step a of forming a resist film using a resin on a surface of a wiring board having a wiring pattern; Step b of forming a columnar through-hole in the resist film to expose the wiring pattern of the wiring board; Step c of forming a columnar base portion using a conductive material on the surface of the wiring pattern exposed in the through-hole of the resist film; Step i of baking the resist film after Step b or after Step c; Step d of forming a resist cone using a resin without covering the entire surface of the base portion on the surface of the resist film after Step c and Step i; Step e of forming a seed film on the side face of the resist cone; Step f of applying a resin on the side face of the resist cone having the seed film thereon and on the surface of the base portion, and exposing and developing the resin to form a resist pattern having a spiral groove extending from the base portion; Step g of forming a three-dimensional spiral contactor on the seed film exposed in the groove of the resist pattern and on the surface of the base portion such that the base portion serves as the bottom of the contactor; and Step j of removing the resist pattern, a part of the seed film, the part being unnecessary for forming the contactor, and the resist cone, and leaving the baked resist film as an elastic film on the surface of the wiring board and below the contactor.
According to the method of producing a probe card of the second aspect of the present invention, the base portion can be easily interposed between the wiring pattern and the contactor without significantly changing a known method of producing a probe card. Accordingly, a probe card in which the amount of movement of a contactor is increased without changing the diameter or the height of the contactor can be easily produced. Furthermore, the resist film can be reused as the elastic film without removing the resist film. Accordingly, a probe card including an elastic film that reduces an impact force applied to an object to be tested and the probe card when the contactor contacts the object can be produced. Therefore, even when the contactor remains fully contracted, application of a large impact force on an object to be tested or the probe can be suppressed. Consequently, the probe card and the method of producing a probe card according to the second aspect of the present invention are advantageous in that even when the contractor remains fully contracted, damage of an object to be tested and the probe card can be prevented.
Probe cards and methods of producing the probe cards will now be described with reference to the drawings using two embodiments.
First, a probe card 1A of a first embodiment will be described with reference to
The wiring board 2 includes a wiring substrate 2a formed so as to have a flat-plate shape using an insulating material and a wiring pattern 2b formed on the surface or an inner layer of the wiring substrate 2a using a conductive material. It is sufficient that the wiring pattern 2b is a conductor. Accordingly, the wiring pattern 2b may be a surface electrode shown in
The base portion 3 is disposed on the surface of the wiring pattern 2b and formed so as to have a columnar shape using a conductive material. In the first embodiment, the height H2 of this base portion 3 is about 5% to 20% of the height H1 of the contactor 4. As described below, the base portion 3 of the first embodiment is formed so as to have a circular columnar shape by plating using Cu or Ni-P.
The contactor 4 is formed so as to have a three-dimensional spiral shape using a conductive material that easily exhibits an elastic force, such as Ni-P. A bottom 4a of the contactor 4 is connected to the surface of the base portion 3. In the first embodiment, the diameter of the contactor 4 is in the range of 30 to 300 μm, and the height H1 of the contactor 4 is in the range of 30% to 100% of the diameter of the contactor 4.
A method of producing the probe card 1A of the first embodiment will now be described with reference to
In Step a, as shown in
In step b, as shown in
In Step c, as shown in
In Step d, as shown in
In Step e, as shown in
In Step f, as shown in
In Step g, as shown in
In Step h, as shown in
Operations of the probe card 1A of the first embodiment and the method of producing the probe card 1A will now be described with reference to
As described above, the probe card 1A of the first embodiment includes the wiring board 2, the base portion 3, and the contactor 4, as shown in
Since the height H2 of the base portion 3 is in the range of 5% to 20% of the height H1 of the contactor 4, the amount of stoke of the contactor 4 is increased by about 5% to 20%. Accordingly, in the three-dimensional spiral contactor 4 whose aspect ratio is difficult to change, even when the height of the base portion 3 is small, the amount of movement of the contactor 4 can be markedly increased.
As described above, the probe card 1A of the first embodiment is produced by Step a to Step h, as shown in
That is, according to the probe card 1A of the first embodiment, by forming the base portion 3, the amount of movement of the contactor 4 can be increased without changing the diameter or the height of the contactor 4. In addition, according to the method of producing the probe card 1A of the first embodiment, the base portion 3 can be easily formed between the wiring pattern 2b and the contactor 4. Accordingly, the probe card 1A and the method of producing the probe card 1A are advantageous in that even when the diameter of the contactor 4 is small, the amount of movement can be increased, as compared with the known probe card 101 not including a base portion 3.
Next, a probe card 1B of a second embodiment will now be described with reference to
The elastic film 5 is provided on the surface of the wiring board 2 and below the contactor 4 in the form of a film using an elastic material. Any material, such as rubber or a resin, may be selected as the elastic material used for the elastic film 5 as long as the material exhibits a large elastic force against an external force. A photoresist material such as a novolak resin is used as the elastic material of the second embodiment. This is because a resist film 11 used in the formation of the base portion 3 is used as the elastic film 5 without further treatment. The thickness of the elastic film 5 is determined so that the height H2 of the base portion 3 is the upper limit of the thickness of the elastic film 5. The height H2 of the base portion 3 is in the range of 5% to 20% of the height H1 of the contactor 4. The thickness of the elastic film 5 does not exceed the height H2 of the base portion 3.
The probe card 1B of the second embodiment is formed by nine steps of Step a to Step c, Step i, Step d to Step g, and Step j in that order. Step a to Step c and Step d to Step g are the same as the first embodiment. Step i and Step j are different from the first embodiment. Accordingly, these steps will now be described with reference to
In Step a, as shown in
In step b, as shown in
In Step i, in the state shown in
In Step d, as shown in
In Step f, as shown in
In Step g, as shown in
In Step j, as shown in
Operations of the probe card 1B of the second embodiment and the method of producing the probe card 1B will now be described with reference to
As shown in
Furthermore, in the probe card 1B of the second embodiment, the elastic film 5 is disposed on the surface of the wiring board 2 and below the contactor 4. When the contactor 4 contacts the elastic film 5, the modulus of elasticity of the contactor 4 is increased by an amount corresponding to the modulus of elasticity of the elastic film 5.
That is, since the elastic film 5 is interposed between the contactor 4 and the wiring board 2, the elastic film 5 functions as a buffer material and prevents a large impact force from being applied from the contactor 4 to the wiring board 2. Therefore, an impact force applied to an object to be tested, such as a semiconductor component, and the probe card 1B on which the contactor 4 is provided can be reduced.
The probe card 1B of the second embodiment is formed by nine steps of Step a to Step c, Step i, and Step d to Step g, and Step j in that order. Among these steps, Step i and Step j differ from the steps in the first embodiment. Since the resist film 11 is baked in Step i in the second embodiment, as shown in
According to the probe card 1B of the second embodiment, in addition to the operations obtained by the probe card 1A of the first embodiment, the following operation can be achieved. Specifically, by forming the elastic film 5, when the contactor 4 contacts the elastic film 5, the elastic film 5 exerts an elastic force on the contactor 4. Furthermore, according to the method of producing the probe card 1B, the resist film 11 can be reused as the elastic film 5. Accordingly, in addition to the operations obtained by the probe card 1A of the first embodiment and the method of producing the probe card 1A, an application of a large impact force to an object to be tested or the probe card can be suppressed even when the contactor 4 remains fully contracted. Accordingly, this method can provide an operation that damage of the object to be tested or the probe card can be prevented even when the contactor 4 remains fully contracted.
The present invention is not limited to, for example, the above-described embodiments, and various modifications can be made according to need.
For example, as shown in
The contactors 4 of the first embodiment and the second embodiment are formed by metal plating. Alternatively, a contactor 4 of another embodiment may be made of an insulating material, such as a ceramic material or silicon, which can exert an elastic force larger than that obtained by Ni-P. In such a case, a conducting portion is formed on the surface of the insulating material having a shape similar to the three-dimensional spiral contactor 4 by metal plating or the like. Thus, a conductive contactor 4 can be formed.
Number | Date | Country | Kind |
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2007-128087 | May 2007 | JP | national |