Claims
- 1. A process for cleaning electronic parts or precision parts which comprises the steps of:
- washing said parts with a cleaning agent composition,
- rinsing the washed parts with water having a temperature of from 5.degree. to 100.degree. C. to obtain a rinsing waste water, and
- maintaining the rinsing waste water at a temperature of at least 20.degree. C., said temperature being equal to or higher than the clouding point of a nonionic surface active agent contained in the cleaning agent composition to effect separation of organic substances from a water phase;
- wherein said cleaning agent composition contains 10 to 49 wt % of water and, as active cleaning agent components, the nonionic surface active agent in an amount of from 33.3 to 99% based on the total weight of said active cleaning agent components and having a clouding point at from 20.degree. to 100.degree. C., and a compound selected from the group consisting of hydrocarbon compounds and slightly water soluble alkyl esters and alkyl ketones, and said cleaning agent composition is such that 70% by weight or more of organic substances separate from the water phase when said composition is made into an aqueous solution having an organic substance content of 5% by weight adjusted by diluting it with water or by evaporating water from it and the resulting cleaning agent aqueous solution is subsequently allowed to stand still for 30 minutes at a temperature of from 20.degree. to 100.degree. C.
- 2. The cleaning process according to claim 1, wherein a clarified portion of said rinsing waste water, resulting from the separation and removal of organic substances, is recycled and used again as a rinsing liquid.
- 3. The cleaning process according to claim 1, wherein said nonionic surface active agent and said compound constitute at least 50% by weight of the total organic component of the composition.
- 4. The cleaning process according to claim 1, wherein said nonionic surface active agent and said compound constitute at least 70% by weight of the total organic component of the composition.
- 5. The cleaning process according to claim 1, wherein said nonionic surface active agent is selected from the group consisting of an ether, ester, amine-condensation, amide-condensation, Pluronic, Tetronic and poly-ethyeneimine-based surface active agent.
- 6. The cleaning process according to claim 1, wherein said rinsing step occurs with water having a temperature of from 20.degree. to 70.degree. C.
- 7. The cleaning process according to claim 1, wherein said rinsing waste water is maintained at a temperature of 20.degree. to 100.degree. C.
- 8. The cleaning process according to claim 1, wherein said rinsing waste water is maintained at a temperature of 20.degree. to 70.degree. C.
Priority Claims (1)
Number |
Date |
Country |
Kind |
3-257745 |
Oct 1991 |
JPX |
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Parent Case Info
This is a continuation of application No. 07/956,297 filed Oct. 5, 1992 now abandoned.
US Referenced Citations (5)
Foreign Referenced Citations (4)
Number |
Date |
Country |
0402981 |
Dec 1990 |
EPX |
0419089 |
Mar 1991 |
EPX |
0464652 |
Jan 1992 |
EPX |
0466054 |
Jan 1992 |
EPX |
Non-Patent Literature Citations (2)
Entry |
JP-A-54 149 330 Abstract. |
Rep. Asahi Glass Found Ind. Technol., vol. 36, 1980, pp. 169-183, K. Shinoda, "How to Attain Very LowInterfacialTension at Oil-water interface?". |
Continuations (1)
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Number |
Date |
Country |
Parent |
956297 |
Oct 1992 |
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