Cleaning or polishing of the conductive pattern

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CPC
H05K3/26

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/26Cleaning or polishing of the conductive pattern

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Wiring substrate and method for manufacturing wiring substrate
- Patent number 12,144,121
- Issue date Nov 12, 2024
- Ibiden Co., Ltd.
- Takema Adachi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing printed wiring board
- Patent number 12,058,818
- Issue date Aug 6, 2024
- Ibiden Co., Ltd.
- Satoru Kawai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for manufacturing printed circuit board
- Patent number 11,997,799
- Issue date May 28, 2024
- SHENNAN CIRCUITS CO., LTD.
- Changsheng Tang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and method for manufacturing wiring substrate
- Patent number 11,792,929
- Issue date Oct 17, 2023
- Ibiden Co., Ltd.
- Takema Adachi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Unit unloading system
- Patent number 11,706,875
- Issue date Jul 18, 2023
- Rokko Systems Pte Ltd.
- Yun Suk Shin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Display device and method of manufacturing the same
- Patent number 11,538,887
- Issue date Dec 27, 2022
- Samsung Display Co., Ltd.
- Jong Man Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing wiring substrate
- Patent number 11,523,515
- Issue date Dec 6, 2022
- Ibiden Co., Ltd.
- Shinichiro Ichikawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for making contact with a component embedded in a printed ci...
- Patent number 11,523,520
- Issue date Dec 6, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Gerald Weidinger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Polishing composition and polishing method
- Patent number 11,492,512
- Issue date Nov 8, 2022
- FUJIMI INCORPORATED
- Yukinobu Yoshizaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing wiring board or wiring board material
- Patent number 11,490,522
- Issue date Nov 1, 2022
- Daiwa Co., Ltd.
- Yoshimura Eiji
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and equipment for the treatment of panels
- Patent number 11,483,933
- Issue date Oct 25, 2022
- WISE S.R.L.
- Massimo Fiorani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cleaning solution for cleaning metal surfaces
- Patent number 11,473,036
- Issue date Oct 18, 2022
- Atotech Deutschland GmbH
- Eckart Klusmann
- B08 - CLEANING
Information Patent Grant
System producing a conductive path on a substrate
- Patent number 11,464,114
- Issue date Oct 4, 2022
- Orbotech Ltd.
- Zvi Kotler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and manufacturing method therefor
- Patent number 11,464,117
- Issue date Oct 4, 2022
- LG Innotek Co., Ltd
- Hee Young Chung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Compositions comprising trans-1,2-dichloroethylene and an organic c...
- Patent number 11,447,725
- Issue date Sep 20, 2022
- SHELLEF HOLDINGS INC.
- Dov Shellef
- B08 - CLEANING
Information Patent Grant
Method for manufacturing water resistant printed circuit board
- Patent number 11,439,024
- Issue date Sep 6, 2022
- Steering Solutions IP Holding Corporation
- Shawn M. Barber
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and method of manufacturing the same
- Patent number 11,430,725
- Issue date Aug 30, 2022
- Shinko Electric Industries Co., Ltd.
- Noriyoshi Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board and method for manufacturing same
- Patent number 11,399,426
- Issue date Jul 26, 2022
- NGK Spark Plug Co., Ltd.
- Toshio Suzuki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Ionic contaminant cleaning
- Patent number 11,304,304
- Issue date Apr 12, 2022
- International Business Machines Corporation
- Vincent Y C Cai
- B08 - CLEANING
Information Patent Grant
Circuit board and light emitting device including circuit board
- Patent number 11,304,291
- Issue date Apr 12, 2022
- Kyocera Corporation
- Yuichi Abe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic etching using photopolymerizable compound
- Patent number 11,266,022
- Issue date Mar 1, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Jolanta Klocek
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for repairing a fine line
- Patent number 11,212,921
- Issue date Dec 28, 2021
- GUANGDONG UNIVERSITY OF TECHNOLOGY
- Chengqiang Cui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing a printed circuit board structure
- Patent number 11,172,576
- Issue date Nov 9, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Johannes Stahr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compositions containing trans-1,2-dichloroethylene and a hydrofluor...
- Patent number 11,124,744
- Issue date Sep 21, 2021
- SHELLEF HOLDINGS INC.
- Dov Shellef
- B08 - CLEANING
Information Patent Grant
Method for manufacturing ceramic circuit board
- Patent number 11,129,282
- Issue date Sep 21, 2021
- Kabushiki Kaisha Toshiba
- Hiromasa Kato
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Desmearing method and desmearing device
- Patent number 11,102,889
- Issue date Aug 24, 2021
- Ushio Denki Kabushiki Kaisha
- Kenichi Hirose
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermally conductive board
- Patent number 11,044,817
- Issue date Jun 22, 2021
- Polytronics Technology Corp.
- Kuo-Hsun Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing connection substrate
- Patent number 11,013,127
- Issue date May 18, 2021
- NGK Insulators, Ltd.
- Tatsuro Takagaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and method of manufacturing the same
- Patent number 10,978,383
- Issue date Apr 13, 2021
- Shinko Electric Industries Co., Ltd.
- Noriyoshi Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compositions comprising trans-1,2-dichloroethylene and an organic c...
- Patent number 10,934,507
- Issue date Mar 2, 2021
- SHELLEF HOLDINGS INC.
- Dov Shellef
- B08 - CLEANING

Patents Applicationslast 30 patents

Information Patent Application
CURABLE RESIN COMPOSITION AND PROCESS FOR PRODUCING PRINTED WIRING...
- Publication number 20240417586
- Publication date Dec 19, 2024
- TAIYO HOLDINGS CO., LTD.
- Yasuyo KANAZAWA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
METHOD FOR MANUFACTURING MULTILAYER THIN-FILM FPCB AND HEATER
- Publication number 20240414852
- Publication date Dec 12, 2024
- Seoul National University R&DB Foundation
- Seung Hwan KO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier and Method Manufacturing the Same
- Publication number 20240334613
- Publication date Oct 3, 2024
- AT&S (Chongqing) Company Limited
- JyunMin WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITION FOR DEFLUXING ELECTRONIC ASSEMBLIES
- Publication number 20240240116
- Publication date Jul 18, 2024
- DEHON
- Christophe DEHON
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Application
MULTILAYER SUBSTRATE MANUFACTURING METHOD AND WIRING SUBSTRATE
- Publication number 20240196530
- Publication date Jun 13, 2024
- Mitsui Mining and Smelting Co., Ltd.
- Yukiko KITABATAKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODIFIED COPPER SURFACE, HETEROAROMATIC SILANE COMPOUNDS AND THEIR...
- Publication number 20240179851
- Publication date May 30, 2024
- Atotech Deutschland GmbH & Co. KG
- Valentina BELOVA-MAGRI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20240164013
- Publication date May 16, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Jae Heun LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICES, SYSTEMS, AND METHODS FOR MAKING AND USING HIGHLY SUSTAINAB...
- Publication number 20240147631
- Publication date May 2, 2024
- Liquid Wire, LLC
- Jorge E. Carbo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL RESIDUE REMOVING LIQUID, METAL RESIDUE REMOVING METHOD, AND M...
- Publication number 20240117280
- Publication date Apr 11, 2024
- Tokyo Ohka Kogyo Co., Ltd.
- Ivan Ryzhii
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Application
Probe Card and Method of Manufacturing Thereof
- Publication number 20240044941
- Publication date Feb 8, 2024
- Nippon Telegraph and Telephone Corporation
- Ai Yanagihara
- G01 - MEASURING TESTING
Information Patent Application
Printed Circuit Board and Manufacturing Method Thereof
- Publication number 20230413430
- Publication date Dec 21, 2023
- UNIMICRON TECHNOLOGY CORPORATION
- Po-Hsiang Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method For Manufacturing Ceramic Circuit Board
- Publication number 20230390845
- Publication date Dec 7, 2023
- Kabushiki Kaisha Toshiba
- Akito SASAKI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
A MANUFACTURING PROCESS TO ENHANCE SURFACE MOUNT SOLDER PAD JOINT F...
- Publication number 20230269884
- Publication date Aug 24, 2023
- Fraser Murray SHAW
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PLATING METHOD AND METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD
- Publication number 20230209721
- Publication date Jun 29, 2023
- Nitto Denko Corporation
- Shotaro NAGAOKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING MULTI-LAYER CIRCUIT BOARD INCLUDING EXTREME...
- Publication number 20230147650
- Publication date May 11, 2023
- TSE CO., LTD.
- Byeong Yong LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE
- Publication number 20230113278
- Publication date Apr 13, 2023
- IBIDEN CO., LTD.
- Takema Adachi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC CIRCUIT MANUFACTURING METHOD FOR SELF-ASSEMBLY TO ANOTHE...
- Publication number 20230061111
- Publication date Mar 2, 2023
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Alice Bond
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING WIRING SUBSTRATE
- Publication number 20230063719
- Publication date Mar 2, 2023
- IBIDEN CO., LTD.
- Michimasa TAKAHASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING PRINTED WIRING BOARD
- Publication number 20230030601
- Publication date Feb 2, 2023
- IBIDEN CO., LTD.
- Satoru KAWAI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD, AND PRINTED CIRCUIT...
- Publication number 20220256716
- Publication date Aug 11, 2022
- SHENNAN CIRCUITS CO., LTD.
- CHANGSHENG TANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE
- Publication number 20220248533
- Publication date Aug 4, 2022
- IBIDEN CO., LTD.
- Takema ADACHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220225510
- Publication date Jul 14, 2022
- QING DING PRECISION ELECTRONICS (HUAIAN) CO.,LTD
- HSIAO-TING HSU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONCENTRATED LIQUID OF POLISHING COMPOSITION AND POLISHING METHOD U...
- Publication number 20220025213
- Publication date Jan 27, 2022
- Fujimi Incorporated
- Yoshihiro Izawa
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SURFACE TREATMENT DEVICE
- Publication number 20210402424
- Publication date Dec 30, 2021
- UNIVERSAL CIRCUIT BOARD EQUIPMENT CO., LTD.
- Takwo CHAN
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
Advanced Manufacturing Method for the Manufacturing of High-Precisi...
- Publication number 20210282268
- Publication date Sep 9, 2021
- Alexandre Perry Kamel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING WIRING SUBSTRATE
- Publication number 20210235584
- Publication date Jul 29, 2021
- IBIDEN CO., LTD.
- Shinichiro ICHIKAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING WIRING BOARD OR WIRING BOARD MATERIAL
- Publication number 20210195755
- Publication date Jun 24, 2021
- DAIWA CO., LTD.
- YOSHIMURA Eiji
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
System Producing a Conductive Path on a Substrate
- Publication number 20210195756
- Publication date Jun 24, 2021
- ORBOTECH LTD.
- Zvi KOTLER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR REPAIRING A FINE LINE
- Publication number 20210176865
- Publication date Jun 10, 2021
- Guangdong University of Technology
- Chengqiang CUI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IONIC CONTAMINANT CLEANING
- Publication number 20210144862
- Publication date May 13, 2021
- International Business Machines Corporation
- Vincent YC Cai
- B08 - CLEANING

Cleaning or polishing of the conductive pattern

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Wiring substrate and method for manufacturing wiring substrate

Method for manufacturing printed wiring board

Method for manufacturing printed circuit board

Wiring substrate and method for manufacturing wiring substrate

Unit unloading system

Display device and method of manufacturing the same

Method for manufacturing wiring substrate

Method for making contact with a component embedded in a printed ci...

Polishing composition and polishing method

Method for manufacturing wiring board or wiring board material

Method and equipment for the treatment of panels

Cleaning solution for cleaning metal surfaces

System producing a conductive path on a substrate

Printed circuit board and manufacturing method therefor

Compositions comprising trans-1,2-dichloroethylene and an organic c...

Method for manufacturing water resistant printed circuit board

Wiring board and method of manufacturing the same

Wiring board and method for manufacturing same

Ionic contaminant cleaning

Circuit board and light emitting device including circuit board

Anisotropic etching using photopolymerizable compound

Method for repairing a fine line

Method for producing a printed circuit board structure

Compositions containing trans-1,2-dichloroethylene and a hydrofluor...

Method for manufacturing ceramic circuit board

Desmearing method and desmearing device

Thermally conductive board

Method for producing connection substrate

Wiring board and method of manufacturing the same

Compositions comprising trans-1,2-dichloroethylene and an organic c...

Patents Applicationslast 30 patents

CURABLE RESIN COMPOSITION AND PROCESS FOR PRODUCING PRINTED WIRING...

METHOD FOR MANUFACTURING MULTILAYER THIN-FILM FPCB AND HEATER

Component Carrier and Method Manufacturing the Same

COMPOSITION FOR DEFLUXING ELECTRONIC ASSEMBLIES

MULTILAYER SUBSTRATE MANUFACTURING METHOD AND WIRING SUBSTRATE

MODIFIED COPPER SURFACE, HETEROAROMATIC SILANE COMPOUNDS AND THEIR...

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD FOR THE SAME

DEVICES, SYSTEMS, AND METHODS FOR MAKING AND USING HIGHLY SUSTAINAB...

METAL RESIDUE REMOVING LIQUID, METAL RESIDUE REMOVING METHOD, AND M...

Probe Card and Method of Manufacturing Thereof

Printed Circuit Board and Manufacturing Method Thereof

Method For Manufacturing Ceramic Circuit Board

A MANUFACTURING PROCESS TO ENHANCE SURFACE MOUNT SOLDER PAD JOINT F...

PLATING METHOD AND METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD

METHOD OF MANUFACTURING MULTI-LAYER CIRCUIT BOARD INCLUDING EXTREME...

WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE

ELECTRONIC CIRCUIT MANUFACTURING METHOD FOR SELF-ASSEMBLY TO ANOTHE...

METHOD FOR MANUFACTURING WIRING SUBSTRATE

METHOD FOR MANUFACTURING PRINTED WIRING BOARD

METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD, AND PRINTED CIRCUIT...

WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE

CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

CONCENTRATED LIQUID OF POLISHING COMPOSITION AND POLISHING METHOD U...

SURFACE TREATMENT DEVICE

Advanced Manufacturing Method for the Manufacturing of High-Precisi...

METHOD FOR MANUFACTURING WIRING SUBSTRATE

METHOD FOR MANUFACTURING WIRING BOARD OR WIRING BOARD MATERIAL

System Producing a Conductive Path on a Substrate

METHOD FOR REPAIRING A FINE LINE

IONIC CONTAMINANT CLEANING