Claims
- 1. A process for providing a metallic layer on a polyimide substrate which comprises providing a substrate of a polyimide from diaryl dianhydride and a diamine; sputter coating a layer of chromium of 200 angstroms or less on said substrate at a deposition rate of about 4 angstroms/second or less, and wherein the temperature of said polyimide substrate during the sputtering is about 0° C.±5° C. and resulting in improved adhesion, followed by coating a layer of copper on said layer of chromium.
- 2. The process of claim 1 wherein the thickness of the chromium is about 5 to about 200 angstroms.
- 3. The process of claim 1 wherein said deposition rate is about 0.3 to about 4 angstroms/second.
- 4. The process of claim 1 wherein said polyimide is from biphenyl dianhydride and phenylene diamine.
- 5. The process of claim 1 wherein the copper is deposited by sputtering.
- 6. The process of claim 1 wherein the sputtering is magnetron sputtering.
- 7. The process cf claim 1 wherein the sputtering is carried out at voltage of about 200 to about 500 volts D.C. and pressures of about 0.5 to about 10 M torr.
- 8. The process of claim 1 wherein the thickness of the copper is about 1,000 to about 10,000 angstroms.
- 9. The metallic coated polyimide substrate obtained by the process of claim 1.
- 10. The process cf claim 1 wherein the thickness of the chromium is about 5 to about 20 angstroms.
- 11. The process of claim 1 wherein the thickness of the copper is about 3000 angstroms and about 6000 angstroms.
Parent Case Info
This application is a continuation of Ser. No. 07/995,431, filed on Dec. 23, 1992 now abandoned.
US Referenced Citations (8)
Non-Patent Literature Citations (1)
Entry |
Skeist “Handbook of Adhesives” 2nd Ed. (1977) Van Nostrand, pp 597-599, 612-613. |
Continuations (1)
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Number |
Date |
Country |
Parent |
07/995431 |
Dec 1992 |
US |
Child |
08/266783 |
|
US |