This is a U.S. National Phase Application Under 35 USC 371 and applicant herewith claims the benefit of priority of PCT/IT02/00678 filed on Oct. 24, 2002, which was published Under PCT Article 21(2) in English, and of Application No. TO2001A001019 filed in Italy on Oct. 25, 2001.
This invention relates to an improved process for construction of a feeding duct for an ink jet printhead, particularly for a “top-shooter” type ink jet printhead, i.e. one in which the droplets of ink are ejected perpendicularly to the substrate containing the expulsion chambers and the heating elements.
As is known in the sector art, for example from Italian patent No. 1234800, and from U.S. Pat. No. 5,387,314, a printhead of the above-mentioned type is made using as the substrate a portion of a thin disk of crystalline silicon approx. 0.6 mm thick, on which are deposited by way of vacuum processes the heating elements, or resistors, made of portions of an electrically conducting layer and the relative connections with the outside; the resistors are arranged inside cells made in the thickness of a layer of photo-sensitive material, for instance VACREL™, and obtained together with the lateral ink feeding channels in a photolithographic process; the cells are filled with a volume of ink fed through a narrow, oblong feeding duct, shaped as a slot, which traverses the silicon substrate and communicates with the lateral channels of the cells. According to the known art, the slots are made with a wet etching applied to the end opposite the cells, and completed with a laser etching, or with sand blasting.
The known techniques for etching of the slots have the drawback that the edge of the slot facing the cells has geometrical irregularities caused either by the action of the grains of abrasive used for sand blasting, or by cracks and fissures caused by an incipient melting of the material if a laser beam is used for the etching; these irregularities disturb the flow of ink at the entrance to the cells and are particularly damaging in the case of very narrow slots, i.e. of width less than 250 μm approx., and in multiple heads with slots side by side in the same portion of the silicon substrate.
The main object of this invention is therefore that of defining an improved process for the manufacture of a feeding duct for an ink jet printhead exempt of the drawbacks mentioned above and in particular having a slot-like aperture of a very low width local to the expulsion cells, to permit multiple heads, and/or heads with a large number of nozzles, to be produced on the same silicon substrate, capable of ejecting very small droplets (<5 pl), particularly suitable for printing images with photographic resolution.
In accordance with this invention, an improved process for the manufacture of a feeding duct for an ink jet printhead, characterized as defined in the main claim, is now presented.
This and other characteristics of the invention shall appear more clearly from the following description of a preferred embodiment of the process for processing the feeding duct, provided by way of non-restricting example, with reference to the figures in the accompanying drawings.
With reference to
The head 1 is made of a support element or dice 3 of crystalline silicon, cut from a larger disc or wafer with crystallographic orientation <100> (
A plurality of cells 8 for expulsion of the ink are made in the thickness of a layer of photosensitive type resin 9, known in the sector art, and communicate hydraulically through channels 10 with the feeding duct 2, constructed according to the process the subject of this invention.
On the bottom of each cell 8 are the heating elements 11, made in a known way, from a layer of electrically resistive material, placed between isolating layers made of silicon nitrides and carbides; the heating elements 11 are in turn electrically connected to electric conductors 12 made in a layer of conducting material, such as aluminium, tantalum, etc. which are connected to external electronic circuits for supplying the electrical pulses for expulsion of the droplets of ink.
Finally on the layer of resin 9 a lamina 14 is stuck, which may be of a metal, such as gold, or nickel, or an alloy thereof, or of a resin, such as Kapton™, which bears the nozzles 15 for ejection of the ink droplets, arranged in correspondence with each cell 8.
The substrate 3 (
Each of the layers 17 and 18 is coated with a protective layer 19 of a photosensitive substance. The photosensitive substance normally consists of epoxy and/or acrylic resins, polimerisable through the effect of light radiations.
The protective layer 19, covering the passivator rear surface 18, after being exposed to light with a suitable mask, is developed and partially removed using the known photolithographic technique, to form a rectangular shape aperture 20, elongated in the direction parallel to the crystallographic axis <110> of the silicon substrate 3 (
The aperture 20 leaves uncovered a zone 21 of the underlying layer 18 of SiO2, suitable for being corroded subsequently and chemically removed with a selective etching solution based on hydrofluoric acid (HF), to free a corresponding area 22 of the silicon substrate 3 (
A fuller description of the structure of an ink jet printhead of the type shown in
The work for producing the feeding duct 2, according to this invention, starts on the rear surface 6, with a dry etching operation, for instance sand-blasting, of the area 22, performed for a depth P1 of approx. 30% of the thickness of the substrate 3 (
The work continues with an anisotropic electrolytic corrosion operation, in a chemical etching bath, using one of the known anisotropic solutions based on ethylenediamine and pyrocatechol, or based on potassium hydroxide, or again on hydrazine.
Each of the solutions used has a maximum etching gradient “G100”, which develops according to the direction of the crystallographic axis <100> of the substrate 3 and varying between 0.75 and 1.8 μm/min, at a temperature of roughly 90° C., whereas the ratio G100/G111, where G111 is the gradient of anisotropic etching according to the crystallographic axis direction <111>, may range between 35:1 and 400:1.
Accordingly the chemical etching in this stage of the process proceeds preferably in the characteristic direction <100> and much less in the direction <111 (see
In a preferred embodiment, according to the invention, the chemical etching action is continued until such time as the depth P2 of the cavity 26 reaches a prefixed value of approximately 50% of the thickness of the substrate 3, while the rear wall 28 of the excavation attains a width L1 of approximately 150 μm, so as to leave a diaphragm 30 between the rear wall 28 and the front surface 5 of thickness P3 of approximately 100 μm +/−20 μm, equal to roughly 15%–20% of the thickness of the substrate 3.
At this point, the construction of the feeding duct 2 is interrupted in order to proceed to deposition on the front surface 5 (
In a second stage of the process, according to the invention, on the layers 7 already deposited on the front surface 5 (
The layer 34 of photoresist is exposed through a thin mask 35, of a particular design, according to this invention, and developed in order to bound the outlet area 2a (
The mask 35 used in this stage of the manufacturing process contains an aperture 36 consisting of a groove 37 of width Ls, in the shape of a closed, narrow ring elongated in a direction parallel to the crystallographic direction <110> of the silicon substrate 3.
The width Ls of the groove 37 is preferably established as 10–50 μm, whereas the distance La between the external, opposite long sides 38 of the aperture 36 is between 100 and 130 μm, and in any case not greater than the width L1 defined above.
The external long sides 38 of the groove 37 and the distance La between them define respectively the profile and the width of the final outlet aperture 2a of the feeding duct 2, in correspondence with the front surface 5; the length of the long sides 38 in the direction <110> depends mainly on the number of nozzles foreseen.
The next step of the process consists in removing the material in the area of the groove 37 in the direction of the rear wall 28, to form a channel 40 (
At the end of this operation, the layer of positive photoresist 34 is removed. In its place, on the front surface 5, a film 9 (
Spread on the photosensitive film 9, accordingly worked, is a protective layer 44 of Emulsitone™ (
At this point, the diaphragm 30 is taken away in a cutting operation, preferably employing a beam of copper vapour laser rays; this choice is dictated by the fact that the copper vapour laser allows cutting with extremely high precision of the diaphragm 30, with a low heating of the material around the cut. The laser beam is applied from the rear surface 6 side, against the wall 28 of the recess 26, and is interrupted when the cut reaches the bottom of the channel 40;
by using a laser cut, the walls of the channel thus formed remain perfectly delimited and above all, the layers comprising the head 1 in close proximity of the cutting zone are not damaged, thanks to the limited heating generated by the laser.
Alternatively, progressive sand-blasting may be used to take away the diaphragm 30, where applied from the rear part of the substrate 3, against the wall 28, taking care to successively erode thin layers of material, for example by bringing the sand-blasting nozzle progressively closer, until the cutting reaches the bottom of the channel 40, and results in the detachment of the portion of silicon 45 located inside.
As has been seen, with the manufacturing process described, according to the invention, the feeding duct 2 is made in three successive stages, of which the first stage and the third stage are performed at the rear of the substrate 3, while the second stage is performed at the front. In this way, the edge of the feeding duct at the outlet 2a in correspondence with the front surface 5 is produced in the second stage, obtaining maximal precision of dimensions and surface finish, ensured by employing a dry etching in an area with perfectly delineated contours, which can only be obtained by using a mask 35. Furthermore, this avoids the erosive agents of the diaphragm 30, such as sand-blasted grains, or other erosive means, used in the step of removing the diaphragm 30, from impairing the precision produced edge 39, without flakings, and/or irregularities.
Later the layer of Emulsitone™ is eliminated and a sheet of Kapton™ 14 (
It will be understood that changes or variants may be made to the manufacturing process of the feeding duct for an ink jet printhead, according to the invention, and that the head produced in this way may have its shapes and dimensions modified, without however departing from the scope of the invention.
Number | Date | Country | Kind |
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TO01A1019 | Oct 2001 | IT | national |
Filing Document | Filing Date | Country | Kind | 371c Date |
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PCT/IT02/00678 | 10/24/2002 | WO | 00 | 4/26/2004 |
Publishing Document | Publishing Date | Country | Kind |
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WO03/035401 | 5/1/2003 | WO | A |
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4169008 | Kurth | Sep 1979 | A |
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6164762 | Zbrozek et al. | Dec 2000 | A |
6402301 | Powers et al. | Jun 2002 | B1 |
6805432 | Milligan et al. | Oct 2004 | B1 |
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0 430 593 | Jun 1991 | EP |
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Number | Date | Country | |
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20040252166 A1 | Dec 2004 | US |