Claims
- 1. A process for electroplating a plurality of pins extending from an integrated circuit package, said pins each having a side surface and an extremity, the process comprising:contacting each of said plurality of pin extremities with a flexible contact finger extending from a single electrically conductive plate, said conductive plate defining a plane, and said flexible contact fingers extending away from said plane; placing said pins to be electroplated in a plating bath; and applying a potential difference between said plating bath and said conductive plate.
- 2. The process of claim 1 wherein the step of contacting each of said plurality of pin extremities with a flexible contact finger comprises:positioning said pins at a first position in which said pins are disengaged from said flexible contact fingers; moving at least one of said pins and said flexible contact fingers in a lateral direction to a second position in which said pins engage said flexible contact fingers; and moving at least one of said pins and said flexible contact fingers in a lateral direction to a third position in which said pins are disengaged from said flexible contact fingers.
- 3. The process of claim 2 wherein the moving steps include moving said pins relative to said flexible contact fingers.
- 4. The process of claim 1 wherein the step of contacting each of said plurality of pin extremities with a flexible contact finger comprises:positioning said pins at a first position in which said pins are disengaged from said flexible contact fingers; moving at least one of said pins and said flexible contact fingers in a lateral direction to a second position in which said pins engage said flexible contact fingers; and moving at least one of said pins and said flexible contact fingers in a reverse lateral direction to a third position in which said pins are disengaged from said flexible contact fingers.
- 5. The process of claim 4 wherein the moving steps include moving said pins relative to said flexible contact fingers.
- 6. The process of claim 1 wherein the step of contacting each of said plurality of pin extremities with a flexible contact finger comprises:positioning said pins at a first position in which said pins are disengaged from said flexible contact fingers; moving at least one of said pins and said flexible contact fingers in a vertical direction to a second position in which said pins engage said flexible contact fingers; and moving at least one of said pins and said flexible contact fingers in a vertical direction to a third position in which said pins are disengaged from said flexible contact fingers.
- 7. The process of claim 6 wherein the moving steps include moving said pins relative to said flexible contact fingers.
- 8. The process of claim 1 wherein said contact plate is electrically connected to a power source to apply the potential difference between said plating bath and said conductive plate.
Parent Case Info
This application is a divisional of U.S. patent application Ser. No. 09/282,133 filed on Mar. 31, 1999, now U.S. Pat. No. 6,197,171.
US Referenced Citations (11)