Number | Date | Country | Kind |
---|---|---|---|
1-73135 | Mar 1989 | JPX |
This application is a continuation of now abandoned application, Ser. No. 07/498,712 filed on Mar. 22, 1990.
Number | Name | Date | Kind |
---|---|---|---|
4324589 | Gulla | Apr 1982 | |
4383016 | Postupack | May 1983 | |
4440847 | Whittemore | Apr 1984 | |
4504529 | Sorensen | Mar 1985 | |
4585502 | Uozu | Apr 1986 | |
4859571 | Cohen | Aug 1989 | |
4915985 | Maxfield | Apr 1990 | |
4920254 | DeCamp | Apr 1990 |
Entry |
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IBM Technical Disclosure Bulletin, vol. 31, No. 5, Oct. 1988, pp. 370-372, New York, US; "Precatalyzed epoxy formulations for electroless plating". |
RCA Technical Notes, No. 768, Apr. 1968, pp. 2-3; R. J. Ryan: "Printed circuit techniques". |
Extended Abstracts, The Electrochemical Society, Inc. Fall Meeting Las Vegas, Nevada, Oct. 17th-22nd 1976, vol. 76-2, abstract No. 273; G. Messner: "imaging processes for electrolessly deposited conductors". |
Number | Date | Country | |
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Parent | 498712 | Mar 1990 |