using masks

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H05K3/184

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

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H05K3/184using masks

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Printed circuit board and method for manufacturing the same
- Patent number 12,022,621
- Issue date Jun 25, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Mi Jeong Jeon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and method of manufacturing the same
- Patent number 11,889,634
- Issue date Jan 30, 2024
- LG Innotek Co., Ltd
- Jung Ho Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plated metallization structures
- Patent number 11,862,518
- Issue date Jan 2, 2024
- Analog Devices International Unlimited Company
- Jan Kubik
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electroless metal-defined thin pad first level interconnects for li...
- Patent number 11,728,258
- Issue date Aug 15, 2023
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board
- Patent number 11,558,959
- Issue date Jan 17, 2023
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jin Uk Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive fabric and its preparation and applications
- Patent number 11,546,974
- Issue date Jan 3, 2023
- Formosa Taffeta Co., Ltd.
- Fang-Jong Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit nanofiber web manufacturing method
- Patent number 11,324,123
- Issue date May 3, 2022
- Amogreentech Co., Ltd.
- In Yong Seo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electroless metal-defined thin pad first level interconnects for li...
- Patent number 11,257,745
- Issue date Feb 22, 2022
- Intel Corporation
- Aleksandar Aleksov
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Implantable thin film devices
- Patent number 11,191,952
- Issue date Dec 7, 2021
- Pacesetter, Inc.
- John R. Gonzalez
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and method of manufacturing the wiring substrate
- Patent number 11,109,491
- Issue date Aug 31, 2021
- Seiko Epson Corporation
- Yutaka Yamazaki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of manufacturing printed circuit board
- Patent number 10,912,202
- Issue date Feb 2, 2021
- LG Innotek Co., Ltd
- Jung Ho Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit surface finish, method of use, and assemblies made...
- Patent number 10,902,967
- Issue date Jan 26, 2021
- Kunal Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing support structures for lighting devices and...
- Patent number 10,797,211
- Issue date Oct 6, 2020
- Osram GmbH
- Lorenzo Baldo
- F21 - LIGHTING
Information Patent Grant
Fabrication method of substrate structure
- Patent number 10,764,995
- Issue date Sep 1, 2020
- Siliconware Precision Industries Co., Ltd.
- Jin-Wei You
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
System and method for manufacture of circuit boards
- Patent number 10,750,618
- Issue date Aug 18, 2020
- University of Hawaii
- David Garmire
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metallization structure and manufacturing method thereof
- Patent number 10,750,619
- Issue date Aug 18, 2020
- Industrial Technology Research Institute
- Ming-Huei Yen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plated metallization structures
- Patent number 10,699,948
- Issue date Jun 30, 2020
- Analog Devices Global Unlimited Company
- Jan Kubik
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Printed circuit surface finish, method of use, and assemblies made...
- Patent number 10,566,103
- Issue date Feb 18, 2020
- Kunal Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photosensitive resin composition, photosensitive element, method fo...
- Patent number 10,564,543
- Issue date Feb 18, 2020
- Hitachi Chemical Company, Ltd.
- Shota Okade
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Method for producing wired circuit board
- Patent number 10,524,363
- Issue date Dec 31, 2019
- Nitto Denko Corporation
- Yuu Sugimoto
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Method for forming resist pattern, method for manufacturing printed...
- Patent number 10,520,816
- Issue date Dec 31, 2019
- Hitachi Chemical Company, Ltd.
- Masakazu Kume
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Conductive film, touch panel sensor, and touch panel
- Patent number 10,452,217
- Issue date Oct 22, 2019
- FUJIFILM Corporation
- Kohei Higashi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Component carrier and method for manufacturing the same
- Patent number 10,424,541
- Issue date Sep 24, 2019
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Hannes Stahr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Motor and stator thereof
- Patent number 10,424,980
- Issue date Sep 24, 2019
- JOHNSON ELECTRIC INTERNATIONAL AG
- Hui Fang Yu
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Method for manufacturing three-dimensional electronic circuit
- Patent number 10,396,469
- Issue date Aug 27, 2019
- The Charles Stark Draper Laboratory, Inc.
- Gregory M. Fritz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method for manufacturing the same
- Patent number 10,219,383
- Issue date Feb 26, 2019
- Ibiden Co., Ltd.
- Katsutoshi Kitagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit substrate containing photoimageable dielectric m...
- Patent number 10,190,218
- Issue date Jan 29, 2019
- TWISDEN LTD.
- Loke Chew Low
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for fine line manufacturing
- Patent number 10,151,980
- Issue date Dec 11, 2018
- Atotech Deutschland GmbH
- David Thomas Baron
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Embedded thin films
- Patent number 10,064,283
- Issue date Aug 28, 2018
- The Research Foundation for the State University of New York
- Junghyun Cho
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Integrated circuit package having pin up interconnect
- Patent number 10,049,935
- Issue date Aug 14, 2018
- QDOS FLEXCIRCUITS SDN BHD
- Zalina Binti Abdullah
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR MANUFACTURING LAMINATE
- Publication number 20240179848
- Publication date May 30, 2024
- Namics Corporation
- Naoki OBATA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METAL WIRING MANUFACTURING METHOD, TRANSISTOR MANUFACTURING METHOD,...
- Publication number 20240164012
- Publication date May 16, 2024
- Nikon Corporation
- Shohei KOIZUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230337367
- Publication date Oct 19, 2023
- Samsung Electro-Mechanics Co., Ltd.
- Mi Jeong JEON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COPPER CLAD LAMINATE AND METHOD FOR PRODUCING THE SAME
- Publication number 20230284393
- Publication date Sep 7, 2023
- TOYO KOHAN CO., LTD
- Nobuaki MUKAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semi-Additive Process for Printed Circuit Boards
- Publication number 20230247774
- Publication date Aug 3, 2023
- CATLAM, LLC
- Kenneth S. BAHL
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE WHICH INCLUDE MULTI...
- Publication number 20230042852
- Publication date Feb 9, 2023
- HYEJIN KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR MANUFACTURING
- Publication number 20220418113
- Publication date Dec 29, 2022
- Averatek Corporation
- Michael Riley Vinson
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20220217843
- Publication date Jul 7, 2022
- Samsung Electro-Mechanics Co., Ltd.
- Jin Uk Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEPOSITION APPARATUS, METHOD OF DEPOSITION ON A SUBSTRATE, SUBSTRAT...
- Publication number 20220157629
- Publication date May 19, 2022
- APPLIED MATERIALS ITALIA S.R.L.
- Francesca ANTONIOLLI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
IMPLANTABLE THIN FILM DEVICES
- Publication number 20220088375
- Publication date Mar 24, 2022
- PACESETTER, INC.
- John R. Gonzalez
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTROLESS METAL-DEFINED THIN PAD FIRST LEVEL INTERCONNECTS FOR LI...
- Publication number 20220084927
- Publication date Mar 17, 2022
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE CARRIER AND MANUFACTURING METHOD THEREOF
- Publication number 20220022316
- Publication date Jan 20, 2022
- Unimicron Technology Corp.
- Po-Wei Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR MANUFACTURING
- Publication number 20210307177
- Publication date Sep 30, 2021
- Averatek Corporation
- Shinichi Iketani
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR PRODUCING PRINTED WIRING BOARD
- Publication number 20210289637
- Publication date Sep 16, 2021
- C. Uyemura & Co., Ltd.
- Yoshikazu SAIJO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210120677
- Publication date Apr 22, 2021
- LG Innotek Co., Ltd.
- Jung Ho Hwang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE FABRIC AND ITS PREPARATION AND APPLICATIONS
- Publication number 20210120634
- Publication date Apr 22, 2021
- FORMOSA TAFFETA CO., LTD.
- Fang-Jong Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR MANUFACTURING
- Publication number 20210045252
- Publication date Feb 11, 2021
- Averatek Corporation
- Haris BASIT
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PLATED METALLIZATION STRUCTURES
- Publication number 20200328114
- Publication date Oct 15, 2020
- Analog Devices Global Unlimited Company
- Jan Kubik
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR FORMING METALLIZATION STRUCTURE
- Publication number 20200260591
- Publication date Aug 13, 2020
- Industrial Technology Research Institute
- Ming-Huei Yen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ELECTROLESS METAL-DEFINED THIN PAD FIRST LEVEL INTERCONNECTS FOR LI...
- Publication number 20200258827
- Publication date Aug 13, 2020
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wiring Substrate And Method Of Manufacturing The Wiring Substrate
- Publication number 20200045834
- Publication date Feb 6, 2020
- SEIKO EPSON CORPORATION
- Yutaka YAMAZAKI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SYSTEM AND METHOD FOR MANUFACTURE OF CIRCUIT BOARDS
- Publication number 20190327837
- Publication date Oct 24, 2019
- University of Hawaii
- David Garmire
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METALLIZATION STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20190200459
- Publication date Jun 27, 2019
- Industrial Technology Research Institute
- Ming-Huei Yen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
FILM HAVING PLATED-LAYER PRECURSOR LAYER, FILM HAVING PATTERNED PLA...
- Publication number 20180371618
- Publication date Dec 27, 2018
- FUJIFILM CORPORATION
- Takahiko ICHIKI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PATTERNING OF ELECTROLESS METALS BY SELECTIVE DEACTIVATION OF CATAL...
- Publication number 20180332713
- Publication date Nov 15, 2018
- Averatek Corporation
- Mihir Reddy
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF FORMING METAL PATTERN
- Publication number 20180274102
- Publication date Sep 27, 2018
- KABUSHIKI KAISHA TOSHIBA
- Yusuke TANAKA
- C07 - ORGANIC CHEMISTRY
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20180270958
- Publication date Sep 20, 2018
- IBIDEN CO., LTD.
- Katsutoshi KITAGAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTROLESS PLATING METHOD AND PRODUCT OBTAINED
- Publication number 20180237917
- Publication date Aug 23, 2018
- SEMBLANT LIMITED
- Gianfranco ARESTA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Integrated Circuit Substrate Containing Photoimageable Dielectric M...
- Publication number 20180209046
- Publication date Jul 26, 2018
- Twisden Ltd.
- Loke Chew Low
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD FOR MANUFACTURING WIRING PATTERN, METHOD FOR MANUFACTURING C...
- Publication number 20180171482
- Publication date Jun 21, 2018
- Nikon Corporation
- Shohei KOIZUMI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

using masks

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Printed circuit board and method for manufacturing the same

Printed circuit board and method of manufacturing the same

Plated metallization structures

Electroless metal-defined thin pad first level interconnects for li...

Printed circuit board

Conductive fabric and its preparation and applications

Printed circuit nanofiber web manufacturing method

Electroless metal-defined thin pad first level interconnects for li...

Implantable thin film devices

Wiring substrate and method of manufacturing the wiring substrate

Method of manufacturing printed circuit board

Printed circuit surface finish, method of use, and assemblies made...

Method of manufacturing support structures for lighting devices and...

Fabrication method of substrate structure

System and method for manufacture of circuit boards

Metallization structure and manufacturing method thereof

Plated metallization structures

Printed circuit surface finish, method of use, and assemblies made...

Photosensitive resin composition, photosensitive element, method fo...

Method for producing wired circuit board

Method for forming resist pattern, method for manufacturing printed...

Conductive film, touch panel sensor, and touch panel

Component carrier and method for manufacturing the same

Motor and stator thereof

Method for manufacturing three-dimensional electronic circuit

Printed wiring board and method for manufacturing the same

Integrated circuit substrate containing photoimageable dielectric m...

Method for fine line manufacturing

Embedded thin films

Integrated circuit package having pin up interconnect

Patents Applicationslast 30 patents

METHOD FOR MANUFACTURING LAMINATE

METAL WIRING MANUFACTURING METHOD, TRANSISTOR MANUFACTURING METHOD,...

PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

COPPER CLAD LAMINATE AND METHOD FOR PRODUCING THE SAME

Semi-Additive Process for Printed Circuit Boards

PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE WHICH INCLUDE MULTI...

SYSTEMS AND METHODS FOR MANUFACTURING

PRINTED CIRCUIT BOARD

DEPOSITION APPARATUS, METHOD OF DEPOSITION ON A SUBSTRATE, SUBSTRAT...

IMPLANTABLE THIN FILM DEVICES

ELECTROLESS METAL-DEFINED THIN PAD FIRST LEVEL INTERCONNECTS FOR LI...

PACKAGE CARRIER AND MANUFACTURING METHOD THEREOF

SYSTEMS AND METHODS FOR MANUFACTURING

METHOD FOR PRODUCING PRINTED WIRING BOARD

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

CONDUCTIVE FABRIC AND ITS PREPARATION AND APPLICATIONS

SYSTEMS AND METHODS FOR MANUFACTURING

PLATED METALLIZATION STRUCTURES

METHOD FOR FORMING METALLIZATION STRUCTURE

ELECTROLESS METAL-DEFINED THIN PAD FIRST LEVEL INTERCONNECTS FOR LI...

Wiring Substrate And Method Of Manufacturing The Wiring Substrate

SYSTEM AND METHOD FOR MANUFACTURE OF CIRCUIT BOARDS

METALLIZATION STRUCTURE AND MANUFACTURING METHOD THEREOF

FILM HAVING PLATED-LAYER PRECURSOR LAYER, FILM HAVING PATTERNED PLA...

PATTERNING OF ELECTROLESS METALS BY SELECTIVE DEACTIVATION OF CATAL...

METHOD OF FORMING METAL PATTERN

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

ELECTROLESS PLATING METHOD AND PRODUCT OBTAINED

Integrated Circuit Substrate Containing Photoimageable Dielectric M...

METHOD FOR MANUFACTURING WIRING PATTERN, METHOD FOR MANUFACTURING C...