Number | Name | Date | Kind |
---|---|---|---|
2938805 | Agens | May 1960 | |
2996408 | Lukes | Mar 1958 | |
3075855 | Agens | Jan 1963 | |
3075856 | Lukes | Jan 1963 | |
3099608 | Radovsky et al. | Jul 1963 | |
3515649 | Hepfer | Jun 1970 | |
3563784 | Innes et al. | Feb 1971 | |
3632388 | Grunwald et al. | Jan 1972 | |
3684572 | Taylor | Aug 1972 | |
3844799 | Underkofler et al. | Oct 1974 | |
3959523 | Grunwald | May 1976 | |
3962497 | Doty | Jun 1976 | |
3982045 | Kukanskis | Sep 1976 | |
4008343 | Cohen | Feb 1977 | |
4042730 | Cohen | Aug 1977 | |
4066809 | Alpaugh et al. | Jan 1978 | |
4152467 | Alpaugh et al. | May 1979 | |
4227963 | Wiggins | Oct 1980 | |
4378384 | Murakami | Mar 1983 | |
4537799 | Dorey | Aug 1985 | |
4540464 | Mueller | Sep 1985 |
Number | Date | Country |
---|---|---|
51-25770 | Mar 1976 | JPX |
51-25771 | Mar 1976 | JPX |
Entry |
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G. C. Wilson et al., "Printed Circuits: Plated Through Holes . . . ", Products Finishing, Jan. 1970, pp. 82-87. |
Pridans et al., "Method for Through-Hole Plating Void Elimination", IBM Technical Disclosure Bulletin, vol. 21, No. 6, Nov. 1978, p. 2267. |
Ciotoli et al., "Pre-Anneal Cleaning Process", IBM Technical Disclosure Bulletin, vol. 21, No. 12, May 1979, p. 4795. |