characterised by electroless plating method; pretreatment therefor

Industry

CPC
H05K3/422

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/422characterised by electroless plating method; pretreatment therefor

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Printed circuit board
- Patent number 12,101,880
- Issue date Sep 24, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Hee-Joon Chun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laminated film structure and method for manufacturing laminated fil...
- Patent number 12,069,809
- Issue date Aug 20, 2024
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Kazuya Shimada
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Three-dimensional (3D) copper in printed circuit boards
- Patent number 11,956,898
- Issue date Apr 9, 2024
- Apple Inc.
- Anne M. Mason
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Single-layer circuit board, multi-layer circuit board, and manufact...
- Patent number 11,917,768
- Issue date Feb 27, 2024
- RICHVIEW ELECTRONICS CO., LTD.
- Siping Bai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plated metallization structures
- Patent number 11,862,518
- Issue date Jan 2, 2024
- Analog Devices International Unlimited Company
- Jan Kubik
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Printed wiring board and method for manufacturing printed wiring board
- Patent number 11,832,397
- Issue date Nov 28, 2023
- Ibiden Co., Ltd.
- Masashi Awazu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laminated film structure and method for manufacturing laminated fil...
- Patent number 11,825,608
- Issue date Nov 21, 2023
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Kazuya Shimada
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Wiring substrate and method for manufacturing wiring substrate
- Patent number 11,792,929
- Issue date Oct 17, 2023
- Ibiden Co., Ltd.
- Takema Adachi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for mounting and cooling a circuit component
- Patent number 11,764,540
- Issue date Sep 19, 2023
- Landa Labs (2012) Ltd.
- Ronny Costi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Core layer with fully encapsulated co-axial magnetic material aroun...
- Patent number 11,696,407
- Issue date Jul 4, 2023
- Intel Corporation
- Chong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate and method of manufacturing the wiring substrate
- Patent number 11,683,886
- Issue date Jun 20, 2023
- Shinko Electric Industries Co., Ltd.
- Toshiki Shirotori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electroless and electrolytic deposition process for forming traces...
- Patent number 11,653,453
- Issue date May 16, 2023
- CATLAM, LLC
- Kenneth S Bahl
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Process for fabrication of a printed circuit board using a semi-add...
- Patent number 11,638,354
- Issue date Apr 25, 2023
- CATLAM, LLC
- Kenneth S. Bahl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board
- Patent number 11,528,810
- Issue date Dec 13, 2022
- Shinko Electric Industries Co., Ltd.
- Yoko Nakabayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Overhang-compensating annular plating layer in through hole of comp...
- Patent number 11,510,316
- Issue date Nov 22, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Abderrazzaq Ifis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mask structure and manufacturing method thereof
- Patent number 11,366,381
- Issue date Jun 21, 2022
- Unimicron Technology Corp.
- Pu-Ju Lin
- G01 - MEASURING TESTING
Information Patent Grant
Display device and electronic apparatus
- Patent number 11,309,338
- Issue date Apr 19, 2022
- Sony Corporation
- Toshihiko Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus with a substrate provided with plasma treatment
- Patent number 11,291,122
- Issue date Mar 29, 2022
- Intel Corporation
- Darko Grujicic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single-layer circuit board, multi-layer circuit board, and manufact...
- Patent number 11,266,027
- Issue date Mar 1, 2022
- RICHVIEW ELECTRONICS CO., LTD.
- Siping Bai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Core layer with fully encapsulated co-axial magnetic material aroun...
- Patent number 11,246,218
- Issue date Feb 8, 2022
- Intel Corporation
- Chong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Overhang-compensating annular plating layer in through hole of comp...
- Patent number 11,051,403
- Issue date Jun 29, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Abderrazzaq Ifis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Single-layer circuit board, multi-layer circuit board, and manufact...
- Patent number 11,032,915
- Issue date Jun 8, 2021
- RICHVIEW ELECTRONICS CO., LTD.
- Siping Bai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for manufacturing flexible printed circuit board and flexibl...
- Patent number 11,013,128
- Issue date May 18, 2021
- AMOSENSE CO., LTD
- Sung-Baek Dan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 11,013,114
- Issue date May 18, 2021
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Seon-Ha Kang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and method of manufacturing a printed circuit...
- Patent number 10,980,114
- Issue date Apr 13, 2021
- Sumitomo Electric Industries, Ltd.
- Eiko Imazaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board using non-catalytic laminate with catalytic adhesive...
- Patent number 10,959,329
- Issue date Mar 23, 2021
- CATLAM, LLC
- Kenneth S. Bahl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing trapezoidal through-hole in component carrier material
- Patent number 10,950,463
- Issue date Mar 16, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Abderrazzaq Ifis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for forming traces on a catalytic laminate
- Patent number 10,849,233
- Issue date Nov 24, 2020
- CATLAM, LLC
- Kenneth S Bahl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Inductor built-in substrate
- Patent number 10,818,428
- Issue date Oct 27, 2020
- Ibiden Co., Ltd.
- Hiroaki Kodama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Catalytic circuit board with traces and vias
- Patent number 10,806,029
- Issue date Oct 13, 2020
- CATLAM, LLC
- Kenneth S. Bahl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE, CIRCUIT BOARD, AND MANUFACTURING METHOD FOR CIRC...
- Publication number 20240373553
- Publication date Nov 7, 2024
- Huawei Technologies Co., Ltd
- Xuanling Liang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240349426
- Publication date Oct 17, 2024
- Murata Manufacturing Co., Ltd.
- Atsushi SAKURAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Three-Dimensional (3D) Copper in Printed Circuit Boards
- Publication number 20240306297
- Publication date Sep 12, 2024
- Apple Inc.
- Anne M. Mason
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD, METAL-CERAMIC SUBSTRATE AS AN INSERT, AND PR...
- Publication number 20240155770
- Publication date May 9, 2024
- Rogers Germany GmbH
- Andreas MEYER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD, ELECTRONIC DEVICE, AND ELECTRONIC MODULE
- Publication number 20230403793
- Publication date Dec 14, 2023
- KYOCERA CORPORATION
- Yuki TAKESHIMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LAMINATED FILM STRUCTURE AND METHOD FOR MANUFACTURING LAMINATED FIL...
- Publication number 20230389189
- Publication date Nov 30, 2023
- Panasonic Intellectual Property Management Co., Ltd.
- Kazuya SHIMADA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD AND APPARATUS FOR MOUNTING AND COOLING A CIRCUIT COMPONENT
- Publication number 20230352903
- Publication date Nov 2, 2023
- LANDA LABS (2012) LTD.
- Ronny COSTI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semi-Additive Process for Printed Circuit Boards
- Publication number 20230247774
- Publication date Aug 3, 2023
- CATLAM, LLC
- Kenneth S. BAHL
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MANUFACTURING PROCESS OF RIGID-FLEX BOARD
- Publication number 20230232546
- Publication date Jul 20, 2023
- Guangdong ZECHENG Technology Co., LTD
- CHIA-MING LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING PRINTED WIRING BOARD
- Publication number 20230164925
- Publication date May 25, 2023
- IBIDEN CO., LTD.
- Katsuhiko TANNO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20230164926
- Publication date May 25, 2023
- Sumitomo Electric Industries, Ltd.
- Shoichiro SAKAI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
LAMINATED FILM STRUCTURE AND METHOD FOR MANUFACTURING LAMINATED FIL...
- Publication number 20230156924
- Publication date May 18, 2023
- Panasonic Intellectual Property Management Co., Ltd.
- Kazuya SHIMADA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
WIRING BOARD AND WIRING BOARD MANUFACTURING METHOD
- Publication number 20230009751
- Publication date Jan 12, 2023
- Shinko Electric Industries Co., Ltd.
- Toshiaki Aoki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20220408559
- Publication date Dec 22, 2022
- Samsung Electro-Mechanics Co., Ltd.
- Hee-Joon CHUN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND APPARATUS FOR MOUNTING AND COOLING A CIRCUIT COMPONENT
- Publication number 20220329040
- Publication date Oct 13, 2022
- LANDA LABS (2012) LTD.
- Ronny COSTI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN FILM, MULTIL...
- Publication number 20220276558
- Publication date Sep 1, 2022
- Showa Denko Materials Co., Ltd.
- Kohei ABE
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE
- Publication number 20220248533
- Publication date Aug 4, 2022
- IBIDEN CO., LTD.
- Takema ADACHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE WIRING SUBSTRATE
- Publication number 20220217844
- Publication date Jul 7, 2022
- Shinko Electric Industries Co., Ltd.
- Toshiki Shirotori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICES AND METHODS FOR FORMING ENGINEERED THERMAL PATHS OF PRINTED...
- Publication number 20220183141
- Publication date Jun 9, 2022
- TTM TECHNOLOGIES INC.
- Matthew D. Neely
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CORE LAYER WITH FULLY ENCAPSULATED CO-AXIAL MAGNETIC MATERIAL AROUN...
- Publication number 20220117089
- Publication date Apr 14, 2022
- Intel Corporation
- Chong ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three-Dimensional (3D) Copper in Printed Circuit Boards
- Publication number 20220095455
- Publication date Mar 24, 2022
- Apple Inc.
- Anne M. Mason
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD
- Publication number 20210243902
- Publication date Aug 5, 2021
- Shinko Electric Industries Co., Ltd.
- Yoko Nakabayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Overhang-Compensating Annular Plating Layer in Through Hole of Comp...
- Publication number 20210185811
- Publication date Jun 17, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Abderrazzaq Ifis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
- Publication number 20210176866
- Publication date Jun 10, 2021
- IBIDEN CO., LTD.
- Masashi AWAZU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE SLURRY AND PLATING METHOD USING THE SAME
- Publication number 20210112669
- Publication date Apr 15, 2021
- National Taiwan University of Science and Technology
- CHIH-WEI CHIU
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Process For Forming Traces on a Catalytic Laminate
- Publication number 20210051804
- Publication date Feb 18, 2021
- CATLAM, LLC
- Kenneth S. BAHL
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
PROCESS FOR METALLIZING HOLES OF AN ELECTRONIC MODULE BY LIQUID-PHA...
- Publication number 20210040620
- Publication date Feb 11, 2021
- 3D PLUS
- Christian VAL
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Circuit Board using non-catalytic laminate with catalytic adhesive...
- Publication number 20200404785
- Publication date Dec 24, 2020
- CATLAM, LLC
- Kenneth S. BAHL
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semi-Additive Process for Printed Circuit Boards
- Publication number 20200389983
- Publication date Dec 10, 2020
- CATLAM LLC
- Kenneth S. BAHL
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SINGLE-LAYER CIRCUIT BOARD, MULTI-LAYER CIRCUIT BOARD, AND MANUFACT...
- Publication number 20200344895
- Publication date Oct 29, 2020
- RICHVIEW ELECTRONICS CO., LTD.
- Siping Bai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

characterised by electroless plating method; pretreatment therefor

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Printed circuit board

Laminated film structure and method for manufacturing laminated fil...

Three-dimensional (3D) copper in printed circuit boards

Single-layer circuit board, multi-layer circuit board, and manufact...

Plated metallization structures

Printed wiring board and method for manufacturing printed wiring board

Laminated film structure and method for manufacturing laminated fil...

Wiring substrate and method for manufacturing wiring substrate

Method and apparatus for mounting and cooling a circuit component

Core layer with fully encapsulated co-axial magnetic material aroun...

Wiring substrate and method of manufacturing the wiring substrate

Electroless and electrolytic deposition process for forming traces...

Process for fabrication of a printed circuit board using a semi-add...

Wiring board

Overhang-compensating annular plating layer in through hole of comp...

Mask structure and manufacturing method thereof

Display device and electronic apparatus

Apparatus with a substrate provided with plasma treatment

Single-layer circuit board, multi-layer circuit board, and manufact...

Core layer with fully encapsulated co-axial magnetic material aroun...

Overhang-compensating annular plating layer in through hole of comp...

Single-layer circuit board, multi-layer circuit board, and manufact...

Method for manufacturing flexible printed circuit board and flexibl...

Printed circuit board

Printed circuit board and method of manufacturing a printed circuit...

Circuit board using non-catalytic laminate with catalytic adhesive...

Manufacturing trapezoidal through-hole in component carrier material

Process for forming traces on a catalytic laminate

Inductor built-in substrate

Catalytic circuit board with traces and vias

Patents Applicationslast 30 patents

ELECTRONIC DEVICE, CIRCUIT BOARD, AND MANUFACTURING METHOD FOR CIRC...

ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME

Three-Dimensional (3D) Copper in Printed Circuit Boards

PRINTED CIRCUIT BOARD, METAL-CERAMIC SUBSTRATE AS AN INSERT, AND PR...

WIRING BOARD, ELECTRONIC DEVICE, AND ELECTRONIC MODULE

LAMINATED FILM STRUCTURE AND METHOD FOR MANUFACTURING LAMINATED FIL...

METHOD AND APPARATUS FOR MOUNTING AND COOLING A CIRCUIT COMPONENT

Semi-Additive Process for Printed Circuit Boards

MANUFACTURING PROCESS OF RIGID-FLEX BOARD

METHOD FOR MANUFACTURING PRINTED WIRING BOARD

PRINTED WIRING BOARD

LAMINATED FILM STRUCTURE AND METHOD FOR MANUFACTURING LAMINATED FIL...

WIRING BOARD AND WIRING BOARD MANUFACTURING METHOD

PRINTED CIRCUIT BOARD

METHOD AND APPARATUS FOR MOUNTING AND COOLING A CIRCUIT COMPONENT

PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN FILM, MULTIL...

WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE

WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE WIRING SUBSTRATE

DEVICES AND METHODS FOR FORMING ENGINEERED THERMAL PATHS OF PRINTED...

CORE LAYER WITH FULLY ENCAPSULATED CO-AXIAL MAGNETIC MATERIAL AROUN...

Three-Dimensional (3D) Copper in Printed Circuit Boards

WIRING BOARD

Overhang-Compensating Annular Plating Layer in Through Hole of Comp...

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

CONDUCTIVE SLURRY AND PLATING METHOD USING THE SAME

Process For Forming Traces on a Catalytic Laminate

PROCESS FOR METALLIZING HOLES OF AN ELECTRONIC MODULE BY LIQUID-PHA...

Circuit Board using non-catalytic laminate with catalytic adhesive...

Semi-Additive Process for Printed Circuit Boards

SINGLE-LAYER CIRCUIT BOARD, MULTI-LAYER CIRCUIT BOARD, AND MANUFACT...