Claims
- 1. A process of supplying a soluble metal compound to an electrolyte solution comprising:providing said electrolyte solution and directing said electrolyte solution through a powder wetting device, said powder wetting device having a rotating impeller producing a vacuum in said powder wetting device; and supplying said soluble metal compound to said vacuum and drawing said soluble metal compound into said powder wetting device, thereby dispersing and dissolving soluble metal compound in said electrolyte solution passing through said powder wetting device.
- 2. The process of claim 1, wherein said electrolyte solution is a sulfuric acid electroplating solution.
- 3. The process of claim 2, wherein said soluble metal compound is powdered zinc oxide.
- 4. The process of claim 1, wherein said soluble metal compound is nickel carbonate.
- 5. The process of claim 1, wherein said soluble metal compound is zinc oxide and said process further comprises sequentially supplying nickel carbonate to said electrolyte solution.
- 6. The process of claim 1, comprising:feeding said soluble metal compound from a storage vessel to a weighing device; and weighing a predetermined amount of said soluble metal compound and supplying said predetermined amount to said powder wetting device.
- 7. The process of claim 6, wherein said electrolyte solution is an electroplating solution for supplying to an electroplating tank, said process further comprising electroplating a metal onto a substrate and calculating said predetermined amount of said soluble metal compound based on an amount consumed by said electroplating in said electroplating tank.
- 8. The process of claim 6, wherein said storage vessel is a tank or silo.
- 9. The process of claim 1, comprising continuously supplying said soluble metal compound to said electrolyte solution.
- 10. The process of claim 1, wherein said soluble metal compound is a galvanic salt.
- 11. The process of claim 1, wherein said soluble metal compound is supplied intermittently to said powder wetting device, and said electrolyte solution is an electroplating solution supplied to an electroplating tank having an electric current passing therethrough to plate a metal substrate, said process further comprising determining an amount of said soluble metal compound to be added to said electrolyte solution based on said electric current.
- 12. The process of claim 1, wherein said electrolyte solution is from an electrolytic treating tank and wherein said process further comprises dissolving said soluble metal compound in said electrolyte solution.
- 13. The process of claim 1, wherein said powder wetting device includes an axial inlet connected to an electrolytic treating tank for receiving said electrolyte solution, and an axial inlet for receiving said soluble metal compound, said process comprising directing said soluble metal compound and electrolyte solution radially outward with respect to said impeller and dispersing and dissolving said soluble metal compound.
- 14. The process of claim 13, wherein said powder wetting device has a radial outlet, said process further comprising directing said electrolyte solution and dissolved metal compound radially outward through said outlet.
Priority Claims (1)
Number |
Date |
Country |
Kind |
1057/98 |
Jun 1998 |
AT |
|
Parent Case Info
This application is a divisional application of Ser. No. 09/335,895, filed Jun. 18, 1999, now U.S. Pat. No. 6,231,729.
US Referenced Citations (6)