Claims
- 1. A thermally copolymerized resin having a softening point of 50.degree. to 200.degree. C., a number average molecular weight of 300 to 1,500 measured by vapor pressure osmometry and a bromine number of less than 120 and soluble in hydrocarbon solvents, the composition of said resin comprising (a) 30 to 97 mol % of one or more monomeric substances selected from cyclopentadiene, dicyclopentadiene and alkyl-substituted compounds thereof, and (b) 3 to 70 mol % of one or more hydroxystyrene derivatives.
- 2. The resin according to claim 1, wherein said resin has a composition comprising (a) 40 to 95 mol % of the monomeric substance and (b) 5 to 60 mol % of the hydroxystyrene derivative.
- 3. The resin according to claim 2, wherein the monomeric substance is dicyclopentadiene and the hydroxystyrene derivative is isopropenylphenol.
- 4. A method of producing a copolymerized resin, characterized in that a starting monomer component comprising (a) 30 to 97 mol % of one or more monomeric substances selected from cyclopentadiene, dicyclopentadiene and alkyl-substituted compounds thereof and (b) 3 to 70 mol % of one or more hydroxystyrene derivatives is copolymerized thermally at a temperature of 240.degree. to 300.degree. C. without using any catalyst.
- 5. The method according to claim 4, wherein the starting monomer component comprises 40 to 95 mol % of dicyclopentadiene and 5 to 60 mol % of isopropenylphenol.
- 6. The method according to claim 4, wherein the polymerization temperature is 250.degree. to 280.degree. C.
- 7. The method according to claim 4, wherein the polymerization is carried out in the presence of a solvent selected from aromatic hydrocarbon, aliphatic hydrocarbon and alicyclic hydrocarbon.
- 8. The method according to claim 4, wherein the alkyl-substituted compound of cyclopentadiene is methylcyclopentadiene and the alkyl-substituted compound of dicyclopentadiene is methyldicyclopentadiene or dimethyldicyclopentadiene.
- 9. The method according to claim 4, wherein the hydroxystyrene derivative is o-, m- or p-isomer of vinylphenol, propenylphenol, isopropenylphenol, vinylcresol, isopropenylcresol, hydroxystibene, vinylisopropylphenol, isopropenylisopropylphenol, vinyl-tert-butylphenol, isopropenyl-tert-butylphenol, vinylethylphenol, isopropenylethylphenol, vinyldimethylphenol, vinyldiisopropylphenol, isopropenyldiisopropylphenol, vinylmethylethylphenol, isopropenyldimethylphenol or isopropenylmethylethylphenol.
- 10. A copolymerized resin obtained by the method of claim 4.
Priority Claims (4)
Number |
Date |
Country |
Kind |
51/61614 |
May 1976 |
JPX |
|
51/61615 |
May 1976 |
JPX |
|
51/91490 |
Jul 1976 |
JPX |
|
51/91491 |
Jul 1976 |
JPX |
|
Parent Case Info
This is a division of application Ser. No. 799,266 filed May 23, 1977, now U.S. Pat. No. 4,129,557.
US Referenced Citations (4)
Number |
Name |
Date |
Kind |
2583638 |
Evans et al. |
Jan 1952 |
|
3963653 |
Katayama et al. |
Jun 1976 |
|
4046838 |
Feeney |
Sep 1977 |
|
4102834 |
Morimoto et al. |
Jul 1978 |
|
Non-Patent Literature Citations (3)
Entry |
Derwent, 49314U-AFG (JA473500-Q) "Thermoplastic Copolymers of (Di)cyclopentadiene". |
Derwent, 77663A/43 (J78035-976)(9-20-78) "Tackifier for Pressure Sensitive Adhesives". |
Derwent, 73767T-A (JA-7243307-R) "Thermoplastic Resin Prodn-by Polymsn of (Di)cyclopentadiene". |
Divisions (1)
|
Number |
Date |
Country |
Parent |
799266 |
May 1977 |
|