Claims
- 1. A polymer comprising a homopolymer of 2,2,2-trifluorethyl methacrylate or a copolymer comprising at least one poly(2,2,2-tri-fluoroethyl methacrylate) block, said homopolymer or copolymer having a polydispersity between 1.1 and 4 and a number average molecular weight of between 10,000 and 300,000.
- 2. The polymer as claimed in claim 1, further comprising a monomer other than 2,2,2-trifluoroethyl methacrylate.
- 3. A photoresist for printed circuits, containing at least one polymer as claimed in claim 1.
- 4. The photoresist for printed circuits as claimed in claim 3, wherein the polymer is in the form of a film having a thickness in the range of 0.2 to 2 microns.
- 5. A polymer comprising a homopolymer of a secondary alkyl acrylate monomer or a copolymer comprising at least one secondary alkyl acrylate polymer block, said alkyl group containing from 3 to 10 carbon atoms and having a polydispersity of between approximately 1.1 and 4 and a number average molecular weight of the homopolymer or poly(secondary alkyl acrylate) block of between 10,000 and 100,000.
- 6. The polymer as claimed in claim 5, further comprising a polymer block of a monomer other than a secondary alkyl acrylate.
Priority Claims (1)
Number |
Date |
Country |
Kind |
86 17790 |
Dec 1986 |
FRX |
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Parent Case Info
This is a division of application Ser. No. 134,373, filed Dec. 18, 1987, now U.S. Pat. No. 4,826,941, dated May 2, 1989.
US Referenced Citations (1)
Number |
Name |
Date |
Kind |
4659782 |
Spinelli |
Apr 1987 |
|
Foreign Referenced Citations (2)
Number |
Date |
Country |
61-258882 |
Nov 1986 |
JPX |
63-86708 |
Apr 1988 |
JPX |
Divisions (1)
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Number |
Date |
Country |
Parent |
134373 |
Dec 1987 |
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