Process of manufacturing a dynamic random access memory device

Abstract

A dynamic random access memory device formed in a substrate having a trench. The trench has a side wall, a top, a lower portion, and a circumference. The device includes a signal storage node including a storage node conductor formed in the lower portion of the trench and isolated from the side wall by a node dielectric and a collar oxide above the node dielectric. A buried strap is coupled to the storage node conductor and contacts a portion of the side wall of the trench above the collar oxide. A trench-top dielectric which is formed upon the buried strap has a trench-top dielectric thickness. A signal transfer device includes a first diffusion region extending into the substrate adjacent the portion of the trench side wall contacted by the buried strap, a gate insulator having a gate insulator thickness formed on the trench side wall above the first buried strap, wherein the gate insulator thickness is less than the trench-top dielectric thickness, and a gate conductor formed within the trench upon the trench-top dielectric and adjacent the gate insulator.

Description

TECHNICAL FIELD

[0001] The present invention relates generally to a dynamic random access memory (DRAM) device and, more particularly, to a vertical DRAM device having robust gate-to-storage node isolation.

BACKGROUND OF THE INVENTION

[0002] In the semiconductor industry, there is an ever-increasing desire to increase memory density and performance. These goals are often achieved by scaling dynamic random access memory (DRAM) devices to smaller dimensions and operating voltages.

[0003] A DRAM cell may include a horizontal, planar, MOSFET (metal oxide semiconductor field effect transistor) transfer device coupled to a deep trench storage capacitor by a buried strap. As the size of such a DRAM cell is scaled to increase memory density, scaling of the channel length of the transfer device may be limited to prevent degradation of sub-threshold leakage requirements (or retention time requirements).

[0004] Vertical memory devices, which use a trench to form both a signal storage node and a signal transfer device, have been proposed to increase memory density. Vertical memory devices may have degrading performance due to storage node leakage.

[0005] To overcome the shortcomings of conventional DRAM devices, a new DRAM device is provided. An object of the present invention is to provide a DRAM device that has improved charge retention characteristics. A related object is to provide a process of manufacturing such a DRAM device. Another object is to provide a process of manufacturing such a DRAM device which is compatible with manufacturing support circuitry.

SUMMARY OF THE INVENTION

[0006] To achieve these and other objects, and in view of its purposes, the present invention provides a dynamic random access memory device formed in a substrate having a trench. The trench has a side wall, a top, a lower portion, and a circumference. The device includes a signal storage node including a storage node conductor formed in the lower portion of the trench and isolated from the side wall by a node dielectric and a collar oxide above the node dielectric. A buried strap is coupled to the storage node conductor and contacts a portion of the side wall of the trench above the collar oxide. A trench-top dielectric which is formed upon the buried strap has a trench-top dielectric thickness. A signal transfer device includes a first diffusion region extending into the substrate adjacent the portion of the trench side wall contacted by the buried strap, a gate insulator having a gate insulator thickness formed on the trench side wall above the first buried strap, and a gate conductor formed within the trench upon the trench-top dielectric and adjacent the gate insulator. The gate insulator thickness is less than the trench-top dielectric thickness.

[0007] It is to be understood that both the foregoing general description and the following detailed description are exemplary, but are not restrictive, of the invention.

BRIEF DESCRIPTION OF THE DRAWING

[0008] The invention is best understood from the following detailed description when read in connection with the accompanying drawing. It is emphasized that, according to common practice, the various features of the drawing are not to scale. On the contrary, the dimensions of the various features are arbitrarily expanded or reduced for clarity. Included in the drawing are the following figures:

[0009] FIGS. 1A-C illustrate processes for forming a trench-top dielectric;

[0010] FIG. 2 is a cross-sectional view of memory devices according to an exemplary embodiment of the present invention;

[0011] FIG. 2A is a cross-sectional view of the memory devices shown in FIG. 2 taken along the line 2A-2A;

[0012] FIG. 2B is a cross-sectional view of the memory devices shown in FIG. 2 taken along the line 2B-2B;

[0013] FIG. 2C is a cross-sectional view of the memory devices shown in FIG. 2 taken along the line 2C-2C;

[0014] FIG. 2D is a cross-sectional view of the memory devices shown in FIG. 2 taken along the line 2D-2D;

[0015] FIG. 3 is a cross-sectional view of memory devices according to another exemplary embodiment of the present invention;

[0016] FIG. 3A is a cross-sectional view of the memory devices shown in FIG. 3 taken along the line 3A-3A;

[0017] FIG. 3B is a cross-sectional view of the memory devices shown in FIG. 3 taken along the line 3B-3B;

[0018] FIG. 3C is a cross-sectional view of the memory devices shown in FIG. 3 taken along the line 3C-3C;

[0019] FIG. 3D is a cross-sectional view of the memory devices shown in FIG. 3 taken along the line 3D-3D;

[0020] FIG. 4 is a diagram depicting the sequence of figures used to illustrate the first, second, third, and fourth exemplary processes of manufacture according to the present invention;

[0021] FIGS. 4A-H are cross-sectional views illustrating a first exemplary process of manufacture according to the present invention;

[0022] FIGS. 4I-J are cross-sectional views illustrating a second exemplary process of manufacture according to the present invention;

[0023] FIGS. 4K-Q are cross-sectional views illustrating a third exemplary process of manufacture according to the present invention;

[0024] FIGS. 4R-S are cross-sectional views illustrating a fourth exemplary process of manufacture according to the present invention;

[0025] FIGS. 5A-J are cross-sectional views illustrating a fifth exemplary process of manufacture according to the present invention; and

[0026] FIG. 5K is a cross-sectional view of memory devices according to another exemplary embodiment of the present invention.

DETAILED DESCRIPTION OF THE INVENTION

[0027] Referring now to the drawing, in which like reference numerals refer to like elements throughout, FIG. 1A is a partial cross sectional view of a DRAM cell 100. A trench 102 is formed in a substrate 108. The DRAM cell 100 includes a collar oxide 104 and a storage node conductor 106. As shown in FIGS. 1B and 1C, an oxide layer 110, 112 may be formed upon the storage node conductor 106 to isolate the storage node from a signal transfer device (not shown).

[0028] The oxide layer 110 shown in FIG. 1B may be formed by thermal oxidation. Although thermal oxidation allows precise control of oxide thickness, stress-induced oxidation reduction may result in a thinner and weaker oxide layer at the bottom of the V groove illustrated by arrow 114. The thinned and weak oxide 110 at the V groove 114 may result in high leakage between a word line and the storage node.

[0029] The silicon dioxide or oxide layer 112 shown in FIG. 1C may be formed by chemical vapor deposition (CVD). The CVD oxide 112 may be adjusted to a depth 116 above the storage node conductor 106 by first performing CVD deposition and then planarizing by chemical-mechanical polishing (CMP), for example. The CVD oxide 112 may then be recessed to a depth 116 by reactive ion etching (RIE). Although the CVD oxide 112 fills the V groove 114, reactive ion etching may provide poor control of the depth 116 of the CVD oxide 112. Precise control of the depth 116 is important to ensure that the CVD oxide 112 is thin enough for the diffusion region 118 to overlap a channel region 120 and still be thick enough to isolate the storage node conductor 106 from the gate (not shown) of the device.

[0030] FIG. 2 is a cross-sectional view of a DRAM device 200 according to an exemplary embodiment of the present invention. As shown in FIG. 2, the device 200 is formed using a deep trench (DT) having side walls 202 formed within a P-type silicon substrate 204. Another DRAM device 236 shown in FIG. 2 is formed adjacent to device 200.

[0031] As known to those skilled in the art, the teachings of the present invention may also be applied to forming a memory device in an N-type silicon substrate or using other semiconductor materials. Thus, the present invention is not limited to the particular materials used in describing the exemplary embodiments.

[0032] The signal storage node of the memory device 200 includes an n+ buried plate 206 isolated from a storage node conductor 208 by a node dielectric 210 and a collar oxide 212. The signal transfer device of the memory device 200 includes a first diffusion region 214, coupled to the storage node conductor 208 by a buried strap 216, and a second diffusion region 218. The channel region 228 is controlled by the gate conductor 220. The gate conductor 220 is coupled to the word line 224. The gate conductor 220 is isolated from the channel region 228 by a gate oxide layer 222. The second diffusion region 218 is coupled to the bit line contact 227 and a bit line 226.

[0033] The gate conductor 220 is isolated from the storage node conductor 208 by the trench-top dielectric 230. In this exemplary embodiment, the trench-top dielectric 230 has a thickness 232 greater than the thickness 234 of the gate oxide 222. In an exemplary embodiment, the trench-top dielectric 230 has a thickness 232 ranging from 20 nm to 100 nm. In an exemplary embodiment, the ratio of the thickness 232 of the trench-top dielectric 230 to the thickness 234 of the gate oxide 220 ranges from 3:1 to 12:1.

[0034] The DRAM device 200 is isolated from the adjacent device 236 by an isolation trench fill insulator 238. Further insulation is provided by a passivation insulation layer 237 such as CVD oxide or boron phosphorous silicate glass (BPSG), for example. Cross-sectional views taken along lines 2A-2A, 2B-2B, 2C-2C, and 2D-2D in FIG. 2 are illustrated in FIGS. 2A-D, respectively. As illustrated, trench 240 has a circumference and the buried strap 216 contacts the side wall 202 of the trench 240 along a fragment of the trench circumference.

[0035] FIG. 3 is a cross-sectional view of a DRAM device 300 according to another exemplary embodiment of the present invention. As shown in FIG. 3, the device 300 is formed using a deep trench (DT) having side walls 302 formed within a P-type silicon substrate 304. Another DRAM device 336 shown in FIG. 3 is formed adjacent to device 300.

[0036] As known to those skilled in the art, the teachings of the present invention may also be applied to forming a memory device in an N-type silicon substrate or using other semiconductor materials. Thus, the present invention is not limited to the particular materials used in describing the exemplary embodiments.

[0037] The signal storage node of the memory device 300 includes an n+ buried plate 306 isolated from a storage node conductor 308 by a node dielectric 310 and a collar oxide 312. The signal transfer device of the memory device 300 includes a first diffusion region 314, coupled to the storage node conductor 308 by a buried strap 316, and a second diffusion region 318. The channel region 328 is controlled by the gate conductor 320. The gate conductor 320 is coupled to the word line 324. The gate conductor 320 is isolated from the channel region 328 by a gate oxide layer 322. The second diffusion region 318 is coupled to the bit line 326 by a bit line contact 327.

[0038] The gate conductor 320 is isolated from the storage node conductor 308 by the trench-top dielectric 330. In this exemplary embodiment, the trench-top dielectric 330 has a thickness 332 greater than the thickness 334 of the gate oxide 322. In an exemplary embodiment, the trench-top dielectric 330 has a thickness 332 ranging from 20 nm to 100 nm In an exemplary embodiment, the ratio of the thickness 332 of the trench-top dielectric 330 to the thickness 334 of the gate oxide 320 ranges from 3:1 to 12:1.

[0039] The DRAM device 300 is isolated from the adjacent device 336 by a trench fill insulator 338 and a shallow trench isolation 339. Further insulation is provided by a passivation insulation layer 337 such as CVD oxide or BPSG, for example. Cross-sectional views taken along lines 3A-3A, 3B-3B, 3C-3C, and 3D-3D in FIG. 3 are illustrated in FIGS. 3A-D, respectively.

PROCESSES OF MANUFACTURE

[0040] FIG. 4 illustrates the process flow for four exemplary processes of manufacture according to the present invention. Each lettered block in FIG. 4 corresponds to a figure. For example, block A in FIG. 4 corresponds to FIG. 4A, block B in FIG. 4 corresponds to FIG. 4B, and so on.

[0041] The first and second exemplary processes of manufacture according the present invention are processes for manufacturing a memory device 200 as shown in FIG. 2. Blocks A-B-C-D-E-F-G-H of FIG. 4 correspond to a first exemplary process of manufacture. Blocks A-B-C-D-E-I-J-H of FIG. 4 correspond to a second exemplary process of manufacture according to the present invention.

[0042] The third and fourth exemplary processes of manufacture according to the present invention are processes for manufacturing a memory device 300 as shown in FIG. 3. Blocks A-B-C-K-L-M-N-O-P-Q of FIG. 4 correspond to a third exemplary process of manufacture according to the present invention. Blocks A-B-C-K-L-M-R-S-Q of FIG. 4 correspond to a fourth exemplary process of manufacture according to the present invention.

First Exemplary Process of Manufacture

[0043] The first exemplary process of manufacture according to the present invention is described below with reference to FIGS. 4A-H. FIG. 4A shows a cross section of a wafer after deep-trench processing. A deep-trench signal storage node may be formed by etching a trench 240 into the P-type doped single crystal silicon substrate 204 through the oxide layer 248 and nitride layer 250. A layer of doping source material such as arsenic doped glass (ASG) may then be deposited on the side walls 202 and the bottom (not shown) of the trench 240. A photoresist may then be deposited to fill the trench 240. The photoresist is then recessed to expose the ASG on the upper portion of the side walls 202 of the trench 240. The exposed ASG is then etched off and the remaining photoresist is removed. The dopant, As, is then diffused from the ASG into the substrate 204. The diffused dopant results in the formation of an n+ buried plate 206 which performs as an electrode of the signal storage node.

[0044] The layer of ASG may then be removed and the node dielectric 210 may be formed. The node dielectric 210 may be formed by depositing a layer of silicon nitride on the side walls 202 and the bottom (not shown) of the trench 240 and then oxidizing the silicon nitride layer surface. The trench 240 is then filled with a first n+ polysilicon 242. The first n+ polysilicon 242 is recessed from the top of the trench 240, and a collar oxide 212 is then formed by depositing a conformal oxide layer and directionally etching (e.g., RIE) the oxide from the bottom of the recessed trench.

[0045] The trench 240 is then filled with a second n+ polysilicon 244 which is planarized and recessed. The exposed collar oxide 212 is etched off the side walls 202 of the trench 240.

[0046] As shown in FIG. 4A, the collar oxide 212 is etched slightly below the recessed second polysilicon 244. The trench 240 is then filled with undoped or n+ doped third polysilicon 246 which is then planarized and recessed as shown in FIG. 4A. The buried strap 216, which is a connection between the storage node conductor 208 and the first diffusion region 214, is formed by diffusing an n-type dopant of polysilicon such as As, for example, from the second polysilicon 244 through the third polysilicon 246 and into the adjacent p-type silicon substrate by subsequent process heat treatments.

[0047] The distance in FIG. 4A illustrated by arrow 229 and the lengths of the first diffusion region 214 (FIG. 2) and second diffusion region 218 (FIG. 2) determine the length of the channel region 228 (FIG. 2) of the vertical signal transfer device. In an exemplary embodiment, the distance 229 is approximately 0.35 μm.

[0048] As shown in FIG. 4B, a thin thermal oxide (sacrificial oxide) ranging between 5-10 nm, for example, is grown over the exposed side wall 202 and trench-top polysilicon (third polysilicon) 246. Then, the trench-top dielectric 230 is formed to cover the top of the buried strap. In an exemplary embodiment the trench-top dielectric 230 has a thickness 232 of about 50 nm on top of the trench-top polysilicon 246 and about 5 nm on the side walls 202 of the trench. In this exemplary embodiment, the trench-top dielectric 230 is formed using flowable oxide (FOX) or high density plasma (HDP) oxide deposition. These processes result in a thicker oxide layer being formed on top of the buried strap than on the side walls 202 of the trench 240. The deposited oxide 230 is then annealed to increase its density and reduce leakage current. In an exemplary embodiment, the deposited oxide 230 is annealed to shrink its volume by a factor of about 0.8.

[0049] In an exemplary embodiment, the trench-top dielectric 230 is deposited using an inductively coupled high density plasma (HDP) process. This process uses simultaneous sputtering and deposition which may be tuned, by the RF bias, to maximize the oxide deposited on horizontal features (trench-top polysilicon 246) and minimize deposited oxide on vertical features (side wall 202).

[0050] In another exemplary embodiment, the thinner oxide on the substantially vertical side wall 202 of the trench 240 may then be selectively and controllably removed by a gas phase chemical oxide removal (COR) process. The COR process is described by Jeng, et al. In U.S. Pat. No. 5,282,925, which is incorporated herein by reference for its teachings on oxide removal. The COR process uses gas phase reactants to form a self-limiting etch that is adjustable. The COR process may be adjusted to remove all the oxide on the side wall 202 of the trench 240 while retaining a desired thickness 232 of the trench-top by electric 230. As known to those skilled in the art, the thickness 232 of the trench-top dielectric 230 may be adjusted to be thin enough to allow the first diffusion region 214 to overlap the channel region 228 and thick enough to sufficiently isolate the storage node conductor 208 from the gate conductor 220. Alternatively, a diluted HF etch may be used to remove the oxide from the side wall 202 of the trench 240.

[0051] In an exemplary embodiment, an HDP process is used to deposit 50 nm of oxide on the trench-top polysilicon 246 and 10 nm of oxide on the trench 240 side wall 202. In the exemplary embodiment, the COR process may then be used to remove 15 nm of oxide which ensures removal of all oxide from the side wall 202 while retaining a trench-top dielectric thickness of 35 nm.

[0052] In an exemplary embodiment, the thickness 232 of the trench-top dielectric 230 is reduced to approximately 30 nm. The trench-top dielectric 230 isolates the gate conductor 220 from the storage node conductor 208. In a preferred embodiment, the trench-top dielectric 230 has a thickness 232 sufficient to result in a leakage current through the trench-top dielectric 230 of less than 10−17 amperes. As shown in FIG. 4C, the gate oxide 222 is then grown on the side walls 202 of the trench 240. The trench 240 is then filled with n+ polysilicon 220 and planarized to the top of the nitride 250.

[0053] As shown in FIG. 4D a photolithographically defined mask 252 is formed and an isolation trench 254 is etched between the trenches of adjacent devices 200, 236. The isolation trench 254 is formed through the oxide layer 248, nitride layer 250, and into part of the n+ polysilicon 220, the trench-top dielectric 230, the storage node conductor 208, the collar oxide 212, and the substrate 204. In an exemplary embodiment, the isolation trench 254 has a depth of approximately 600 nm as illustrated by arrow 255. In the exemplary embodiment illustrated in FIG. 4D, the isolation trench 254 separates the signal transfer device (including the diffusion region 214 shown in FIG. 2) of the DRAM cell 200 from adjacent devices such as device 236.

[0054] The exposed silicon 204 surface is oxidized. In an exemplary embodiment, approximately 3 nm of oxide is formed on the single crystal silicon 204. As shown in FIG. 4E, the isolation trench 254 is then filled with an isolation trench fill insulator 238. In an exemplary embodiment, the isolation trench 254 is filled with silicon dioxide by CVD. The device is then planarized to the top of the nitride layer 250 by CMP, for example.

[0055] As shown in FIG. 4F, the oxide layer 248 and the nitride layer 250 are stripped. A sacrificial oxide layer (not shown) is then grown over the exposed planar silicon substrate 204 surface. As known to those skilled in the art, the sacrificial oxide layer may be used to remove defects from the substrate 204 surface. In an exemplary embodiment, the sacrificial oxide has a thickness of approximately 5 nm. The sacrificial oxide is then stripped. A gate oxide layer 256 is grown and a polysilicon gate conductor layer 258 is deposited for planar support circuit devices. In an exemplary embodiment, the gate oxide layer 256 has a thickness of approximately 4 nm and the gate conductor layer 258 has a thickness of approximately 50 nm.

[0056] As shown in FIG. 4G, a photoresist mask 260 is formed. Contact holes 262 are then etched through the gate oxide layer 256 and polysilicon gate conductor layer 258 to expose the gate conductor polysilicon 220. The photoresist 260 is then removed.

[0057] As shown in FIG. 4H, a word line conductor 224 is then deposited through the contact hole 262 (FIG. 4G)to contact the gate conductor 220. In an exemplary embodiment, the word line conductor 224 has a thickness of approximately 75 nm. In another exemplary embodiment, a thin layer of silicide (not shown) such as CoSi, TiSi, or WSi may be deposited upon the word line conductor 224 to reduce the resistivity of the word line 224. Reduced word line resistance may be desirable for increased DRAM device performance. A photoresist 264 is then deposited upon the gate conductor 224 and patterned. An etch is then performed to form the word line 224 and the gate (not shown) of support circuit devices.

[0058] As shown in FIG. 2, the second diffusion region 218 is formed by implanting with a dopant such as As or P, for example. The dopant may be activated thermally by rapid thermal annealing or by conventional furnace annealing processes, for example. The buried strap 216 and first diffusion region 214 may be formed by the prior thermal treatments and the annealing process used to form the second diffusion region 218.

[0059] A dielectric film 237 such as CVD oxide, for example, is then deposited and planarized as shown in FIG. 2. A contact hole is formed through the dielectric film 237 to the second diffusion region 218. The contact hole is filled with a conductor such as n+ doped polysilicon or W and is planarized to form the bit line contact 227. An bit line 226 formed of Al or Cu, for example, is then formed upon the bit line contact 227.

Second Exemplary Process of Manufacture

[0060] The second exemplary process of manufacture according to the present invention is described below with reference to FIGS. 4I and 4J. As illustrated by FIG. 4, blocks A-B-C-D-E-I-J-H correspond to the second exemplary process of manufacture.

[0061] Referring to FIG. 4I, after performing the process of the first exemplary embodiment described above with regard to FIGS. 4A through 4E, the polysilicon remaining in the half-trench 266 is removed. As known to those skilled in the art, a mask may not be necessary to remove the polysilicon from the half-trench 266. The term half-trench does not signify that exactly one half of the trench is opened. The teachings of the present invention may be applied to pattern the mask to expose a portion of the trench The nitride layer 250 and oxide layer 248 are then removed and a sacrificial oxide layer 268 is grown to prepare the substrate 204 surface for gate processing.

[0062] As shown in FIG. 4J, the sacrificial oxide layer 268 is stripped and the gate oxide layer 222 is grown. The half-trench 266 is then filled with and the wafer surface is coated with polysilicon 270. This polysilicon 270 forms the gate 220, the word line 224 (FIG. 2), and a gate for the support circuitry planar devices (not shown). A photoresist 264 (FIG. 4H) is then coated upon the polysilicon 270 and patterned. The remaining process steps for the second exemplary process are similar to those described above with regard to FIG. 4H and FIG. 2.

Third Exemplary Process of Manufacture

[0063] The third exemplary process of manufacture according to the present invention is described below with reference to FIGS. 4K-Q. As illustrated by FIG. 4, blocks A-B-C-K-L-M-N-O-P-Q correspond to the third exemplary process of manufacture.

[0064] Referring to FIG. 4K, after performing the process described above for the first exemplary embodiment with reference FIGS. 4A-C, a photoresist 352 is deposited and patterned and the polysilicon 358 remaining in the half-trench 354 is removed up to the trench-top dielectric 330.

[0065] As shown in FIG. 4L, the photoresist 352 is again used as a mask for further etching. The further etch breaks through the trench-top dielectric 330 and the storage node conductor 308 and into a portion of the collar oxide 312. The further etch creates a shallow trench isolation (STI) region 341 to isolate the device 300 from adjacent devices and for isolating support circuitry devices (not shown). In an exemplary embodiment, the further etch forms a STI region 341 having a depth of about 250 nm as illustrated by arrow 356.

[0066] As shown in FIG. 4M, the STI region 341 is filled with oxide 339 and planarized. As shown in FIG. 4N, the nitride layer 350 and oxide layer 348 are then stripped. A sacrificial oxide layer 360 is grown to prepare the planar surfaces for gate processing for the support circuitry (not shown).

[0067] As shown in FIG. 40, the sacrificial oxide layer 360 is stripped and a gate oxide layer 362 is grown. A layer of polysilicon 364 is then deposited. The gate oxide 362 and polysilicon 364 are used to form a gate for support circuitry (not shown).

[0068] A mask (not shown) is used to etch the polysilicon 364 and oxide 362 over the polysilicon 358. As shown in FIG. 4P, the mask is then removed and a polysilicon layer 366 is deposited. As shown in FIG. 4Q, a photoresist 368 is then deposited upon the polysilicon 270 and patterned and the word line 324 is etched. Further processing to complete a device shown in FIG. 3 is similar to the process described above for the first exemplary process according to the present invention with regard to FIG. 2.

Fourth Exemplary Process of Manufacture

[0069] The fourth exemplary process of manufacture according to the present invention is described below with reference to FIGS. 4R and 4S. As illustrated by FIG. 4, blocks A-B-C-K-L-M-R-S-Q correspond to the fourth exemplary process of manufacture.

[0070] Referring to FIG. 4R, after performing the process of the third exemplary embodiment described above with regard to FIGS. 4A-C and FIGS. 4K-M, the remaining polysilicon 358 is etched out of the other half-trench up to the trench-top dielectric 330. The nitride layer 350 and oxide layer 348 are then stripped and a sacrificial oxide layer 370 is grown to prepare the substrate 304 for gate processing.

[0071] As shown in FIG. 4S, the sacrificial oxide 370 is stripped and a gate oxide layer 372 and polysilicon layer 374 are formed. The polysilicon layer 374 fills the empty half-trench to form the gate 320 as well as word line conductor 324 of the DRAM device and a gate for the support circuitry (not shown). The remaining process steps for the fourth exemplary process are similar to those described above with regard to FIG. 4Q to manufacture a device shown in FIG. 3.

Fifth Exemplary Process of Manufacture

[0072] A fifth exemplary process according to the present invention is described below with reference to FIGS. 5A-K. FIG. 5A shows a cross section of a wafer after deep trench processing. The deep trench processing may be performed as described above with regard to FIG. 4A.

[0073] As shown in FIG. 5B, the wafer is coated with a photoresist 502 which fills the trenches 240. The photoresist is removed from the planar wafer surface while leaking it in the trenches 240 (FIG. 5A). In an exemplary embodiment, the planarization is performed by an RIE etch.

[0074] As shown in FIG. 5C, a photoresist 504 is coated on the wafer surface and patterned to expose the photoresist 502 in a portion of the trench 240. The photoresist 502 is then etched out of the exposed portion of the trench 204 by RIE, for example.

[0075] The photoresist 504 is then used again as a mask for performing an STI etch. As shown in FIG. 5D, the STI etch breaks through the storage node conductor 208 and into a portion of the collar oxide 212. The STI etch creates a STI region to isolate the device 500 (see FIG. 5K) from adjacent devices and for isolating support circuitry devices (not shown). In an exemplary embodiment, the STI etch forms an STI region 544 having a depth of about 250 nm as illustrated by arrow 542.

[0076] As shown in FIG. 5E, an insulator 506 is deposited to cover the exposed storage node conductor 208 with an insulator thickness 507. As discussed above with regard to the first exemplary process, the insulator 506 is deposited using either a FOX or HDP oxide deposition. A thin nitride layer 508 is deposited upon the insulator 506 to act as an etch stop in subsequent processing steps.

[0077] As shown in FIG. 5F, the remaining STI region 544 is filled with an oxide 510 and planarized. As shown in FIG. 5G, the wafer is coated by a photoresist 512 patterned to expose the trench 240. The photoresist 512 is used as a mask to remove the oxide 510 from the trench 240, stopping on the nitride layer 508.

[0078] As shown in FIG. 5H, the photoresist 512 is stripped from the wafer. The nitride layer 250 and the thin nitride layer 508 are then stripped. The oxide layer 248 is carefully removed to concurrently remove the oxide on the side wall 202 while not removing excessive oxide formed upon the storage node conductor 208. A sacrificial 512 oxide is then grown to prepare the side wall 202 surface for gate processing.

[0079] As shown in FIG. 5I, the sacrificial oxide 512 is removed and the gate oxide 514 is grown. The layer of polysilicon 516 is deposited, filling the trenches 240 to act a gate conductor and word line and to act as a gate for the support circuitry (not shown).

[0080] As shown in FIG. 5J, a photoresist 518 is deposited and patterned. The wafer is then etched exclusive of the patterned photoresist 518 to form the word line 530 and the gate (not shown) of support circuit devices. Further processing similar to that described above with respect to FIG. 4H and FIG. 4 may be performed to complete the device as shown in FIG. 5K.

[0081] FIG. 5K is a cross sectional view of a dynamic random access memory (DRAM) device 500 according to an exemplary embodiment of the present invention which may be manufactured according to the fifth exemplary process of manufacture described above. As shown in FIG. 5K, the device 500 is formed using a deep trench (DT) having side walls 202 formed within a P-type silicon substrate 204. Another DRAM device 536 shown in FIG. 5K is formed adjacent to device 500.

[0082] The signal storage node of the memory device 500 may be formed similarly as described above with regard to the signal storage node of the memory device 200 in FIG. 2. Accordingly, like reference numerals in FIGS. 2 and 5K represent like elements and their description will not be repeated.

[0083] The signal transfer device of the memory device 500 includes a first diffusion region 520 coupled to the storage node conductor 208 by a buried strap 522, and a second diffusion region 524. The channel region 526 is controlled by the gate conductor 528. The gate conductor 528 is coupled to the word line 530. The gate conductor 528 is isolated from the channel region 526 by a gate oxide layer 514. The second diffusion region 524 is coupled to the bit line contact 532 and a bit line 534.

[0084] The gate conductor 528 is isolated from the storage node conductor 208 by the trench-top dielectric 538. The DRAM device 500 is isolated from the adjacent device 536 by the trench-top dielectric 538, the nitride layer 508 and STI 510.

[0085] Although illustrated and described above with reference to certain specific embodiments, the present invention is nevertheless not intended to be limited to the details shown. Rather, various modifications may be made in the details within the scope and range of equivalents of the claims and without departing from the spirit of the invention.

Claims

1. A dynamic random access memory device comprising: a substrate having a trench formed therein, the trench having a lower portion and a side wall; a signal storage node including a storage node conductor formed in the lower portion of the trench, a node dielectric, and a collar oxide disposed above the node dielectric, the storage node conductor isolated from the side wall by the node dielectric and by the collar oxide; a buried strap coupled to the storage node conductor and contacting a portion of the side wall of the trench above the collar oxide; a trench-top dielectric having a trench-top dielectric thickness formed upon the buried strap; and a signal transfer device including: a first diffusion region extending into the substrate adjacent the portion of the trench side wall contacted by the buried strap, a gate insulator having a gate insulator thickness formed on the trench side wall above the buried strap, wherein the gate insulator thickness is less than the trench-top dielectric thickness, and a gate conductor formed within the trench upon the trench-top dielectric and adjacent the gate insulator.

2. A dynamic random access memory device according to claim 1 wherein a ratio of the trench-top dielectric thickness to the gate insulator thickness ranges between 3:1 and 12:1.

3. A dynamic random access memory device according to claim 1 wherein the trench-top dielectric thickness ranges between 20 nm and 100 nm.

4. A dynamic random access memory device according to claim 1 wherein the trench has a circumference and the buried strap contacts the side wall of the trench along a fragment of the trench circumference.

5. A dynamic random access memory device according to claim 4 wherein the trench has a top and the device further comprises a trench insulator formed in the trench extending from the top of the trench down through a portion of the collar oxide and extending around the circumference of the trench exclusive of the fragment of the trench contacted by the buried strap.

6. A dynamic random access memory device according to claim 1 wherein the device has a signal storage node leakage current less than 10− amperes.

7. A dynamic random access memory device according to claim 5 wherein a ratio of the trench-top dielectric thickness to the gate insulator thickness ranges between 3:1 and 12:1.

8. A process of manufacturing a dynamic random access memory device in a substrate comprising the steps of: (a) etching a trench in the substrate, the trench having a side wall, a lower portion, and an upper portion; (b) forming a signal storage node having a storage node conductor disposed in the lower portion of the trench; (c) depositing a trench-top dielectric having a trench-top dielectric thickness upon the storage node conductor; (d) forming a signal transfer device having a gate conductor in the trench above the trench-top dielectric isolated from the side wall by a gate insulator having a gate insulator thickness less than the trench-top dielectric thickness.

9. A process of manufacturing a dynamic random access memory device in a substrate comprising the steps of: (a) forming a trench in the substrate, the trench having a side wall and a lower portion; (b) forming a signal storage node having a storage node conductor in the lower portion of the trench isolated from the side wall by a node dielectric and by a collar oxide disposed above the node dielectric; (c) coupling the storage node conductor, with a buried strap, to a portion of the side wall above the collar oxide; (d) depositing a trench-top dielectric having a trench-top dielectric thickness upon the storage node conductor; (e) forming a signal transfer device including: (i) a first diffusion region extending into the substrate adjacent the portion of the trench side wall contacted by the buried strap, (ii) a gate insulator having a gate insulator thickness formed on the trench side wall above the buried strap, wherein the gate insulator thickness is less than the trench-top dielectric thickness, and (iii) a gate conductor formed within the trench upon the trench-top dielectric and adjacent the gate insulator.

10. The process according to claim 9 wherein step (d) includes using one of high density plasma (HDP) deposition and flowable oxide (FOX) deposition.

11. The process according to claim 9 wherein steps (d) and (e) include forming the trench-top dielectric and the gate insulator wherein the trench-top dielectric has a thickness ranging between three and twelve times the gate insulator thickness.

12. The process according to claim 9 wherein step (d) includes forming the trench-top dielectric having a thickness ranging between 20 and 100 nm.

13. The process according to claim 9 wherein the trench has a circumference and in step (e) the buried strap is formed to contact the side wall of the trench along a fragment of the trench circumference.

14. The process according to claim 13 wherein the trench has a top and the process further comprises a step of depositing a trench insulator in the trench extending from the top of the trench down through a portion of the collar oxide and extending around the circumference of the trench exclusive of the fragment of the trench contacted by the buried strap.

15. The process according to claim 9 wherein step (d) includes depositing the trench-top dielectric to a thickness wherein the signal storage node has a leakage current less than 10− amperes.

16. The process according to claim 14 wherein steps (d) and (e) include forming the trench-top dielectric and the gate insulator wherein the trench-top dielectric has a thickness ranging between three and twelve times the gate insulator thickness.

17. A process of manufacturing a dynamic random access memory device in a substrate comprising the steps of: (a) forming a trench in the substrate, the trench having a side wall, a lower portion, and a circumference; (b) forming a signal storage node having a storage node conductor in the lower portion of the trench, the storage node conductor being isolated from the side wall by a node dielectric and by a collar oxide disposed above the node dielectric and being coupled to a portion of the side wall by a buried strap extending above the collar oxide and around a fragment of the circumference of the trench; (c) forming an isolation region within the trench extending into the collar oxide and around the circumference of the trench exclusive of the fragment contacted by the buried strap; and (d) forming a signal transfer device having a gate conductor in the trench.

18. A process of manufacturing a dynamic random access memory device according to claim 17 wherein step (c) includes the steps of: (c1) filling the trench with a photoresist; (c2) etching the photoresist from the trench along the circumference of the trench exclusive of the fragment contacted by the buried strap; and (c3) performing a shallow trench isolation etch into a portion of the collar oxide along the circumference of the trench exclusive of the fragment contacted by the buried strap.

19. The process according to claim 17 further comprising the step of forming a trench-top dielectric between the storage node conductor and the gate conductor.

20. The process according to claim 19 wherein the trench-top dielectric is formed having a thickness ranging between 20 nm and 100 nm.