Number | Date | Country | Kind |
---|---|---|---|
5-308244 | Dec 1993 | JPX |
Number | Name | Date | Kind |
---|---|---|---|
5266521 | Lee et al. | Nov 1993 | |
5356836 | Chen et al. | Oct 1994 | |
5371042 | Ong | Dec 1994 |
Number | Date | Country |
---|---|---|
02186634 | Jul 1990 | JPX |
03188267 | Aug 1991 | JPX |
06020994 | Jan 1994 | JPX |
Entry |
---|
"Al-Plaph (Aluminum-Planarization by Post-Heating) Process for planarized Double CMOS Applications", C. S. Park, S. I. Lee, J. H. Park, J. H. Sohn, D. Chin, J. G. Lee, Jun. 11-12, 1991 VMIC Conference, pp. 326-328. |
"Quarter, Micron Hole Filling with SiN sidewall by aluminum High temperature sputtering", M. Taguchi, K. Koyama, Y. Sugano, Jun. 9-10, 1992 VMIC Conference, pp. 219-225. |