Process tube for manufacturing semiconductor wafers

Information

  • Patent Grant
  • D586768
  • Patent Number
    D586,768
  • Date Filed
    Wednesday, April 11, 2007
    17 years ago
  • Date Issued
    Tuesday, February 17, 2009
    15 years ago
Abstract
Description


FIG. 1 is a front view of the design for a process tube for manufacturing semiconductor wafers in accordance with the invention;



FIG. 2 is a rear view thereof;



FIG. 3 is a right side view thereof;



FIG. 4 is a left side view thereof;



FIG. 5 is a top view thereof;



FIG. 6 is a bottom view thereof;



FIG. 7 is a sectional view thereof along line 77 of FIG. 5;



FIG. 8 is a sectional view thereof along line 88 of FIG. 5;



FIG. 9 is a sectional view thereof along line 99 of FIG. 1; and,



FIG. 10 is a front, perspective view thereof.


In the preferred embodiment, the entire body of the process tube is transparent such that the inside of the tube can be seen. Dash lines show the boundary of the claimed design.


The broken lines define portions of the process tube that form no part of the claimed design.


Claims
  • The ornamental design for a process tube for manufacturing semiconductor wafers, as shown and described.
Priority Claims (1)
Number Date Country Kind
2006-027524 Oct 2006 JP national
US Referenced Citations (10)
Number Name Date Kind
5618349 Yuuki Apr 1997 A
D404368 Shimazu Jan 1999 S
D405062 Shimazu Feb 1999 S
D406113 Hanagata et al. Feb 1999 S
5948300 Gero et al. Sep 1999 A
6251189 Odake et al. Jun 2001 B1
6538237 Yang et al. Mar 2003 B1
D520467 Ishii et al. May 2006 S
D521464 Ishii et al. May 2006 S
20020014483 Suzuki et al. Feb 2002 A1