Process tube for manufacturing semiconductor wafers

Information

  • Patent Grant
  • D600659
  • Patent Number
    D600,659
  • Date Filed
    Friday, March 9, 2007
    17 years ago
  • Date Issued
    Tuesday, September 22, 2009
    15 years ago
Abstract
Description


FIG. 1 is a perspective view of the design for a process tube for manufacturing semiconductor wafers in accordance with the invention;



FIG. 2 is a front view thereof;



FIG. 3 is a rear view thereof;



FIG. 4 is a top view thereof;



FIG. 5 is a bottom view thereof;



FIG. 6 is a right side view thereof;



FIG. 7 is a left side view thereof;



FIG. 8 is a sectional view thereof along line 88 of FIG. 4;



FIG. 9 is a sectional view thereof along line 99 of FIG. 4;



FIG. 10 is a sectional view thereof along line 1010 of FIG. 4; and,



FIG. 11 is a sectional view thereof along line 1111 of FIG. 2.


The broken lines are shown for illustrative purpose only and form no part of the claimed design.


Claims
  • The ornamental design for a process tub for manufacturing semiconductor wafers, as shown and described.
Priority Claims (1)
Number Date Country Kind
2006-024315 Sep 2006 JP national
US Referenced Citations (10)
Number Name Date Kind
5618349 Yuuki Apr 1997 A
D404368 Shimazu Jan 1999 S
D405062 Shimazu Feb 1999 S
D406113 Hanagata et al. Feb 1999 S
5948300 Gero et al. Sep 1999 A
6251189 Odake et al. Jun 2001 B1
6538237 Yang et al. Mar 2003 B1
D520467 Ishii et al. May 2006 S
D521464 Ishii et al. May 2006 S
20020014483 Suzuki et al. Feb 2002 A1