The present invention relates to a processing apparatus having a touch panel.
In general, a processing apparatus that processes a workpiece such as a semiconductor wafer is configured to have plural movement axes. For example, in a cutting apparatus, an X-axis along which a chuck table that holds a workpiece is moved in a processing feed direction, a Z-axis along which a cutting blade is caused to move farther away from or closer to the chuck table, and a Y-axis along which the cutting blade is moved in an indexing direction are set. Moreover, in the cutting apparatus, besides the above-described X-axis, Y-axis, and Z-axis, various movement axes such as a lifting-lowering axis for lifting and lowering of a cassette stage and a conveyance axis along which the workpiece is conveyed between a cassette and the chuck table are set (for example, refer to Japanese Patent Laid-open No. 2006-108219).
In maintenance work of such a processing apparatus, the chuck table is moved in the X-direction and the cutting blade is moved in the Y-direction to evacuate units that are obstacles to the work and return the units to the original positions after the work. When the respective units are returned, the units are moved at low speed with a visual check of whether the units do not collide with each other. When the unit is evacuated, the movement position of the unit varies according to the work place. At a position distant from the target position, the unit is moved at high speed. When getting close to the target position, the unit is moved at low speed to be moved little by little with a visual check.
For this purpose, in the present processing apparatus, motion modes of high-speed movement and low-speed movement of the unit are set. Movement keys about which movement directions are symmetrical are displayed on a touch panel of the processing apparatus. Moreover, low-speed movement keys and high-speed movement keys are separately displayed as the movement keys and the motion mode of the movement axis is changed by pressing the movement key of different movement speed. That is, the following operation is possible. When a unit is comparatively distant from the target position, the operator presses the high-speed movement key on the touch panel to move the unit at high speed. When the unit comes close to the target position, the operator separates the finger from the high-speed movement key and presses the low-speed movement key to make switching to low-speed movement and bring the unit closer to the target position.
In the above-described touch panel, low-speed movement and high-speed movement are stopped by separating a finger from the low-speed movement key and the high-speed movement key. For this reason, when switching between the low-speed movement and the high-speed movement is made, the movement keys different from each other are pressed and thus the movement keys on the touch panel need to be sought. Moreover, when a unit has passed through the target position, the movement key of the reverse direction needs to be pressed and thus the movement key of the reverse direction needs to be sought from the screen of the touch panel.
Thus, an object of the present invention is to provide a processing apparatus that can change the movement direction and movement speed of a unit by simple operation.
In accordance with an aspect of the present invention, there is provided a processing apparatus including a unit that is movable along one direction; a touch panel that displays an operation screen of the unit, a movement button that accepts a movement instruction to the unit being displayed on the touch panel; control means for controlling movement of the unit according to operation to the touch panel; and a movement axis that moves the unit forward and reversely along the one direction, in which the control means includes a movement direction deciding section that decides a movement direction of the movement axis based on a movement direction in which a finger that has pressed the movement button moves on a screen, a finger movement speed recognizing section that recognizes movement speed of the finger that moves on the screen, and an axis movement speed deciding section that decides axis movement speed from the movement speed of the finger recognized by the finger movement speed recognizing section.
According to this configuration, the movement direction of the unit is automatically decided based on the direction in which the finger that has pressed the movement button on the touch panel has moved on the screen. In addition, the movement speed of the unit is automatically decided based on the movement speed of the finger on the screen. Therefore, the movement direction and movement speed of the unit can be easily switched and the operability of the unit based on the touch panel is improved. Moreover, the movement direction of the unit is not instructed by a movement key, arrow key, or the like about which the movement direction has been decided, and the movement direction of the unit is automatically decided based on the direction in which the finger starts to move. Thus, the movement direction of the unit can be switched without visual check with the touch panel by the operator.
According to the present invention, the movement direction of the unit is decided from the direction in which the finger that has pressed the movement button on the touch panel has moved. In addition, the movement speed of the unit is decided from the movement speed of the finger on the screen. Therefore, the operability of the unit based on the touch panel can be improved.
The above and other objects, features and advantages of the present invention and the manner of realizing them will become more apparent, and the invention itself will best be understood from a study of the following description and appended claim with reference to the attached drawings showing a preferred embodiment of the invention.
A cutting apparatus of the present embodiment will be described below with reference to the accompanying drawings.
A cutting apparatus 1 is provided with a touch panel 75 that accepts operation by an operator and various kinds of processing conditions are set by the touch panel 75. The cutting apparatus 1 is configured to relatively move cutting blades 71 (see
A dicing tape T is stuck to the back surface of the workpiece W and a ring frame F is stuck to the periphery of the dicing tape T. The workpiece W is carried in to the cutting apparatus 1 in the state of being supported by the ring frame F with the intermediary of the dicing tape T. It suffices for the workpiece W to be what becomes a processing target. For example, the workpiece W may be a semiconductor wafer or optical device wafer on which devices have been formed. Furthermore, the dicing tape T may be a die attach film (DAF) tape obtained by sticking a DAF to a tape base besides a normal adhesive tape obtained by applying an adhesive layer on a tape base.
The cutting apparatus 1 has a casing 10 that covers the processing space of cutting processing and has a rectangular parallelepiped shape and a support base 13 that is adjacent to the casing 10 and forms a waiting space and a cleaning space. The center of the upper surface of the support base 13 is opened to extend toward the inside of the casing 10 and this opening is covered by a moving plate 15 that can move together with the chuck table 14 and a waterproof cover 16 having an accordion shape. An X-axis movement mechanism 50 (see
A holding surface 17 is formed in the chuck table 14 of a porous ceramic material and the workpiece W is sucked and held by a negative pressure generated through this holding surface 17. Four clamps 18 of an air-driven type are provided around the chuck table 14 and the ring frame F around the workpiece W is clamped and fixed from four sides by the respective clamps 18. A pair of centering guides 21 that extend along the Y-axis direction are provided over the chuck table 14. Through separation and approximation between the pair of centering guides 21 in the X-axis direction, the workpiece W is positioned in the X-axis direction relative to the chuck table 14.
On the support base 13, an elevator unit 22 on which a cassette is placed is provided adjacent to the chuck table 14. In the elevator unit 22, a stage 23 on which a cassette is placed is lifted and lowered and the loading/unloading position of the workpiece W in the cassette is adjusted in the height direction. A side surface 11 of the casing 10 is provided with a push-pull arm 24 that loads and unloads the workpiece W into and from a cassette while causing the pair of centering guides 21 to guide the ring frame F. Furthermore, the side surface 11 of the casing 10 is provided with a carry-in arm 31 and a carry-out arm 41 that convey the workpiece W between the pair of centering guides 21 and the chuck table 14.
The push-pull arm 24 is driven by a horizontal movement mechanism 25 disposed on the side surface 11 of the casing 10. The horizontal movement mechanism 25 has a pair of guide rails 26 that are disposed on the side surface 11 of the casing 10 and are parallel to the Y-axis direction and a slider 27 that is slidably set on the pair of guide rails 26 and is motor-driven. A nut part, which is not shown in the diagram, is formed on the back surface side of the slider 27 and a ball screw 28 is screwed to this nut part. A drive motor 29 joined to a one-end part of the ball screw 28 is rotationally driven and thereby the push-pull arm 24 executes push-pull action in the Y-axis direction along the pair of guide rails 26.
The carry-in arm 31 and the carry-out arm 41 are driven by horizontal movement mechanisms 32 and 42 disposed on the side surface 11 of the casing 10. The horizontal movement mechanisms 32 and 42 have pairs of guide rails 33 and 43 that are disposed on the side surface 11 of the casing 10 and are parallel to the Y-axis direction and sliders 34 and 44 that are slidably set on the pairs of guide rails 33 and 43 and are motor-driven. Nut parts, which are not shown in the diagram, are formed on the back surface side of the sliders 34 and 44 and ball screws 35 and 45 are screwed to these nut parts. Drive motors 36 and 46 joined to one-end parts of the ball screws 35 and 45 are rotationally driven and thereby the carry-in arm 31 and the carry-out arm 41 are conveyed and moved in the Y-axis direction along the pairs of guide rails 33 and 43.
As shown in
A gate-shaped standing wall part 20 provided upright in such a manner as to straddle the movement path of the chuck table 14 is provided on the base 19. The standing wall part 20 is provided with a Y-axis movement mechanism 60 that moves cutting means 70 in the Y-axis direction and Z-axis movement mechanisms 65 that move the cutting means 70 in the Z-axis direction. The Y-axis movement mechanism 60 has a pair of guide rails 61 that are disposed on the front surface of the standing wall part 20 and are parallel to the Y-axis direction and Y-axis tables 62 slidably set on the pair of guide rails 61. The Z-axis movement mechanisms 65 each have a pair of guide rails 66 that are disposed on the Y-axis table 62 and are parallel to the Z-axis direction and a Z-axis table 67 slidably set on the pair of guide rails 66.
The cutting means 70 that cut the workpiece W are provided under the respective Z-axis tables 67. A nut part is formed on the back surface side of each of tables including the Y-axis tables 62 and the Z-axis tables 67 and ball screws 63 and 68 are screwed to these nut parts. Drive motors 64 and 69 are joined to one-end parts of the ball screws 63 for the Y-axis tables 62 and the ball screws 68 for the Z-axis tables 67, respectively. The respective ball screws 63 and 68 are rotationally driven by the drive motors 64 and 69. Thereby, each cutting means 70 is moved in the Y-axis direction along the guide rails 61 and each cutting means 70 is moved in the Z-axis direction along the guide rails 66.
The cutting blade 71 that is held by the chuck table 14 and cuts the workpiece W is rotatably mounted to a spindle of each cutting means 70. Each cutting blade 71 is shaped into a circular plate shape by binding diamond abrasive grains by a binding agent, for example. Returning back to
Incidentally, on a general axis motion screen like one shown in a comparative example of
Therefore, in the present embodiment, movement buttons 81 (see
A control configuration for units will be described below with reference to
As shown in
As shown in
The control means 90 is provided with a movement direction deciding section 91 that decides the movement direction of the movement axis 96 according to the movement direction of a finger that has pressed the movement button 81, a finger movement speed recognizing section 92 that recognizes the speed of the finger on the screen, and an axis movement speed deciding section 93 that decides the axis movement speed of the movement axis 96 from the movement speed of the finger. When a finger that has pressed the movement button 81 is slid, the movement direction deciding section 91 decides the movement direction of the movement axis 96 based on the movement direction of the finger. In this case, the position at which the finger has gotten contact with the movement button 81 first is deemed as the starting point and the movement direction of the movement axis 96 is decided depending on which of the clockwise direction (forward direction) and the anticlockwise direction (reverse direction) the finger moves in with respect to the starting point.
The finger movement speed recognizing section 92 recognizes the movement speed from the distance across which a finger has moved on the screen in a predetermined time. The movement speed of the finger is recognized to be low if the movement distance in the predetermined time is short, and the movement speed of the finger is recognized to be high if the movement distance in the predetermined time is long. The axis movement speed deciding section 93 decides the axis movement speed according to the movement speed of the finger recognized by the finger movement speed recognizing section 92. In this case, the axis movement speed according to the movement speed of the finger is decided with reference to a correspondence data table of the movement speed of the finger and the axis movement speed. For example, according to the movement speed of the finger, two stages of movement speed, low speed and high speed, are prepared as the axis movement speed.
Furthermore, the control means 90 is provided with an indexing feed section 94 that executes indexing feed of the unit 97 by the movement axis 96 through pressing of the indexing feed button 82 by a finger. When the indexing feed button 82 is pressed on the touch panel 75, the indexing feed section 94 drives the movement axis 96 to move the unit 97 along one direction by a predetermined indexing feed amount. That is, in the case of operating the movement axis 96 at the time of maintenance work or the like, it is possible to select two kinds of operation, direct feed operation with use of the movement button 81 and indexing feed operation with use of the indexing feed button 82.
As above, the units 97 joined to the movement axes 96 can be manually operated by operating the axis motion screen of the touch panel 75 with a finger. The respective units of the control means 90 are configured by processor, memory, and so forth that execute various kinds of processing. The memory is formed of one or plural storage media such as read only memory (ROM) and random access memory (RAM) according to the use purpose. In the memory, a program for drive control of the respective units of the apparatus and a program for display control are stored, for example. Furthermore, the control means 90 may be provided exclusively for the touch panel 75 separately from control of the whole of the cutting apparatus 1.
The axis motion screen will be described with reference to
As shown in
The movement buttons 81 having a ring shape are displayed around the indexing feed buttons 82. A finger is moved while the movement button 81 remains pressed with the finger. Thereby, movement of the X-axis, the Y1-axis, or the Y2-axis is executed according to the movement of the finger. The position at which the finger has gotten contact with the movement button 81 first is deemed as the starting point and the movement direction (forward or reverse direction) of the X-axis, the Y1-axis, or the Y2-axis is decided depending on which direction of the clockwise direction (forward direction) and the anticlockwise direction (reverse direction) the finger starts to move in with respect to the center of the movement button 81. In the example of the diagram, when a finger starts to move in the clockwise direction, the X-axis, the Y1-axis, or the Y2-axis is moved in the forward direction. When the finger starts to move in the anticlockwise direction, the X-axis, the Y1-axis, or the Y2-axis is moved in the reverse direction. As described later in detail, the movement direction and the movement distance are recognized from the coordinates of at least three points on the locus of the finger that has moved on the screen in a predetermined time.
Moreover, the movement speed of the finger is obtained from the movement distance in the predetermined time and the movement speed of the X-axis, the Y1-axis, or the Y2-axis is decided according to the movement speed of the finger. For example, the touch panel 75 recognizes the coordinates of the place pressed with the finger and the movement distance of the finger is obtained based on the locus along which the finger has moved in the predetermined time. Then, switching is made between high-speed movement and low-speed movement of the X-axis, the Y1-axis, or the Y2-axis according to whether or not this movement distance is equal to or longer than a reference distance. The high-speed movement corresponds with the indexing feed speed and the low-speed movement is set to 1/10 of the indexing feed speed. Then, when the finger is separated from the movement button 81, the movement direction and movement speed of the X-axis, the Y1-axis, or the Y2-axis are reset.
When the movement button 81 is pressed, input to another button becomes unacceptable until the finger is separated from the screen (operation surface) of the touch panel 75. Therefore, even when a finger is slid in the state in which the finger presses the movement button 81 and the finger gets contact with the indexing feed button 82, indexing feed of the X-axis, the Y1-axis, or the Y2-axis is not executed and erroneous operation is prevented. Furthermore, once the movement button 81 is pressed with a finger, the whole screen of the touch panel 75 functions as the operation surface. Thus, even when the finger slid on the screen gets out of the ring-shaped region of the movement button 81, the X-axis, the Y1-axis, or the Y2-axis can be moved until the finger is separated from the screen of the touch panel 75. That is, the movement direction does not change until the finger is separated from the screen and the movement speed is changed in association with the movement speed of the finger.
Input cells 85 and 86 and origin return buttons 87 are set at the lower parts of the respective operation regions 80a, 80b, and 80c. The indexing feed amounts of the X-axis, the Y1-axis, and the Y2-axis are set in the input cells 85 and the movement speeds at the time of high-speed movement of the X-axis, the Y1-axis, and the Y2-axis are set in the input cells 86. Through pressing of the origin return buttons 87, return to the initial standby position is executed regarding the X-axis, the Y1-axis, and the Y2-axis. As above, by moving the X-axis, the Y1-axis, and the Y2-axis in association with the motion of a finger on the axis motion screen, the chuck table 14 and the pair of cutting means 70 can be intuitively moved forward and reversely along one direction.
An operation method of the movement axis by use of the touch panel will be described with reference to
As shown in
As shown in
Furthermore, for example, as shown in
In addition, as shown in
Furthermore, the speed may be decided from movement distance L2 and movement distance L3 if the movement distance L2 and the movement distance L3 are shorter than the movement distance L1, the movement distance L1 is longer than the reference distance L0 and the movement distance L2 and the movement distance L3 are shorter than the reference distance L0. For example, if a finger moves in order of starting point O, point P1, and point P2, the movement direction of the finger is recognized as the clockwise direction and, when the axis movement is started, 2.00 mm/second as the speed of the low-speed movement is set because the movement distance L2 is shorter than the reference distance L0.
As shown in
As described above, in the cutting apparatus 1 of the present embodiment, the movement direction of the unit is automatically decided based on the locus along which a finger that has pressed the movement button 81 on the touch panel 75 has moved on the screen in the predetermined time. In addition, the movement speed of the unit is automatically decided based on the movement speed of the finger on the screen. Due to this, the motion of the finger tip links to the motion of the unit. Therefore, the unit can be moved more intuitively, and the movement direction and movement speed of the unit are easily switched and the operability of the unit based on the touch panel is improved.
In the present embodiment, the operation regions of the X-axis, the Y1-axis, and the Y2-axis are set in the axis motion screen. However, the present invention is not limited to this configuration. For example, as shown in
Furthermore, in the present embodiment, the configuration is employed in which the finger movement speed recognizing section recognizes the movement speed of a finger from the movement distance in the predetermined time. However, the present invention is not limited to this configuration. It suffices for the finger movement speed recognizing section to have a configuration to recognize the speed of a finger that moves on the screen, and the finger movement speed recognizing section may recognize the movement speed of a finger from the time it takes for the finger to move across a predetermined distance.
Moreover, in the present embodiment, the configuration is employed in which the axis movement speed deciding section decides the axis movement speed from the movement speed of a finger by using the correspondence data table of the movement speed of the finger and the axis movement speed. However, the present invention is not limited to this configuration. It suffices for the axis movement speed deciding section to decide the axis movement speed from the correspondence relationship between the movement speed of the finger and the axis movement speed, and the axis movement speed deciding section may store the movement speed of the finger and the axis movement speed in a graph format.
In addition, in the present embodiment, the configuration is employed in which the axis movement speed deciding section varies the axis movement speed to two stages, high speed and low speed. However, the present invention is not limited to this configuration. The axis movement speed deciding section may vary the axis movement speed to three or more stages. Furthermore, the axis movement speed deciding section may set the axis movement speed to speed made proportional to the movement speed of the finger.
Furthermore, in the present embodiment, the touch panel of the capacitive system (surface capacitive system) is exemplified. However, the present invention is not limited to this configuration. It suffices for the touch panel to be capable of displaying the operation screen of the unit. For example, a touch panel of any of a resistive film system, projected capacitive system, ultrasonic surface acoustic wave system, optical system, or electromagnetic induction system may be used.
Moreover, in the present embodiment, the description is made with exemplification of the cutting apparatus that cuts a workpiece as the processing apparatus. However, the present invention is not limited to this configuration. The present invention can be applied to other processing apparatuses having a touch panel. For example, the present invention may be applied when other processing apparatuses such as grinding apparatus, polishing apparatus, laser processing apparatus, plasma etching apparatus, edge trimming apparatus, expanding apparatus, breaking apparatus, and cluster apparatus obtained by combining them are caused to move a movement axis as long as these processing apparatuses are each processing apparatus having a touch panel.
Therefore, although the chuck table, the cutting means, the push-pull arm, the carry-in arm, and the carry-out arm are exemplified as the units in the present embodiment, the present invention is not limited to this configuration. It suffices for the units to have a configuration that enables movement along one direction, and the units may be units such as various kinds of processing means, tables, and conveying means used in a grinding apparatus, a polishing apparatus, a laser processing apparatus, a plasma etching apparatus, an edge trimming apparatus, an expanding apparatus, a breaking apparatus, and a cluster apparatus, for example.
Moreover, in the present embodiment, the X-axis movement mechanism, the Y-axis movement mechanism, the Z-axis movement mechanism, and the horizontal movement mechanisms of the respective arms are exemplified as the movement axes. However, the present invention is not limited to this configuration. It suffices for the movement axes to have a configuration that moves the unit forward and reversely along one direction, and the movement axes may be an X-axis movement mechanism, a Y-axis movement mechanism, a Z-axis movement mechanism, and a horizontal movement mechanism used in a grinding apparatus, a polishing apparatus, a laser processing apparatus, a plasma etching apparatus, an edge trimming apparatus, an expanding apparatus, a breaking apparatus, and a cluster apparatus. Furthermore, the movement axes are not limited to movement mechanisms of a feed screw system. It suffices for the movement axes to be movement mechanisms of a direct acting system, and the movement axes may be movement mechanisms of a linear motor system, for example.
Furthermore, as the processing target, various kinds of works such as semiconductor device wafer, optical device wafer, package substrate, semiconductor substrate, inorganic material substrate, oxide wafer, green ceramic substrate, and piezoelectric substrate may be used, for example, according to the kind of processing. As the semiconductor device wafer, a silicon wafer or compound semiconductor wafer after device forming may be used. As the optical device wafer, a sapphire wafer or silicon carbide wafer after device forming may be used. Furthermore, a chip size package (CSP) substrate may be used as the package substrate. Silicon, gallium arsenide, or the like may be used as the semiconductor substrate and sapphire, ceramics, glass, or the like may be used as the inorganic material substrate. Moreover, as the oxide wafer, lithium tantalate or lithium niobate after device forming or before device forming may be used.
Moreover, although the embodiment of the present invention is described, what are obtained by wholly or partly combining the above-described embodiment and modification examples may be employed as other embodiments of the present invention.
Furthermore, embodiments of the present invention are not limited to the above-described embodiment and modification examples and may be variously changed, replaced, and modified without departing from the gist of technical ideas of the present invention. Moreover, if technical ideas of the present invention can be implemented in another way by advancement in technique or another technique that is derivative, the present invention may be carried out by using the method. Therefore, the scope of the claim covers all embodiments that can be included in the range of technical ideas of the present invention.
Moreover, although the configuration in which the present invention is applied to a cutting apparatus is described in the present embodiment, it is also possible to apply the present invention to another apparatus that drives a direct acting mechanism by a touch panel. As described above, the present invention has an effect that the movement direction and movement speed of a unit can be changed by simple operation, and is particularly useful for a cutting apparatus that cuts a workpiece.
The present invention is not limited to the details of the above described preferred embodiment. The scope of the invention is defined by the appended claim and all changes and modifications as fall within the equivalence of the scope of the claim are therefore to be embraced by the invention.
Number | Date | Country | Kind |
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2017-076645 | Apr 2017 | JP | national |