Processing method using atomic force microscope microfabrication device

Abstract

Under the condition that the height is fixed at a target height by turning off a feedback control system of a Z piezoelectric actuator of a cantilever of an atomic force microscope having a probe, which is harder than a processed material, flexure and twisting of the cantilever when carrying out mechanical processing while selectively repeating scanning only on the processed area (in the case of detecting flexure, parallel with the cantilever and in the case of detecting twisting, vertical with the cantilever) is monitored by a quadrant photodiode position sensing detector and the processing is repeated till a flexure amount or a twisting amount, namely, till an elastic deformation amount of the cantilever becomes not more than a determined threshold. It is not necessary to carry out scanning of the observation in obtaining the height information for detection of an end point, so that it is possible to improve a throughput of processing.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A and FIG. 1B are views explaining the case of detecting an end point by a flexure amount of a cantilever upon processing. FIG. 1A is the case that the area does not attain to the end point of the processing, and FIG. 1B is the case that the area attains to the end point of the processing.

FIGS. 2A and 2B are views explaining the case of detecting an end point by a flexure amount of a cantilever upon processing. FIG. 1A is the case that the area does not attain to the end point of the processing, and FIG. 1B is the case that the area attains to the end point of the processing.

FIG. 3 is a view explaining the case of changing a next determined processing height in response to the volume of flexure from a flexure amount upon processing.

FIG. 4 is a view explaining the case of changing a next determined processing height in response to the volume of twisting from a twisting amount upon processing.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

Hereinafter, the embodiment of the present invention will be described in detail with reference to the drawing taking a correction of an opaque defect of a photomask as an example. The present invention is naturally applied to a correction of an opaque defect (a quartz bump defect) of alternating aperture phase shift photomask (Shibuya-Revenson type phase-shifting mask).

Introducing a photomask having an opaque defect found by a defect inspection of a defect inspection device into an atomic force microscope microfabrication device having a probe (for example, a probe made of diamond) which is harder than the processed material, a high precision XY stage is moved to the position where the opaque defect is found. Upon observation, under the condition of feed backing of Z piezoelectric actuator with a flexure amount of a cantilever, the area including the opaque defect is imaged in a contact mode or an intermittent contact mode of a normal atomic force microscope. Comparing the obtained image with a normal pattern without a defect by pattern matching or the like, the defect portion needing the processing is extracted to be identified.

FIGS. 1A and 1B are views explaining the case of detecting an end point by a flexure amount of a cantilever upon processing. Then, this embodiment shows the case that the flexure amount is detected by a quadrant photodiode position sensing detector in an optical lever system.

A laser beam 6, which is emitted from a laser light source 10 and reflected on a rear surface of a cantilever 2 on the portion where a probe 1 is disposed, is controlled so as to strike a center of a quadrant photodiode position sensing detector 7 when there is no flexure on the cantilever 2. In the case that there is flexure on the cantilever 2, the laser beam 6 strikes the position deviated from the center of the quadrant photodiode position sensing detector 7, so that it is possible to detect if there is flexure or not by checking the output of the quadrant photodiode position sensing detector 7. In addition, it is also possible to estimate the flexure amount from a deviation amount from the center of the quadrant photodiode position sensing detector 7 of the laser beam 6 which is reflected on the rear surface of the cantilever 2.

Upon processing, a feedback control system 9 of a Z piezoelectric actuator 8, on the lower end of which the base of the cantilever 2 is fixed, is turned off. Moving the lower end of the Z piezoelectric actuator 8 in a Z direction by a predetermined amount, the base of the cantilever 2 is on the target level. Under the condition that the level of the base of the cantilever 2 is fixed, selectively repeating scanning of an opaque defect 3 of a light-resistant film 4 in a length direction of the cantilever 2, the defect is removed by mechanical processing. The target height is finally the height at which the front end of the probe 1 contacts a glass surface 5 in a binary mask and a half tone type phase shift mask, and is the height at which the probe 1 contacts the glass surface, which is a reference, in the case of a Levenson type phase shift mask. In the case that over-etching is generated by suddenly designating the target height of processing as the height of the glass surface, the removing processing is carried out while gradually lowering the target height till the area attains to the height of the glass surface step-by-step. In the case that the processed material (the opaque defect 3) is left for the target height while synchronizing the detected flexure amount of the cantilever 2 upon processing with scanning and two-dimensionally monitoring it in a planar direction, the front end of the probe 1 crashes against the processed material (the opaque defect 3) when scanning in the length direction of the cantilever 2, so that the cantilever 2 is flexed and the detected flexure amount is increased (FIG. 1A). In the case that the processed material is processed up to the target height, the front end of the probe 1 does not crash against the processed material (the opaque defect 3) when scanning in the length direction of the cantilever 2, so that the flexure amount is not increased (FIG. 1B). Assuming the area where the flexure amount is not more than the determined threshold as the end point of processing, in the next processing, the removing process is continued in the processing area except for the area that attains to the end point. In order not to have the untrimmed portion, the removing process is repeated till the all identified defect areas become the end points (finally, the glass surface 5 or the glass surface which is the reference) so as to completely remove defects for correction.

In the above description, the case of detecting the flexure amount of the cantilever 2 by the quadrant photodiode position sensing detector in an optical lever system upon processing is explained, however, the end point can be detected by the detection of the flexure amount using any of change of the piezoelectric actuator resistance in a self detection system and change of a distance in an optical interferometer system.

According to the example shown in the above-described FIGS. 1A and 1B, since the detection of the end point of the process is carried out depending on the flexure amount of the cantilever 2 upon processing, it is not necessary to carry out scanning for the observation in order to obtain the height information taking a long time in the middle of the processing. Therefore, it is possible to improve the throughput of the defect correction.

FIGS. 2A and 2B are views explaining the case of detecting an end point of process by a flexure amount of a cantilever upon processing. Then, this embodiment shows the case that the flexure amount is detected by a quadrant photodiode position sensing detector in an optical lever system. Also in the case that there is twisting on the cantilever 2, the laser beam 6 strikes the position deviated from the center of the quadrant photodiode position sensing detector 7, so that it is possible to detect if there is twisting or not by checking the output of the quadrant photodiode position sensing detector 7.

In this case, by scanning the probe 1 in the width direction of the cantilever 2, the defect is removed by the mechanical processing. Since scanning is carried out in the width direction, twisting is generated on the end portion of the cantilever 2 to be detected as an elastic change amount. In other words, in the case that the processed material (the opaque defect 3) is left for the target height, the front end of the probe 1 crashes against the processed material (the opaque defect 3) when scanning in the width direction of the cantilever 2, so that the cantilever 2 is twisted and the twisting amount to be detected is increased (FIG. 2A). In the case that the processed material is processed up to the target height, the front end of the probe 1 does not crash against the processed material (the opaque defect 3) when scanning, so that the twisting amount is not increased (FIG. 2B). Therefore, assuming the area where the flexure amount is not more than the determined threshold as the end point of processing, in the next processing, the removing process is continued in the processing area except for the area that attains to the end point.

In the above processing, since the end point of the processing is detected by the twisting amount of the cantilever 2 upon processing, it is not necessary to carry out scanning of observation, which takes a long time for obtaining the height information in the middle of the processing. Therefore, a time taken for defect correction can be shortened and the throughput can be improved.

In order to decrease the number of processing till the area attains to the end point in the detection of the end point using the above-described flexure amount which is explained with reference to FIGS. 1A and 1B, as shown in FIG. 3, a two-dimensional distribution of the flexure amount of the cantilever 2 which is detected upon the processing of the defect is obtained and in response to the volume of the flexure, by two-dimensionally controlling the next determined processing height (on the area where the flexure amount is large, the determined processing height is lowered), the removing processing is carried out, and then, by repeating detection of the end point of the processing by performing the processing at the target height again, the processing amount is large since the processing height is lowered than the target height on the area where the flexure amount is large and the area where the flexure amount is small is not trimmed so much because the height of this area is near to the target height. As a result, the number of processing till the area attains to the end point (finally, the glass surface or the glass surface, which is a reference) can be reduced in comparison with the case that the processing is continued as the target height is remained, so that a total time for correction of a defect can be made shorter.

Also in the case of detecting the twisting amount, which is described with reference to FIGS. 2A and 2B, as shown in FIG. 4, by obtaining the two-dimensional distribution of the twisting amount of the cantilever 2 upon processing and two-dimensionally controlling the next determined processing height in response to the volume of the twisting (on the area where the flexure amount is large, the determined processing height is lowered), the removing processing is carried out, and then, by repeating detection of the end point of the processing by performing the processing at the target height again, the processing amount is large since the processing height is lowered than the target height on the area where the twisting amount is large and the area where the twisting amount is small is not trimmed so much because the height of this area is near to the target height. As a result, the number of processing till the area attains to the end point (finally, the glass surface or the glass surface, which is a reference) can be reduced in comparison with the case that the processing is continued as the target height is remained, so that a total time for correction of a defect can be made shorter.

The present invention is described taking an opaque defect removal of the photomask as an example, however, the same method can be applied to not only processing of the defect correction of the photomask but also the processing which requires accuracy in the height direction and uniformity of the processed bottom face.

Claims

1. A processing method for removing a processed area which exists on a planar substrate as a bulge by using an atomic force microscope microfabrication device having a probe which is harder than a processed material, comprising the steps of: removing the processed area by scanning the cantilever in a planar direction and thereby scanning a probe that is disposed at an end portion of the cantilever in a planar direction on the processed area repetitively under the condition that a height of a base of a cantilever is fixed at a target height;monitoring an elastic modification amount of the cantilever when removing the processed area; anddetecting an end point of the processed area from the elastic modification amount.

2. The processing method using the atomic force microscope microfabrication device according to claim 1, wherein the target height is a height at which the probe contacts the planar substrate under the condition that the cantilever is not elastically deformed.

3. The processing method using the atomic force microscope microfabrication device according to claim 1, wherein the planar direction is a length direction of the cantilever and the elastic deformation amount is a flexure amount of the cantilever.

4. The processing method using the atomic force microscope microfabrication device according to claim 1, wherein the planar direction is a width direction of the cantilever and the elastic deformation amount is a twisting amount of the cantilever.

5. The processing method using the atomic force microscope microfabrication device according to claim 1, wherein the end point of the processed area is detected by repeating the steps of: controlling a next process height distribution in response to a two-dimensional distribution in a planar direction of the elastic deformation amount; and monitoring the elastic deformation amount of the cantilever upon the processing in which a height is fixed at the next process height again.

6. The processing method using the atomic force microscope microfabrication device according to claim 1, wherein an optical lever system is used to detect the elastic deformation amount.

7. The processing method using the atomic force microscope microfabrication device according to claim 1, wherein a self detection system is used to detect the elastic deformation amount.

8. The processing method using the atomic force microscope microfabrication device according to claim 6, wherein in the optical lever system, the detection of the elastic deformation amount is carried out by using a different value of a photo detector having detecting portion divided in quarters, the photo detector detecting light to be reflected by the cantilever.