Claims
- 1. A single use processing substrate, comprising:
a first cut-resistant layer having a first surface area with a width and including a first absorbent ply and a first thermoplastic material ply; a second layer having a second surface area and including a second absorbent ply and a second thermoplastic material ply; and a plurality of adhesive portions securing the first layer to the second layer, wherein each adhesive portion has an effective dimension shorter than the width of the first layer and wherein the first layer is secured to the second layer such that a portion of the second surface area is laterally disposed outside of the first surface area.
- 2. The single use processing substrate of claim 1, wherein the first layer further includes a plurality of apertures.
- 3. The single use processing substrate of claim 2, wherein the plurality of adhesive portions is in a pattern of discontinuous parallel segments.
- 4. The single use processing substrate of claim 3, wherein each of the adhesive portions is of substantially the same length.
- 5. The single use processing substrate of claim 4, wherein each of the plurality of adhesive portions is separated by a distance less than the length of each adhesive portion.
- 6. The single use processing substrate of claim 2, wherein the plurality of adhesive portions is disposed in a regular pattern.
- 7. The single use processing substrate of claim 2, wherein the plurality of apertures is disposed in a regular pattern.
- 8. The single use processing substrate of claim 2, wherein a regular spacing exists between apertures in an x-direction and a y-direction such that rows of apertures are formed.
- 9. The single use processing substrate of claim 8, wherein each of the plurality of adhesive portions is disposed in rows equidistant between rows of apertures.
- 10. The single use processing substrate of claim 2, wherein the first layer includes width edges, the processing substrate further including two border adhesive strips disposed parallel with and extending the entire distance of the width edges.
- 11. The single use processing substrate of claim 10, wherein the first layer includes length edges and further including two additional border adhesive strips disposed parallel with and extending the entire distance of the length edges.
- 12. A method of producing a single use processing substrate, the method comprising the steps of:
providing a first layer having a width and including a liquid absorbent ply adjacent to a cut resistant ply; providing a second layer including a liquid impermeable ply; applying adhesive to at least one of the liquid absorbent ply of the first layer or second layer so that the adhesive forms a plurality of adhesive portions with no portion being longer then the width of the first layer; and contacting the liquid absorbent ply to the second layer.
- 13. The method of claim 12, wherein the adhesive is applied only to the liquid absorbent ply.
- 14. The method of claim 13, wherein the adhesive is applied in broken parallel stripes.
- 15. The method of claim 14, wherein the adhesive portions are of substantially uniform size.
- 16. The method of claim 15, wherein the adhesive portions are longer than the distance between the adhesive portions.
- 17. A method of producing a single use processing substrate, the method comprising the steps of:
providing a first layer having a width and including a liquid absorbent ply adjacent to a cut resistant ply; providing a second layer including a liquid impermeable ply; applying adhesive to the liquid absorbent ply of the first layer so that the adhesive forms a plurality of adhesive portions; deactivating at least one section of each adhesive portion; and contacting the liquid absorbent ply to the second layer.
- 18. The method of claim 17, wherein a plurality of sections of each adhesive portion is deactivated.
- 19. The method of claim 18, wherein the step of applying comprises applying the adhesive in a pattern of parallel stripes.
- 20. The method of claim 19, wherein the step of deactivating comprises deactivating sections that are separated by a distance more than the length of each deactivated section.
RELATED CASES
[0001] This application is a continuation-in-part of Ser. No. 10/075,020, filed Feb. 12, 2002, entitled “Processing Substrate and/or Support Surface,” which is a continuation-in-part of Ser. No. 09/677,663, filed Oct. 2, 2000, entitled “Processing Substrate and/or Support Surface.”
Continuation in Parts (2)
|
Number |
Date |
Country |
Parent |
10075020 |
Feb 2002 |
US |
Child |
10364239 |
Feb 2003 |
US |
Parent |
09677663 |
Oct 2000 |
US |
Child |
10075020 |
Feb 2002 |
US |