This invention relates to the field of light emitting devices (LEDs), and in particular to a light emitting device having a light emitting surface that can be modified to enhance the light extraction efficiency of the device.
The use of roughened emitting surfaces is one of several techniques commonly used to enhance LED extraction efficiency in LED designs. Roughening may be applied to different types of LED structures including InGaN, AlInGaP systems, in flip chip bonded and vertical thin film device architectures, and others.
U.S. Pat. No. 7,875,533, “PACKAGE INTEGRATED THIN FILM LED, AND DEVICES”, issued to John Epler, Paul Martin and Michael Krames on 25 Jan. 2011, and incorporated by reference herein, discloses roughening of the GaN light emitting surface of an LED to enhance the light extraction efficiency using a photo-electrochemical etch process using a KOH solution. The depth of the etching is controlled using an etch stop layer that is grown during the formation of the light emitting device. In like manner, USPA 2010/0025717, USPA 2009/0146170, USPA 2008/0113463, and U.S. Pat. No. 7,749782 also disclose techniques for improving light extraction efficiency by roughening the light emitting surface, and are incorporated by reference herein.
Each of the above referenced methods creates a substantially uniformly roughened surface that allows for maximum light extraction, often allowing for the extraction of as much as twice the light as the original unroughened surface. With continuing increases in light emission efficiency, a doubling of the light extraction efficiency may be undesirable in certain applications. For example, it may be desirable to limit the total light output to a customer's maximum-flux specification, to conform to a particular standard, or to achieve a particular lighting effect.
Consider, for example, providing LED lamps for automobile headlights or taillights, typically comprising multiple light emitting elements. Standards exist that set a certain minimum and maximum luminescent output. The design of a particular lamp, including the number of light emitting elements, the shape of reflector and lens elements, etc. to achieve the desired luminescent output is fundamentally dependent upon the amount of light (flux) that can be provided by each light emitting element. Conventionally, as improved technologies provide for more light per light emitting element, the design of the ‘next-generation’ lamps takes advantage of this increased light output to achieve cost efficiencies while still maintaining the total luminescent output between the required minimum and maximum limits.
Although each next-generation lamp may be optimized for cost or other efficiencies, these efficiencies may be sub-optimal in a more global sense. Consider, for example, the progression of technologies exhibited in
As noted above, each of the lamps L1-L4 will use the available LED technology to achieve a cost-efficient design. However, because each of the lamps L1-L4 use an LED technology that provides a particular level of flux per LED element 111-114, the provider of these lamps L1-L4 must maintain production of each of these LED technologies. That is, in year Y4, because there is a demand for each of the lamps L1-L4, and each of the lamps L1-L4 were designed based on technologies that provided a corresponding flux per LED element 111-114, each of these technologies must be maintained for producing LED elements having the required flux per LED element 111-114.
In addition to introducing manufacturing complexities for maintaining various technologies, the cost of manufacturing each LED element may be sub-optimal, particularly as the demand for older technologies decreases, and the economies of mass production cannot be achieved. Additionally, as time progresses, newer technologies can be expected to provide LED elements with more flux at less cost. Thus, the cost of producing the LED elements used in lamp L4 may be less than the cost of producing the LED elements used in lamp L1, even though the LED elements used in lamp L4 produce a significantly higher flux per element 114.
However, even though the potential flux per unit cost of using the LED technology used in lamp L4 may be significantly lower than the cost of using the LED technology used in lamp L1, the LED elements used in lamp L4, with flux 114, may not be useable in lamp L1, which was designed for a lower flux per element 111, if the luminance output of lamp L1 with LED elements having flux 114 exceeds some specified maximum luminance output for the use of lamp L1.
It would be advantageous to be able to reliably and/or inexpensively control the light flux of a light emitting element to allow the use of a common LED technology among applications designed for different flux levels. It would also be advantageous to be able to control the flux of a light emitting element without substantially modifying the process used to produce the light emitting element.
To better address one or more of these concerns, in an embodiment of this invention, conventional techniques are used to modify the surface of a light emitting device, such as roughening the surface, to enhance the light extraction efficiency, but the degree of modification of the surface is controlled by controlling one or more of the parameters associated with the modification technique. A given LED technology will have some minimum flux without modification and some maximum flux with optimal modification. By characterizing the relationship between the parameters of the modification process and the resultant flux, the parameters of the modification process can be controlled to achieve a desired flux between the minimum and maximum flux achievable by the given LED technology.
The invention is explained in further detail, and by way of example, with reference to the accompanying drawings wherein:
Throughout the drawings, the same reference numerals indicate similar or corresponding features or functions. The drawings are included for illustrative purposes and are not intended to limit the scope of the invention.
In the following description, for purposes of explanation rather than limitation, specific details are set forth such as the particular architecture, interfaces, techniques, etc., in order to provide a thorough understanding of the concepts of the invention. However, it will be apparent to those skilled in the art that the present invention may be practiced in other embodiments, which depart from these specific details. In like manner, the text of this description is directed to the example embodiments as illustrated in the Figures, and is not intended to limit the claimed invention beyond the limits expressly included in the claims. For purposes of simplicity and clarity, detailed descriptions of well-known devices, circuits, and methods are omitted so as not to obscure the description of the present invention with unnecessary detail.
As noted above, a variety of techniques may be used to modify the light emitting surface(s) of light emitting devices, the most common technique currently being used is a photo-electrochemical etch process. Accordingly, for ease of presentation and understanding, this invention is being presented using the paradigm of such an etching process.
As noted above, to improve the light extraction efficiency, and thereby increase the flux provided by the LED element, the “top” surface 215 of the n-layer 210 may be roughened, using, for example, a photo-electrochemical etch process using a KOH solution. Typically, a flux increase of as much as 100% may be achieved compared to an unroughened surface.
Co-pending U.S. patent application 61/585,673, “SIDEWALL ETCHING OF LED DIE TO IMPROVE LIGHT EXTRACTION”, filed 12 Jan. 2012 for Tiang Chuan Hng and Tomonari Ishikawa, Attorney docket 2011P002295US, discloses a photoelectrochemical etching technique that improves the light extraction efficiency by roughening the sidewalls of the LED die, and is incorporated by reference herein. In this application, each LED is situated in a solution of KOH and K252O8 between a multi-directional light source and a mirror, and is illuminated for a duration of about 45 minutes to achieve an additional flux increase of about 30% compared to an LED with unroughened edges.
For the purposes of this disclosure and accompanying claims, “surface roughening” includes the roughening of any and all surfaces of the LED element, including edge surfaces 217.
Although the result of time duration of exposure to a roughening process is illustrated in
In like manner, as disclosed in copending U.S. patent application 61/584,836, “CONTROLLED LED LIGHT OUTPUT BY SELECTIVE AREA ROUGHENING”, filed 10 Jan. 2012 for Mac Benedict, Paul Martin, and Dave Kharas, and incorporated by reference herein, the proportion of the area that is roughened is controlled. The roughened area enhances the light extraction efficiency while the unroughened area does not enhance the extraction efficiency, the proportion of roughened area to unroughened area determining the overall increase in light extraction efficiency. One of skill in the art will recognize that multiple surface processing parameters may be controlled to achieve the desired amount of light extraction efficiency.
One of skill in the art will recognize that the relationship illustrated in
As noted above, there may be a variety of roughening parameters that can be controlled, and the parameter, or set of parameters, that exhibits the least variance would generally be preferred, assuming the costs associated with controlling each parameter are comparable.
At 420, a particular LED technology is selected. For example, the technology having the greatest flux per unit cost may be the preferred choice, provided that it is suitable for use in the current application.
To determine the suitability of the selected technology, the minimum and maximum achievable flux per element is determined, based on control of the degree of roughening, at 430. If the required flux is not between the achievable minimum and maximum flux using this technology, at 440, a different technology, if available, is similarly assessed at 420-440.
When a suitable technology is identified, at 440, the required degree of flux increase over the minimum flux is determined, at 450, and the corresponding roughening parameter value is determined, at 460, using the previously determined relationship between the roughening parameter and increased flux over an unroughened surface. Plotted line 380 is one example of a roughening/flux relationship.
The selection of the particular roughening parameter value may be based on the aforementioned variance and the requirements for the required flux. If, for example, the application requires that the flux does not exceed a particular value, the parameter value is selected such that most (e.g. 95%) of the elements produced will be below the required flux, based on the expected distribution of flux per element at the selected parameter value. The expected distribution of flux per element may also be used to assure that an acceptable number of the produced elements are able to achieve a required minimum flux at the selected parameter value.
The LED elements are fabricated, at 470, then the surface is roughened using the determined roughening parameter value, at 480. For example, if the time that the surface is subjected to the roughening process is the parameter used to control the degree of roughening, the LED elements are subjected to the roughening process for the determined roughening time. If the concentration of etching solution is the parameter used to control the degree of roughening, the LED elements are subjected to the roughening process of the determined concentration. One of skill in the art will also recognize that a combination of parameters may be controlled to achieve a desired degree of roughening, such as controlling both the concentration of etching solution and the etching time.
As can be seen, by determining the relationship between flux of an LED element and a roughening parameter, the flux of the LED element may be controlled by controlling the value of the roughening parameter. In this manner, for example, with reference to
While the invention has been illustrated and described in detail in the drawings and foregoing description, such illustration and description are to be considered illustrative or exemplary and not restrictive; the invention is not limited to the disclosed embodiments.
For example, it is possible to operate the invention in an embodiment wherein different surfaces of the LED element are roughened to different degrees than other surfaces, thereby achieving a desired light output distribution, with a controlled flux in each direction. One of skill in the art will recognize that the degree of control may be dependent upon the stage of manufacturing at which the control is applied. If, as in the example of this disclosure, the controlled etching is applied to the edges of the LED device, the LED device will need to be singulated before the edge-etching is applied. In other applications, applying and controlling the surface roughening at the wafer level, before singulation, may be sufficient to achieve the desired control of light output efficiency.
Other variations to the disclosed embodiments can be understood and effected by those skilled in the art in practicing the claimed invention, from a study of the drawings, the disclosure, and the appended claims. In the claims, the word “comprising” does not exclude other elements or steps, and the indefinite article “a” or “an” does not exclude a plurality. The mere fact that certain measures are recited in mutually different dependent claims does not indicate that a combination of these measured cannot be used to advantage. Any reference signs in the claims should not be construed as limiting the scope.
Filing Document | Filing Date | Country | Kind | 371c Date |
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PCT/IB2013/050743 | 1/29/2013 | WO | 00 | 7/22/2014 |
Number | Date | Country | |
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61594106 | Feb 2012 | US |