TREA

wafer bonding or at least partial removal of the growth substrate

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Industry

  • CPC
  • H01L33/0079
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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof Details thereof

Current Industry

H01L33/0079wafer bonding or at least partial removal of the growth substrate
Industries