Quasi-waveguide printed circuit board structure

Abstract

In some embodiments a channel is formed in printed circuit board material, the formed channel is plated to form at least two side walls of a quasi-waveguide, and printed circuit board material is laminated to the plated channel using thermoset adhesive. Other embodiments are described and claimed.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

The inventions will be understood more fully from the detailed description given below and from the accompanying drawings of some embodiments of the inventions which, however, should not be taken to limit the inventions to the specific embodiments described, but are for explanation and understanding only.

FIG. 1 illustrates a process of forming an embedded waveguide according to some embodiments of the inventions.

FIG. 2 illustrates an embedded waveguide according to some embodiments of the inventions.

FIG. 3 illustrates a process of forming an embedded waveguide according to some embodiments of the inventions.

FIG. 4 illustrates an embedded waveguide according to some embodiments of the inventions.

FIG. 5 illustrates a process of forming an imprinted waveguide according to some embodiments of the inventions.

FIG. 6 illustrates a process of forming an imprinted waveguide according to some embodiments of the inventions.

FIG. 7 illustrates processes of imprinting cores (and/or sub-parts) that are used to form a waveguide according to some embodiments of the inventions.

FIG. 8 illustrates a process of forming a quasi-waveguide according to some embodiments of the inventions.

FIG. 9 illustrates a quasi-waveguide according to some embodiments of the inventions.

Claims

1. A method comprising: forming a channel in printed circuit board material;plating the formed channel to form at least two side walls of a quasi-waveguide; andlaminating printed circuit board material to the plated channel using thermoset adhesive.

2. The method of claim 1, wherein the channel is formed in a copper clad core.

3. The method of claim 1, wherein the channel is formed in a dielectric material.

4. The method of claim 1, wherein the channel is formed in a multilayer printed circuit board composite.

5. The method of claim 1, wherein a conductor is laminated over the channel using the thermoset adhesive.

6. The method of claim 1, wherein the thermoset adhesive is removed in an area of the channel prior to lamination.

7. The method of claim 1, wherein the quasi-waveguide is an air filled quasi-waveguide.

8. The method of claim 1, wherein the quasi-waveguide is a high speed interconnect.

9. The method of claim 1, wherein the printed circuit board material includes low cost FR4 material.

10. The method of claim 1, wherein the printed circuit board material includes thermoset FR4 material.

11. A quasi-waveguide comprising: a channel formed in printed circuit board material;at least two plated side walls of the channel; andprinted circuit board material laminated to the channel.

12. The quasi-waveguide of claim 11, wherein the channel is formed in a copper clad core.

13. The quasi-waveguide of claim 11, wherein the channel is formed in a dielectric material.

14. The quasi-waveguide of claim 11, wherein the channel is formed in a multilayer printed circuit board composite.

15. The quasi-waveguide of claim 11, wherein a conductor is laminated over the channel using the thermoset adhesive.

16. The quasi-waveguide of claim 11, wherein the thermoset adhesive is removed in an area of the channel.

17. The quasi-waveguide of claim 11, wherein the quasi-waveguide is an air filled quasi-waveguide.

18. The quasi-waveguide of claim 11, wherein the quasi-waveguide is a high speed interconnect.

19. The quasi-waveguide of claim 11, wherein the printed circuit board material includes low cost FR4 material.

20. The quasi-waveguide of claim 11, wherein the printed circuit board material includes thermoset FR4 material.