the electrical connections between the circuit boards being made during lamination

Industry

CPC
H05K3/4614

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/4614the electrical connections between the circuit boards being made during lamination

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Methods of manufacturing circuit board and circuit board assembly
- Patent number 12,063,752
- Issue date Aug 13, 2024
- Avary Holding (Shenzhen) Co., Limited.
- Wen-Zhu Wei
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board having laminated build-up layers
- Patent number 12,057,381
- Issue date Aug 6, 2024
- Unimicron Technology Corp.
- Chih-Chiang Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer resin substrate and method of manufacturing multilayer r...
- Patent number 11,856,713
- Issue date Dec 26, 2023
- Murata Manufacturing Co., Ltd.
- Masanori Okamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and manufacturing method thereof
- Patent number 11,665,833
- Issue date May 30, 2023
- QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
- Ming-Jaan Ho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for making a three-dimensional liquid crystal polymer multil...
- Patent number 11,657,989
- Issue date May 23, 2023
- Harris Corporation
- Louis Joseph Rendek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a glass substrate with a plurality of vias
- Patent number 11,646,246
- Issue date May 9, 2023
- Samtec, Inc.
- Tim Mobley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board and method for manufacturing the same
- Patent number 11,382,218
- Issue date Jul 5, 2022
- TDK Corporation
- Takaaki Morita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board with an embedded an electronic component and method f...
- Patent number 11,363,726
- Issue date Jun 14, 2022
- QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
- Lin-Jie Gao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Board-to-board connecting structure and method for manufacturing th...
- Patent number 11,310,922
- Issue date Apr 19, 2022
- Avary Holding (Shenzhen) Co., Limited.
- Rui-Wu Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Buried via in a circuit board
- Patent number 11,310,921
- Issue date Apr 19, 2022
- International Business Machines Corporation
- Kyle Indukummar Giesen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing multilayer wiring board
- Patent number 11,291,124
- Issue date Mar 29, 2022
- Lincstech Co., Ltd.
- Yuto Tanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Filling materials and methods of filling through holes of a substrate
- Patent number 11,251,109
- Issue date Feb 15, 2022
- Samtec, Inc.
- Tim Mobley
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Circuit board and manufacturing method thereof
- Patent number 11,212,922
- Issue date Dec 28, 2021
- QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
- Ming-Jaan Ho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for providing hermetic electrical feedthrough
- Patent number 10,952,332
- Issue date Mar 16, 2021
- Second Sight Medical Products, Inc.
- Jerry Ok
- B32 - LAYERED PRODUCTS
Information Patent Grant
Plating methods for modular and/or ganged waveguides for automatic...
- Patent number 10,944,148
- Issue date Mar 9, 2021
- Advantest Corporation
- Don Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Using a partially uncured component carrier body for manufacturing...
- Patent number 10,905,016
- Issue date Jan 26, 2021
- AT & Austria Technologie & Systemtechnik Aktiengesellschaft
- Gernot Grober
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing multilayer substrate
- Patent number 10,893,618
- Issue date Jan 12, 2021
- Murata Manufacturing Co., Ltd.
- Kuniaki Yosui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid component carrier and method for manufacturing the same
- Patent number 10,887,977
- Issue date Jan 5, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Markus Leitgeb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making a three-dimensional liquid crystal polymer multil...
- Patent number 10,818,448
- Issue date Oct 27, 2020
- Harris Corporation
- Louis Joseph Rendek
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrode connecting method
- Patent number 10,785,880
- Issue date Sep 22, 2020
- Brother Kogyo Kabushiki Kaisha
- Toru Kakiuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and method for manufacturing the same
- Patent number 10,772,217
- Issue date Sep 8, 2020
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Lin-Jie Gao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optical waveguide having aluminum nitride thin film
- Patent number 10,667,388
- Issue date May 26, 2020
- II-VI Delaware Inc.
- Henry Meyer Daghighian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of a multi-layer circuit board
- Patent number 10,609,824
- Issue date Mar 31, 2020
- Winbond Electronics Corp.
- Yu-Ming Chen
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Grant
Circuit carrier structure, manufacturing method thereof and chip pa...
- Patent number 10,575,397
- Issue date Feb 25, 2020
- Unimicron Technology Corp.
- Chien-Chen Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductor-structure element having an internal layer substrate lami...
- Patent number 10,555,419
- Issue date Feb 4, 2020
- Schweizer Electronic AG
- Thomas Gottwald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer circuit board and manufacturing method thereof
- Patent number 10,499,512
- Issue date Dec 3, 2019
- Winbond Electronics Corp.
- Yu-Ming Chen
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Grant
Multilayer board and electronic device
- Patent number 10,477,704
- Issue date Nov 12, 2019
- Murata Manufacturing Co., Ltd.
- Kuniaki Yosui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Aluminum nitride substrate with graphite foil
- Patent number 10,470,302
- Issue date Nov 5, 2019
- Finisar Corporation
- Henry Meyer Daghighian
- G02 - OPTICS
Information Patent Grant
Multi-layer circuit board
- Patent number 10,405,423
- Issue date Sep 3, 2019
- Kinsus Interconnect Technology Corp.
- Ting-Hao Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laminated substrate and method of manufacturing laminated substrate
- Patent number 10,398,026
- Issue date Aug 27, 2019
- Toyota Jidosha Kabushiki Kaisha
- Akihito Goto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Circuit board
- Publication number 20240422920
- Publication date Dec 19, 2024
- Avary Holding (Shenzhen) Co., Limited.
- WEN-ZHU WEI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF CIRCUIT BOARD
- Publication number 20240282687
- Publication date Aug 22, 2024
- Unimicron Technology Corp.
- Chih-Chiang Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAMINATED ASSEMBLY COMPRISING RADIO-FREQUENCY INTERFACE BOARD
- Publication number 20230413420
- Publication date Dec 21, 2023
- AGC Glass Europe
- Mohsen YOUSEFBEIKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MAKING A THREE-DIMENSIONAL LIQUID CRYSTAL POLYMER MULTIL...
- Publication number 20230238197
- Publication date Jul 27, 2023
- Harris Corporation
- LOUIS JOSEPH RENDEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD HAVING A DIFFERENTIAL PAIR ROUTING TOPOLOGY W...
- Publication number 20230209726
- Publication date Jun 29, 2023
- Infinera Corporation
- Aneesh Kachroo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TOLERANCE COMPENSATION ELEMENT FOR CIRCUIT CONFIGURATIONS
- Publication number 20230189450
- Publication date Jun 15, 2023
- Siemens Aktiengesellschaft
- Rene BLANK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD, METHOD FOR MANUFACTURING CIRCUIT BOARD, AND ELECTRON...
- Publication number 20230180398
- Publication date Jun 8, 2023
- FICT LIMITED
- Kenji Iida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARDS WITH EMBOSSED METALIZED CIRCUIT TRACES
- Publication number 20230047568
- Publication date Feb 16, 2023
- Imagine TF, LLC
- Brian Edward Richardson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of Manufacturing Component Carrier and Component Carrier Int...
- Publication number 20220377911
- Publication date Nov 24, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Marco Gavagnin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF AND ELECTRONIC DEVICE
- Publication number 20220230949
- Publication date Jul 21, 2022
- Unimicron Technology Corp.
- Chih-Chiang Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RIGID-FLEXIBLE CIRCUIT BOARD WITH EASY AND SIMPLE MANUFACTURE AND M...
- Publication number 20220225511
- Publication date Jul 14, 2022
- QING DING PRECISION ELECTRONICS (HUAIAN) CO.,LTD
- WEI-XIANG LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER SUBSTRATE AND METHOD OF MANUFACTURING MULTILAYER SUBSTRATE
- Publication number 20220141965
- Publication date May 5, 2022
- Murata Manufacturing Co., Ltd.
- Yusuke KAMITSUBO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20220078922
- Publication date Mar 10, 2022
- QING DING PRECISION ELECTRONICS (HUAIAN) CO.,LTD
- MING-JAAN HO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BOARD-TO-BOARD CONNECTING STRUCTURE AND METHOD FOR MANUFACTURING TH...
- Publication number 20220061167
- Publication date Feb 24, 2022
- Avary Holding (Shenzhen) Co., Limited.
- RUI-WU LIU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FILLING MATERIALS AND METHODS OF FILLING THROUGH HOLES OF A SUBSTRATE
- Publication number 20220059436
- Publication date Feb 24, 2022
- SAMTEC, INC.
- Tim Mobley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD WITH AN EMBEDDED AN ELECTRONIC COMPONENT AND METHOD F...
- Publication number 20220039266
- Publication date Feb 3, 2022
- QING DING PRECISION ELECTRONICS (HUAIAN) CO.,LTD
- LIN-JIE GAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND METHOD OF MANUFACTURING CIRCUIT BOARD, AND METHOD...
- Publication number 20210410295
- Publication date Dec 30, 2021
- Avary Holding (Shenzhen) Co., Limited.
- WEN-ZHU WEI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER RESIN SUBSTRATE AND METHOD OF MANUFACTURING MULTILAYER R...
- Publication number 20210410296
- Publication date Dec 30, 2021
- Murata Manufacturing Co., Ltd.
- Masanori OKAMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20210235590
- Publication date Jul 29, 2021
- QING DING PRECISION ELECTRONICS (HUAIAN) CO.,LTD
- MING-JAAN HO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BURIED VIA IN A CIRCUIT BOARD
- Publication number 20210127502
- Publication date Apr 29, 2021
- International Business Machines Corporation
- Kyle Indukummar Giesen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MAKING A THREE-DIMENSIONAL LIQUID CRYSTAL POLYMER MULTIL...
- Publication number 20210005405
- Publication date Jan 7, 2021
- Harris Corporation
- LOUIS JOSEPH RENDEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TOLERANCE COMPENSATION ELEMENT FOR CIRCUIT CONFIGURATIONS
- Publication number 20200122450
- Publication date Apr 23, 2020
- Siemens Aktiengesellschaft
- Rene BLANK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF A MULTI-LAYER CIRCUIT BOARD
- Publication number 20200053884
- Publication date Feb 13, 2020
- WINBOND ELECTRONICS CORP.
- Yu-Ming Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20190373742
- Publication date Dec 5, 2019
- TDK Corporation
- Takaaki MORITA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING MULTILAYER WIRING BOARD
- Publication number 20190313536
- Publication date Oct 10, 2019
- HITACHI CHEMICAL COMPANY, LTD.
- Yuto TANABE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Providing Hermetic Electrical Feedthrough
- Publication number 20190313537
- Publication date Oct 10, 2019
- Second Sight Medical Products, Inc.
- Jerry Ok
- B32 - LAYERED PRODUCTS
Information Patent Application
Hybrid Component Carrier and Method for Manufacturing the Same
- Publication number 20190297719
- Publication date Sep 26, 2019
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Markus Leitgeb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE ELECTRODE LAMINATE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20190116658
- Publication date Apr 18, 2019
- POSTECH ACADEMY-INDUSTRY FOUNDATION
- Unyong JEONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LAMINATED SUBSTRATE AND METHOD OF MANUFACTURING LAMINATED SUBSTRATE
- Publication number 20190104611
- Publication date Apr 4, 2019
- Toyota Jidosha Kabushiki Kaisha
- Akihito GOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electrode Connecting Method
- Publication number 20190098768
- Publication date Mar 28, 2019
- BROTHER KOGYO KABUSHIKI KAISHA
- Toru Kakiuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

the electrical connections between the circuit boards being made during lamination

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Methods of manufacturing circuit board and circuit board assembly

Circuit board having laminated build-up layers

Multilayer resin substrate and method of manufacturing multilayer r...

Circuit board and manufacturing method thereof

Method for making a three-dimensional liquid crystal polymer multil...

Method of fabricating a glass substrate with a plurality of vias

Printed wiring board and method for manufacturing the same

Circuit board with an embedded an electronic component and method f...

Board-to-board connecting structure and method for manufacturing th...

Buried via in a circuit board

Method for manufacturing multilayer wiring board

Filling materials and methods of filling through holes of a substrate

Circuit board and manufacturing method thereof

Method for providing hermetic electrical feedthrough

Plating methods for modular and/or ganged waveguides for automatic...

Using a partially uncured component carrier body for manufacturing...

Method for manufacturing multilayer substrate

Hybrid component carrier and method for manufacturing the same

Method for making a three-dimensional liquid crystal polymer multil...

Electrode connecting method

Circuit board and method for manufacturing the same

Optical waveguide having aluminum nitride thin film

Manufacturing method of a multi-layer circuit board

Circuit carrier structure, manufacturing method thereof and chip pa...

Conductor-structure element having an internal layer substrate lami...

Multi-layer circuit board and manufacturing method thereof

Multilayer board and electronic device

Aluminum nitride substrate with graphite foil

Multi-layer circuit board

Laminated substrate and method of manufacturing laminated substrate

Patents Applicationslast 30 patents

Circuit board

MANUFACTURING METHOD OF CIRCUIT BOARD

LAMINATED ASSEMBLY COMPRISING RADIO-FREQUENCY INTERFACE BOARD

METHOD FOR MAKING A THREE-DIMENSIONAL LIQUID CRYSTAL POLYMER MULTIL...

PRINTED CIRCUIT BOARD HAVING A DIFFERENTIAL PAIR ROUTING TOPOLOGY W...

TOLERANCE COMPENSATION ELEMENT FOR CIRCUIT CONFIGURATIONS

CIRCUIT BOARD, METHOD FOR MANUFACTURING CIRCUIT BOARD, AND ELECTRON...

PRINTED CIRCUIT BOARDS WITH EMBOSSED METALIZED CIRCUIT TRACES

Method of Manufacturing Component Carrier and Component Carrier Int...

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF AND ELECTRONIC DEVICE

RIGID-FLEXIBLE CIRCUIT BOARD WITH EASY AND SIMPLE MANUFACTURE AND M...

MULTILAYER SUBSTRATE AND METHOD OF MANUFACTURING MULTILAYER SUBSTRATE

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

BOARD-TO-BOARD CONNECTING STRUCTURE AND METHOD FOR MANUFACTURING TH...

FILLING MATERIALS AND METHODS OF FILLING THROUGH HOLES OF A SUBSTRATE

CIRCUIT BOARD WITH AN EMBEDDED AN ELECTRONIC COMPONENT AND METHOD F...

CIRCUIT BOARD AND METHOD OF MANUFACTURING CIRCUIT BOARD, AND METHOD...

MULTILAYER RESIN SUBSTRATE AND METHOD OF MANUFACTURING MULTILAYER R...

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

BURIED VIA IN A CIRCUIT BOARD

METHOD FOR MAKING A THREE-DIMENSIONAL LIQUID CRYSTAL POLYMER MULTIL...

TOLERANCE COMPENSATION ELEMENT FOR CIRCUIT CONFIGURATIONS

MANUFACTURING METHOD OF A MULTI-LAYER CIRCUIT BOARD

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

METHOD FOR MANUFACTURING MULTILAYER WIRING BOARD

Method for Providing Hermetic Electrical Feedthrough

Hybrid Component Carrier and Method for Manufacturing the Same

FLEXIBLE ELECTRODE LAMINATE AND METHOD FOR MANUFACTURING THE SAME

LAMINATED SUBSTRATE AND METHOD OF MANUFACTURING LAMINATED SUBSTRATE

Electrode Connecting Method