Claims
- 1. A radiant ray-detector comprising a plurality of photo-multiplier tubes joined to a hexahedron scintillator bundle consisting of a number of hexahedron scintillator chips, the number of such chips being greater than that of the tubes, the chips having a plurality of faces, more than one of said faces being mirror finished and the remainder of the faces being roughened by treatment with abrasive grains, said bundle being formed by joining the roughened faces, the roughness of the faces being controlled by controlling the size of the abrasive grains used for the treatment and the roughness varying so that the transmittance of the bundle increases from the center of the bundle to the periphery thereof.
- 2. The radiant ray-detector of claim 1 wherein the scintillator chips are a Bi.sub.4 Ge.sub.3 O.sub.12 crystal.
- 3. A method for producing a radiant ray-detector comprising providing a plurality of photo-multiplier tubes having entrance windows for receiving light, preparing a plurality of scintillator chips in the form of a hexahedron having a plurality of faces, mirror finishing more than one face and roughening the remaining faces by treatment with abrasive grains and joining the roughened faces of the chips together, joining the entrance windows of the tubes with the mirror finished faces of the joined chips, the number of the chips being greater than the number of tubes, such that the overall area of the joined chips is about the same as the area of the entrance windows of the tubes, and varying the transmittance of the joined chips so as to increase from the center to the periphery thereof by controlling the roughening of the chip surface by controlling the size of the grains used to roughen the chip faces.
- 4. The method of claim 3 wherein the scintillator chips are arranged in order that the transmittance of the joined roughened faces of the scintillator chips are increased as the distance between the chip and the center of the joined chips increases.
- 5. The method of claim 3 wherein the scintillator chip is a Bi.sub.4 Ge.sub.3 O.sub.12 crystal.
- 6. The method of claim 3 wherein the transmittances of the roughed faces of each scintillator chip joined to those of other scintillator chips are controlled by properly selecting the particle size of abrasive grains for roughening the faces and then the transmittance thereof is further controlled through at least one treatment selected from the group consisting of a heat-treatment, an etching treatment with a strong acid and a resin-coating treatment.
Priority Claims (1)
Number |
Date |
Country |
Kind |
5-078241 |
Apr 1993 |
JPX |
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Parent Case Info
This is a continuation of application Ser. No. 08/218,657, filed Mar. 25, 1994, now abandoned.
US Referenced Citations (2)
Number |
Name |
Date |
Kind |
5091650 |
Uchida et al. |
Feb 1992 |
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5227634 |
Ryuo |
Jul 1993 |
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Foreign Referenced Citations (2)
Number |
Date |
Country |
2-252698 |
Oct 1990 |
JPX |
4-290984 |
Oct 1992 |
JPX |
Continuations (1)
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Number |
Date |
Country |
Parent |
218657 |
Mar 1994 |
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