Radio communication device

Abstract

A digital signal processor for handling, as a digital signal, data to be transmitted or received and a analog signal processor for handling the data as an analog signal are so arranged as to be spatially separate from each other, and a converter circuit which performs signal format conversion between the digital signal and the analog signal is provided on the analog signal processor side between the digital signal processor and the analog signal processor.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is schematic block diagram of a radio communication device according to the present invention;

FIG. 2 is an internal block diagram of a high frequency circuit of FIG. 1;

FIG. 3 shows configuration of the radio communication device of FIG. 1;

FIG. 4 is a schematic sectional diagram of a board on which circuits forming the radio communication device of FIG. 1 are mounted;

FIG. 5 is a diagram for explaining the circuit arrangement on the component mounting surface of the board of FIG. 4;

FIG. 6 is a schematic block diagram of a conventional radio communication device; and

FIG. 7 is a plane view of a board on which the radio communication device of FIG. 6 is mounted.

Claims

1. A radio communication device comprising: a digital signal processor which for handling, as a digital signal, data to be transmitted or received and a analog signal processor for handling the data as an analog signal, which are so arranged as to be spatially separate from each other; and a converter circuit which is provided on the analog signal processor side between the digital signal processor and the analog signal processor and which performs signal format conversion between the digital signal and the analog signal.

2. The radio communication device according to claim 1, comprising a board for mounting the digital signal processor, the analog signal processor, and the converter circuit thereon.

3. The radio communication device according to claim 2, wherein the analog signal processor and the converter circuit are arranged on a first surface side of the board, and the digital signal processor is arranged on a second surface side of the board which is different from the first surface side.

4. The radio communication device according to claim 3, wherein the board is multilayer wiring board having a plurality of wiring layers,wherein a digital ground part is provided in a wiring layer inside the board, and an analog ground part is provided in a wiring layer on the first surface side of the digital ground part, and a wiring layer on the first surface side of the analog ground part is assigned as an analog wiring layer.

5. The radio communication device according to claim 4, wherein digital signal transfer is performed between a conductor on the first surface and a conductor on a wiring layer on the second surface side of the digital ground part via a through-hole which links the conductors together and which is provided in the board.

6. The radio communication device according to claim 2, wherein the analog signal processor comprises a high frequency circuit for transmitting or receiving an analog signal of a high frequency which permits radio transmission, andwherein part or all of the high frequency circuit is arranged near a first side of the board, and the converter circuit is arranged near a second side located opposite to the first side.

7. The radio communication device according to claim 6, wherein the high frequency circuit comprises a receiving circuit for wirelessly receiving a signal and a transmitting circuit for wirelessly transmitting a signal, andwherein the receiving circuit is arranged near the first side, and the transmitting circuit is arranged near a third side located between the first and second sides.

8. A radio communication device comprising: a digital signal processor for handling, as a digital signal, data to be transmitted or received;an analog signal processor for handling the data as an analog signal;a converter circuit which is provided between the digital signal processor and the analog signal processor and which performs signal format conversion between the digital signal and the analog signal; anda board for mounting the digital signal processor, the analog signal processor, and the converter circuit thereon,wherein the analog signal processor has a high frequency circuit for transmitting or receiving an analog signal of a high frequency which permits radio transmission, and an RF circuit, for performing frequency conversion of an analog signal, interposed between the high frequency circuit and the converter circuit, andwherein part or all of the high frequency circuit is arranged in a first region near a first side of the board, the digital signal processor and the converter circuit are arranged in a second region near a second side located opposite to the first side, and the RF circuit is arranged in a region between the first and second regions.

9. The radio communication device according to claim 8, wherein the high frequency circuit comprises a receiving circuit for wirelessly receiving a signal and a transmitting circuit for wirelessly transmitting a signal, andwherein the receiving circuit is arranged near the first side and the transmitting circuit is arranged near a third side located between the first and second sides.

10. A radio communication device comprising: a digital signal processor for handling, as digital signal, data to be transmitted or received;an analog signal processor for handling the data as an analog signal;a converter circuit which is provided between the digital signal processor and the analog signal processor and which performs signal format conversion between the digital signal and the analog signal; anda board for mounting the digital signal processor, the analog signal processor, and the converter circuit thereon,wherein the analog signal processor is arranged on a first surface side of the board, the digital signal processor and the converter circuit are arranged on a second surface side of the board which is different from the first surface side,wherein the board is a multilayer wiring board having a plurality of wiring layers, andwherein a digital ground part is provided in a wiring layer inside the board, an analog ground part is provided in a wiring layer on the first surface side of the digital ground part, and a wiring layer on the first surface side of the analog ground part is assigned as an analog wiring layer.