Patent Application
20230280107
The present disclosure relates to a heat dissipation device, particularly to a rapid heat dissipation device.
A related-art heat dissipation device is to utilize a heat conducting plate thermally attached to a heat source, and a plurality of fins are disposed on the heat conducting plate to form a heat radiator. Heat is transferred to the fins or the heat radiator through the heat conducting plate to provide a heat dissipating function to the heat source.
With the requirement of heat dissipating performance being higher, an additional device or method, for example disposing a fan or water cooling to provide an external heat-dissipating force, is used for providing an assisting heat dissipating capability under the structure of the related-art heat dissipation device. A heat pipe or a vapor chamber having a coolant or a working fluid being provided therein are also used for increasing the effects of heat dissipating or cooling.
However, the above-mentioned structure has disadvantages as follows. Situations of heat being gathered in the heat source or collected at a portion of the heat dissipation device during the heat transferring process may happen, thus the heat dissipation device may not fully perform the effects of heat dissipating or cooling when the heat dissipating device is not uniformly heated and unable to uniformly dissipate heat.
Accordingly, the applicant of the present disclosure has devoted himself for improving the mentioned disadvantages.
The present disclosure is to provide a rapid heat dissipation device, in which heating flowing field of a siphon heat-dissipating device overlaps up and down with that of a heat pipe in the same direction, the rapid heat dissipation device has advantages of uniformly dissipating heat and cooling.
Accordingly, the present disclosure provides a rapid heat dissipation device, provided to use for a heat source, and includes: a heat conducting plate, thermally attached to the heat source; a heat dissipating fin group, arranged on one side of the heat conducting plate; at least one heat pipe, one end thereof fixed to the heat conducting plate and another end thereof fixed to the heat dissipating fin group; and a siphon heat-dissipating device, stacked above the at least one heat pipe and one end thereof fixed to the heat conducting plate and another end thereof fixed to the heat dissipation fin group.
Based on what has been disclosed above, the siphon heat-dissipating device is stacked above the heat pipe, one end of the heat pipe and one end of the siphon heat-dissipating device are fixed to the heat conducting plate and another end of the heat pipe and another end of the siphon heat-dissipating device are fixed to the heat dissipating fin group. As such, through heating flowing field of the siphon heat-dissipating device overlapping up and down with that of the heat pipe in the same direction, situations of heat being gathered in the heat source or collected at a portion of the heat dissipation device during the heat transferring process may be avoided, thus the rapid heat dissipation device has advantages of uniformly dissipating heat and cooling.
The features of the disclosure believed to be novel are set forth with particularity in the appended claims. The disclosure itself, however, may be best understood by reference to the following detailed description of the disclosure, which describes a number of exemplary embodiments of the disclosure, taken in conjunction with the accompanying drawings, in which:
The technical contents of this disclosure will become apparent with the detailed description of embodiments accompanied with the illustration of related drawings as follows.
It is intended that the embodiments and drawings disclosed herein are to be considered illustrative rather than restrictive.
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In some embodiments, the heat conducting plate 1 is thermally attached above the heat source 100. The I-shaped mounting slot 11 is formed at a bottom end of the heat conducting plate 1, but here is not intended to be limiting. The heat source 100 may be disposed in the heat conducting plate 1, and the I-shaped mounting slot 11 may be formed at a top end of the heat conducting plate 1 or penetrate the heat conducting plate 1.
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The substrate 21 has a top surface 211 and a bottom surface 212. In some embodiments, the top surface 211 of the substrate 21 has a plurality of L-shaped mounting slots 213 extended from the center toward two sides. The plurality of first fins 22 are connected to the bottom surface 212 of the substrate 21, but here is not intended to be limiting.
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Details are provided as follows. The siphon heat-dissipating device 4 has an evaporator 41, a condenser 42, a convey pipe 43 and a working fluid. The evaporator 41 is stacked above and fixed to the heat conducting plate 1. The condenser 42 is stacked above and fixed to the heat dissipating fin group 2. The convey pipe 43 is stacked above the heat pipe 3 and two ends thereof communicate with the evaporator 41 and the condenser 42.
In some embodiments, the evaporator 41 is a hollow case body made of a heat conducting material. The convey pipe 43 is a hollow pipe member made of a heat conducting material. The working fluid is filled in the evaporator 41, the condenser 42 and the convey pipe 43. The evaporator 41 is fixed above the heat conducting plate 1 with a locking or welding manner.
The condenser 42 has an extending pipe 421 extended from one end of the convey pipe 43 away from the evaporator 41, a heat dissipating plate 422 fixed above the extending pipe 421 and a plurality of second fins 423 connected to the heat dissipating plate 422. The plurality of second fins 423 are disposed between the heat dissipating plate 422 and the heat dissipating fin group 2 and arranged on two sides of the extending pipe 421. A distance s is formed between the convey pipe 43 and the heat pipe 3.
In some embodiments, the plurality of second fins 423 are connected to the heat dissipating plate 422 with a squeezing, milling, or welding manner, and disposed between the heat dissipating plate 422 and the top surface 211 of the substrate 21. The extending pipe 421 and the heat dissipating plate 422 are combined with a welding manner, but here is not intended to be limiting.
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In some embodiments, a plurality of corners 6 are respectively formed on the substrate 21 and the heat dissipating plate 422, and a plurality of recessed slots 61 are concavely formed on the plurality of corners 6. Two ends of each of the C-shaped clips 5 clip the two recessed slots 61 correspondingly arranged up and down, thus the substrate 21 and the heat dissipating plate 422 are stably stacked up and down.
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Moreover, the plurality of C-shaped clips 5 are disposed to clip the outer sides of the substrate 21 and the heat dissipating plate 422, thus the heat dissipating fin group 2 and the condenser 42 are stably stacked up and down to increase the structural strength of the rapid heat dissipation device 10.
While this disclosure has been described by means of specific embodiments, numerous modifications and variations could be made thereto by those skilled in the art without departing from the scope and spirit of this disclosure set forth in the claims.
