Read-only MOS memory

Abstract

A read-only memory formed of cells, each of which includes, between a selection line and a bit line, the series connection of a memory element and of a selection MOS transistor with a gate connected to a read control line. The memory elements of blank cells are P-channel MOS transistors and the memory elements of programmed cells are uniformly N-type doped semiconductor regions.

Description

BACKGROUND OF THE INVENTION

[0001] 1. Field of the Invention

[0002] The present invention relates to the forming in integrated form of memories. More specifically, the present invention relates to the integration of read-only memories (ROMs).

[0003] 2. Description of the Related Art

[0004] Such memories are intended for the storing of data or functions intended to be always available and not reprogrammable.

[0005] Upon design of an integrated circuit including such a ROM, at least one prototype memory circuit, especially intended to test whether the data provided to be stored in the memory enable fulfilling desired functions, is formed.

[0006] To reduce the number of formed prototypes, it has been provided to form the prototype memory in the form of a programmable array. It is thus possible to modify the number and the arrangement of programmed or unprogrammed cells of the memory array in successive checking operations.

[0007] To form the programmable prototype memory, electrically-programmable cells erasable by being exposed to ultraviolet rays may be used.

[0008] FIG. 1A illustrates the equivalent electric diagram of an embodiment of such a cell 1. Cell 1 includes, between a selection line SL and a bit line BL, the series connection of a memory element and of a selection element. The memory element is a P-channel MOS transistor 2, gate 3 of which is unconnected. The selection element is a MOS transistor 4. As a non-limiting example, it will be considered in the following description that selection transistor 4 is an N-channel transistor. However, it could also be a P-channel transistor. Gate 5 of transistor 4 is connected to a read line RL.

[0009] FIG. 1B illustrates an embodiment in integrated form of the cell of FIG. 1A.

[0010] Memory transistor 2 is formed in a first active area 6 of a silicon substrate. A channel area of transistor 2, defined by unconnected isolated gate 3, separates, in active area 6, source 7 and drain 8 of transistor 2. Selection line SL is in contact with source 7. Drain 8 is integral with one end of a conductive connection 9. The other end of conductive connection 9 is in contact with source 10 of selection transistor 4. Selection transistor 4 is formed in a second active area 11 of the same substrate as first active area 6. Source 10 of transistor 4 is separated from drain 12 by a channel area defined by isolated gate 5, formed on area 11. Drain 12 of selection transistor 4 is in contact with bit line BL.

[0011] In the forming of a complete array, selection and read lines SL and RL are common to the cells of a same row, while bit line BL is common to the cells of a same column.

[0012] The operation of a programmable array formed of cells identical to cell 1 of FIG. 1 is the following. When a datum is desired to be programmed in a cell, this cell is selected via appropriate signals on read line RL to turn selection transistor 4 on. In the considered case of an N-channel selection transistor 4, read line RL, that is, gate 5 of transistor 4, is brought to a high biasing level VDD. Line BL is grounded. Selection line SL (source 7 of transistor 2) is brought to a programming level VPP raised with respect to high level VDD. The insulator of gate 3 of memory transistor 2 is chosen to enable in these conditions the passing of electrons on gate 3 (programming by hot electrons).

[0013] The reading of a datum stored in a programmable cell 1 is performed as follows. Selection line SL is brought to high level VDD. Gate 5 of transistor 1 is biased to level VDD to turn on selection transistor 4. Then, if memory transistor 2 has been previously programmed, it is at least partially conductive due to the charges accumulated on its unconnected gate 3. The voltage level copied by selection transistor 4 on bit line BL then is relatively close to high level VDD. However, if memory transistor 2 has undergone no programming, it is totally non-conductive (off) and line BL is brought to a relatively low level with respect to high level VDD.

[0014] To determine the data to be contained in the programmable array, the following step succession is repeated:

[0015] programming such a memory array;

[0016] testing the circuit operation; and

[0017] erasing with ultraviolet rays the array data.

[0018] These steps are repeated until the functional test is satisfactory. Once the number of programmed and unprogrammed (blank) cells and their configuration specific to the desired operation have been determined, a definitive integrated circuit including a read-only memory is manufactured.

[0019] Thus, the conventional industrial process of manufacturing of an integrated circuit containing immovably stored data includes the steps of manufacturing a prototype circuit containing a programmable memory, then a definitive circuit containing a definitive ROM, the definitive ROM containing for example a simple transistor at the level of each memory point and being clearly distinct from the programmable memory. This requires, for each circuit, manufacturing two sets of masks very different from each other.

BRIEF SUMMARY OF THE INVENTION

[0020] An embodiment of the present invention provides for a method and device for simplifying this manufacturing process.

[0021] The applicant has noticed that the general manufacturing cost of prior art designs (prototype memory plus definitive memory) may be higher than the gain resulting from the inserting of an optimized ROM in the definitive circuit.

[0022] Thus, an embodiment of the present invention provides a read-only memory which is slightly different from a programmable memory.

[0023] Another embodiment of the present invention provides a ROM which can be easily formed in a memory array also including a programmable sector.

[0024] Another embodiment of the present invention provides a method for converting a programmable memory into a ROM which is compatible with the above embodiments.

[0025] An embodiment of the present invention provides a read-only memory formed of cells, each of which includes, between a selection line and a bit line, the series connection of a memory element and of a selection MOS transistor with a gate connected to a read control line. The memory elements of blank cells are P-channel MOS transistors and the memory elements of programmed cells are uniformly N-type doped semiconductor regions.

[0026] According to an embodiment of the present invention, the gates of the memory transistors of the blank cells are unconnected.

[0027] According to an embodiment of the present invention, the selection transistor of at least one blank cell is an N-channel transistor and the gates of the memory and selection transistors of said at least one blank cell are interconnected by a conductive connection.

[0028] According to an embodiment of the present invention, the read-only memory is formed in the same integrated circuit chip as a programmable memory formed of cells including, between a selection line and a bit line, the series connection of a P-channel MOS transistor, the gate of which is unconnected, and of a MOS transistor, the gate of which is connected to a read control line, the lines of selection of the read-only and programmable memories being connectable to a selection power supply and the lines of selection of the sole programmable memory being selectively connectable to a write power supply distinct from said selection power supply.

[0029] An embodiment of the present invention also provides a method for forming, in a single-crystal semiconductor substrate, a read-only memory, including the steps of defining first and second active areas of same dimension; forming isolated lines above the second areas and some of the first areas; implanting the exposed portions of said first and second active areas; depositing an insulator over the entire structure; opening said insulator to partially expose each of the first and second areas, in the vicinity of each of its ends; and forming selection lines in contact with the first active areas, conductive connections to match each first active area with a second active area, and bit lines in contact with said second active areas.

[0030] The foregoing embodiments of the present invention will be discussed in detail in the following non-limiting description of specific embodiments in connection with the accompanying drawings.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWING(S)

[0031] FIG. 1A is an electric diagram of an elementary cell of a conventional programmable array;

[0032] FIG. 1B is a partial simplified top view of an example of implementation in integrated form of the cell of FIG. 1A;

[0033] FIGS. 2A and 2B schematically illustrate a programmed cell of a read-only memory array according to an embodiment of the present invention; and

[0034] FIGS. 3A and 3B schematically illustrate a blank (unprogrammed) cell of a read-only memory array according to an embodiment of the present invention.

[0035] FIG. 4A illustrates a memory array of having read-only logic-one cells, read-only logic-zero cells and programmable cells.

[0036] FIG. 4B is a schematic diagram of the memory array of FIG. 4A.

DETAILED DESCRIPTION OF THE INVENTION

[0037] For clarity, same elements have been designated with the same references in the different drawings. Further, as usual in the representation of integrated circuits, the top views of FIGS. 1B, 2A, and 3A are not shown to scale.

[0038] An embodiment of the present invention uses as elementary cells of a ROM, according to their programmed or unprogrammed (blank) state, cells identical or similar to a programmable cell such as cell 1 of FIG. 1B.

[0039] FIG. 2A schematically illustrates in a partial top view the monolithic forming of a programmed cell 20 according to an embodiment of the present invention. FIG. 2B is an equivalent electric diagram of cell 20 of FIG. 2A.

[0040] A programmed cell 20 includes a selection element identical to that of a previously-described programmable cell (1, FIG. 1). It is, for example, a MOS transistor 4, preferably with an N channel, formed in an active area 11 of a semiconductor substrate. Programmed cell 20 also includes a memory element 22 similar to memory element 2 of programmable cell 1 of FIG. 1B. However, the gate of the transistor forming programmable memory element 2 is suppressed. Thus, memory element 22 is no longer formed of a MOS transistor, but of a uniformly-doped active area 26, which behaves as a resistor.

[0041] As illustrated in FIG. 2B, programmed cell 20 includes, between selection line SL and bit line BL, the series connection of the resistor formed by memory area 26 and of selection transistor 4.

[0042] In a read operation, selection line SL is biased to a high level VDD. Gate 5 of selection transistor 4 is biased by read line RL to a read level turning on selection transistor 4. In the case of an N-channel selection transistor 4, the read level is equal to high level VDD. Then, memory area 26 behaves as a resistor. Selection transistor 4 thus copies on bit line BL a level close to high voltage level VDD of selection line SL.

[0043] According to an embodiment of the present invention, a blank (unprogrammed) cell of a ROM is identical to a programmable cell 1 of FIG. 1B in which no data have been memorized. Memory transistor 2 still is non-conductive. In a read access, selection transistor 4 thus copies on bit line BL a relatively low level with respect to high level VDD.

[0044] The use according to the present invention of a read-only memory having programmed and blank cells such as previously described is particularly advantageous. In particular, its obtaining based on the prototype programmable array is easy. Indeed, it is sufficient to modify the sole mask of definition of the transistor gates to suppress those of the memory elements of programmed cells. In many cases, the manufacturing cost reduction resulting from the use of a set of masks similar to that used to form the programmable prototype compensates for the increase in integration surface area with respect to an optimized ROM.

[0045] FIG. 3A illustrates, in a simplified partial top view, another embodiment of a blank cell 30 according to the present invention. FIG. 3B illustrates the equivalent electric diagram of cell 30 of FIG. 3A.

[0046] The selection element is an N-channel MOS transistor 4 (it can no longer be a P-channel MOS transistor). Gate 3 of memory transistor 2 is connected, by a conductive connection 31, to gate 5 of selection transistor 4.

[0047] The presence of connection 31 advantageously enables avoiding self-programming of memory transistor 2. Indeed, if in a read access, electrons pass over gate 3, due to high level VDD of selection line SL, they are derived by read line RL which, to turn on complementary selection transistor 4, also is at high level VDD. Memory transistor 2 then always remains off (non-conductive).

[0048] As indicated previously, the programmed (20, FIG. 2) and blank cells of a read-only memory according to the present invention are formed by a method similar to the forming of a programmable array:

[0049] active 6, 11, 26 areas are defined in a silicon substrate;

[0050] isolated gates 3, 5 are formed above all active areas except for those (26) intended to form the memory elements of programmed cells 20;

[0051] appropriate dopants are implanted in each of the active areas; and

[0052] contacts between the appropriate semiconductor regions and connections or conductive lines 9, SL, RL, and BL are formed.

[0053] In the case of blank read-only cells of the type of cell 30 of FIG. 3, connections 31 of interconnection of gates 3 and 5 of memory and selection transistors 2 and 4 are formed, preferably, at the same time as gates 3 and 5. Thus, again, only the gate definition mask is modified with respect to the set of masks used to manufacture the programmable prototype array.

[0054] A read-only memory according to the present invention can thus be simply formed, simultaneously to a programmable memory such as described in relation with FIG. 1.

[0055] Shown in FIGS. 4A and 4B is a general memory array 100 that includes a first ROM Sector 104 of programmed and blank memory cells, a second ROM Sector 106 of programmed and blank memory cells, and a programmable memory Sector 108 of 100 programmable memory cells. Each sector 104 & 108 may contain multiple rows of memory cells. Preferably, the sectors 2-4-108 of the general memory array of FIGS. 4A and 4B will share the same bit lines. However, the selection lines are assigned by sector according to the programmable or read-only nature of the considered sector. Thus, in the ROM sectors 104, 106 as shown in FIG. 4B, the selection lines are adapted to being biased at most to high level VDD. However, in the programmable memory sector 108 of FIG. 4B, the selection lines are adapted to being biased either to a level VDD, or to a programming level VPP raised with respect to high level VDD.

[0056] The advantages of the forming of a memory array including programmable sectors and read-only sectors are many.

[0057] Thus, in the previously-described design steps, it is possible to store in the read-only sector information, for example, concerning the designer, the circuit fmality, or an access code for the array, to forbid, if necessary, its access to an unauthorized user.

[0058] It is also possible, in the test steps, to have a read-only sector memorizing the data or the functions to be processed and a programmable sector in which the function to be implemented is carried out. In the successive test and modification steps, only the programmable sector is erasable and accessible to the designer. This reduces the circuit testing time by the time conventionally necessary to reprogram the certain data or functions now contained in the read-only memory.

[0059] The conversion of a programmable sector into a read-only sector is relatively simple and can be performed between two prototypes. Thus, based on a programmable array, a first test series can show a correct operation of one portion of the array. Then, this portion is turned into a read-only portion, to which access is forbidden to the tester, on the one hand, by making impossible the biasing of its selection lines to a programming level VPP and, on the other hand, by reducing a UV lighting window provided to face the sole programmable portion.

[0060] A single read circuit common to the programmable array and to the read-only array may be provided, which substantially divides by two the surface area occupied by the read circuit with respect to the case where the programmable and read-only arrays are memory blocks of distinct natures.

[0061] Finally, maintaining a programmable array enables a possible user to input new data or modify a function.

[0062] The present invention is likely to have various alterations, modifications, and improvements which will readily occur to those skilled in the art. In particular, the present invention has been previously described as a non-limiting example in relation with FIGS. 2 and 3 in the case of the association of a memory element and of an N-channel type selection transistor. However, the present invention also applies to the case of a P-channel selection transistor. In this last case, however, the gates of the selection and memory transistors of the blank cells of the read-only memory will not be interconnected. The gates of the memory transistors of the blank cells will be unconnected while the gates of the associated selection transistors will be connected to a respective read line RL.

[0063] Such alterations, modifications, and improvements are intended to be part of this disclosure, and are intended to be within the spirit and the scope of the present invention. Accordingly, the foregoing description is by way of example only and is not intended to be limiting. The present invention is limited only as defined in the following claims and the equivalents thereto.

Claims

1. A read-only memory comprising programmed and blank cells, each of the cells including, between a selection line and a bit line, a series connection of a memory element and of a MOS selection transistor with a gate connected to a read control line, wherein the memory elements of the blank cells are P-channel MOS transistors; and wherein the memory elements of the programmed cells are uniformly N-type doped semiconductor regions.

2. The memory of claim 1, wherein of the memory elements of the blank cells have gates that are unconnected.

3. The memory of claim 1, wherein the selection transistor of at least one of the blank cells is an N-channel transistor and wherein the gates of the memory and selection transistors of said at least one blank cell are interconnected by a conductive connection.

4. The memory of claim 1, wherein the read-only memory is formed in a same integrated circuit chip as a programmable memory formed of cells including, between a selection line and a bit line, a series connection of a P-channel MOS transistor, having a gate, unconnected, and of a MOS transistor, having a gate connected to a read control line, the selection lines of the read-only and programmable memories being connectable to a selection power supply and the selection lines of the programmable memory being selectively connectable to a write power supply distinct from said selection power supply.

5. A method for forming, in a single-crystal semiconductor substrate, a read-only memory, comprising the steps of: defining first and second active areas of same dimension; forming isolated lines above the second active areas and some of the first active areas; implanting exposed portions of said first and second active areas; depositing an insulator over the substrate and isolated lines; opening said insulator to partially expose each of the first and second areas; and forming selection lines in contact with the first active areas, conductive connections to match each first active area with a second active area, and bit lines in contact with said second active areas.

6. A configurable memory array formed in a surface of a semiconductor substrate, comprising: conductive select lines, bit lines, and redlines; a plurality of first memory cells each storing either a first logic state or a second logic state, coupled between one of the select lines and one of the bit lines, and having a read input; a plurality of second memory cells each permanently storing only the first logic state and coupled between one of the select lines and one of the bit lines; and a plurality of third memory cells permanently storing only the second logic state and coupled between one of the select lines and one of the bit lines.

7. The configurable memory array according to claim 6 wherein the first logic state is a logical one, and the second logic state is a logical zero.

8. The configurable memory array according to claim 6 wherein each the plurality of first memory cells comprise: a first transistor having, a source region coupled to one of the select lines, a gate region, and a drain region; a conductive region having a first terminal coupled to the drain region of the first transistor, and a second terminal; and a second transistor having, a drain region coupled to the second terminal of the conductive region, a gate region and coupled to one of the read lines, and a source region coupled to one of the bit lines.

9. The configurable memory array according to claim 8 wherein the gate region of the first transistor is floating.

10. The configurable memory array according to claim 8 wherein the conductive region comprises a region of metal.

11. The configurable memory array according to claim 6 wherein each of the plurality of second memory cells comprises: a resistive region having first and second terminals wherein the second terminal is coupled to one of the select lines; a conductive region having first and second terminals wherein the first terminal of the conductive region is coupled to the second terminal of the resistive region; and a transistor having, a drain region coupled to the second terminal of the conductive region, a gate region and coupled to one of the read lines, and a source region coupled to one of the bit lines.

12. The configurable memory array according to claim 11 wherein the resistive region comprises a dopant formed in the surface of the semiconductor substrate.

13. The configurable memory array according to claim 11 wherein the conductive region comprises, a region of polysilicon.

14. The configurable memory array according to claim 11 wherein the resistive region is a region of N-type dopant.

15. The configurable memory array according to claim 6 wherein each of the plurality of third memory cells comprises: a first transistor having an active region, a gate region formed over the active region of the first transistor and coupled to one of the read lines, a source region coupled to one of the select lines, and a drain region; a conductive region having first and second terminals wherein the first terminal is coupled to the drain region of the first transistor; and a second transistor having an active region, a gate region formed over the active region of the second transistor and coupled to one of the read lines, a drain region coupled to the second terminal of the conductive region, and a source region coupled to the bit line.

16. The configurable memory array according to claim 15 wherein the active region of the first transistor is P-type conductivity, and the active region of the second transistor is N-type conductivity.

17. A configurable memory array cell formed in a semiconductor substrate for a memory having a bit line, a read line, and a select line, the cell comprising: a conductive region having first and second terminals; a first active region having first and second contacts, and a polysilicon region formed of a first portion of the read line wherein the first contact of the first active region is coupled to the first terminal of the conductive region and the second contact of the first active region is coupled to the select line; and a second active region having first and second contacts, and a polysilicon region formed of a second portion of the read line wherein the first contact of the second active region is coupled to the second terminal of the conductive region, the second contact of the second active region is coupled to the bit line, and the second portion of the read line is substantially orthogonal to the first portion of the read line.

18. The configurable memory array cell according to claim 17 wherein the first and second active regions are N-type conductivity.

19. A method of forming a configurable memory array in a semiconductor substrate comprising: forming a plurality of first active regions in the surface of the semiconductor substrate thereby defining a first total number of first active regions; forming a plurality of second active regions in the surface of the semiconductor substrate thereby defining a second total number of second active regions; forming a first subset of a plurality of the first conductive strips over a first portion of the plurality of the first active regions wherein electrically programmable memory cells are formed; forming a second subset of the plurality of first conductive strips over a second portion of the plurality of the first active regions wherein a plurality of read-only logic-zero memory cells are formed; forming a plurality of second conductive strips over the plurality of second active regions, wherein the first conductive strips of the second subset of the plurality of first conductive strips electrically couples to the plurality of second conductive strips over the plurality of second active regions.

20. The method of forming a configurable memory array according to claim 19 wherein the step of forming the first subset of the plurality of first conductive strips further comprises determining a first number of first conductive strips less than or equal to the first total number.

21. The method of forming a configurable memory array according to claim 19 wherein the step of forming a second subset of the plurality of first conductive strips further comprises the step of determining a second number of first conductive strips less than or equal to the first total number.

22. The method of forming a configurable memory array according to claim 19 wherein the step of forming a second subset of the plurality of first conductive strips forms a third subset of the plurality of first conductive strips equal to the first total number minus the second number thereby defining a plurality of read-only logic-one memory cells.