Patent Application
20070160448
1. Field of the Invention
The invention relates generally to semiconductor manufacturing, and more particularly to an improved receipt and delivery control system for front opening unified pods (FOUP) and reticle storage pods (RSP) within a semiconductor fabrication facility.
2. Description of the Related Art
Reduction of semiconductor processing cycle time is of utmost importance within a semiconductor fabrication facility. Transportation moves within a semiconductor fabrication facility increase semiconductor processing cycle time. Therefore, it has become increasingly important to reduce transportation moves within a semiconductor fabrication facility.
The prior art method for FOUP/RSP receipt and delivery within a semiconductor fabrication facility is depicted in
The prior art method is problematic because the MSP does not efficiently determine and subsequently send receipt and delivery instructions to the vehicles in the semiconductor fabrication facility. The MSP does not determine which pod a station requires next until after the vehicle receives the pod from the station. A more efficient receipt and delivery instruction is necessary to reduce semiconductor processing cycle time.
What is needed in the art is an improved FOUP/RSP receipt and delivery control system for semiconductor fabrication facilities that reduces semiconductor processing cycle time.
The invention comprises a method for pod transportation within a semiconductor fabrication facility comprising the steps of receiving, determining, and sending. The receiving step comprises receiving a completion notice of a process performed on the contents of a pod from one of the stations in the semiconductor fabrication facility. The determining step comprises determining which pod the station requires next. The sending step comprises sending an instruction to a vehicle in the semiconductor fabrication facility to receive the pod that the station finished processing from the station and deliver the pod that the station requires next to the station.
The invention comprises a system for pod transportation within a semiconductor fabrication facility comprising vehicles, stations, and a material control system (MCS). Each vehicle comprises at least two compartments for receiving or delivering a pod through the semiconductor fabrication facility and a communication system that receives an instruction regarding receipt and delivery of pods. Each process tool receives a pod from the vehicles, performs a process on contents of the received pod, and sends a notice upon completion of the process. The MCS has a communication system that receives the completion notice from one of the stations, determines the pod that the station requires next, and sends an instruction to one of the vehicles to receive the first pod from the station and deliver the required second pod to the station.
The invention is directed to an improved pod transportation system and method within a semiconductor fabrication facility. The invention reduces vehicle transportation time within a semiconductor fabrication facility. Therefore, the invention reduces semiconductor processing cycle time.
For at least the foregoing reasons, the invention improves upon pod transportation within a semiconductor fabrication facility.
The features and the element characteristics of the invention are set forth with particularity in the appended claims. The figures are for illustrative purposes only and are not drawn to scale. Furthermore, like numbers represent like features in the drawings. The invention itself, however, both as to organization and method of operation, may best be understood by reference to the detailed description which follows, taken in conjunction with the accompanying figures, in which:
The invention will now be described with reference to the accompanying figures. In the figures, various aspects of the structures have been depicted and schematically represented in a simplified manner to more clearly describe and illustrate the invention.
By way of overview and introduction, the invention is directed to an improved method and system for FOUP and/or RSP receipt and delivery within a semiconductor fabrication facility. Upon receipt of a completion notice from a station within the semiconductor fabrication facility, the MCS determines which pod a station requires next and sends a vehicle an instruction to receive the pod that the station finished processing and deliver to the pod that the station requires next. Upon arriving at the station with the next required pod, the vehicle executes combined pick-up of completed previous pod and delivery of next pod.
The invention efficiently handles the receipt and delivery of pods within a semiconductor fabrication facility through the use of a MCS that determines which pod a station requires next and then sends an instruction to a single vehicle to both receive the pod that the station finished processing and deliver the pod that the station requires next. In so doing, the invention reduces cycle time within the semiconductor fabrication facility.
While the invention has been particularly described in conjunction with a specific preferred embodiment and other alternative embodiments, it is evident that numerous alternatives, modifications and variations will be apparent to those skilled in the art in light of the foregoing description. It is therefore intended that the appended claims embrace all such alternatives, modifications and variations as falling within the true scope and spirit of the invention.
