1. Field of the Invention
The present invention relates to a recording/reproducing separated type magnetic head for use in magnetic disk apparatuses.
2. Description of the Prior Art
Along with the capacity enlargement of magnetic disk apparatuses, the requirement for higher recording density is increasing year after year. The apparatuses are also required to be smaller. To meet these requirements, state-of-the-art magnetic disk apparatuses use a giant magnetoresistive (GMR) head to perform the reproducing function of the recording/reproducing separated type magnetic head, with their recording track width being reduced to 0.3 μm and the gap between the head and the recording medium (hereinafter referred to as the flying height), to 13 nm, both approximately.
In order to achieve a high density of recording, the heads indispensably need to be lowered in flying height. However, along with the lowering of the flying height, the deformation of heads due to heat generation of coils in the inductive write thin film head during recording is posing an increasingly serious problem, because the deformation of heads would invite localized protrusion of the air bearing surfaces of the heads by about 3 nm and the consequent narrowing of the gap between the heads and the recording medium to about 10 nm, leading to possible collision of the heads and the recording medium, which would make head positioning impossible and in the worst case result in signal disappearance due to damaging of the recording medium or sliding of the heads. Studies on this problem include, for instance, what is reported in the IEEE Transactions on Magnetics, VOL. 38. NO.1, JANUARY 2002, pp 101.
A head can be deformed by differences among its constituent layers in the ratio of expansion when the head is heated. The heating of the head in turn would be due to its ambient temperature or its own heat generation. Among the factors of ambient temperature, the temperature within the magnetic disk apparatus is dominant. Many magnetic disk apparatuses are guaranteed against a temperature of about 60° C. The self-generated heat of the head mainly derives from Joule heating due to the electrification of coils at the time of writing, eddy current heating in the high frequency region, iron loss and an increase in resistance by the skin effect.
Deformation can be reduced by lowering the head temperature, the ambient temperature among various temperature elements is specified by the customer, and the manufacturer has to configure a structure that can meet the customer's requirement. On the other hand, to reduce the self-generated heat of heads, effective ways include reducing the resistance of coils, shaping the magnetic film compactly and using high-resistance magnetic materials. It is effective as well to reduce the volumic proportion of a material with a big difference in thermal expansion coefficient. More specifically, it is advisable to reduce the size of metallic films having a high thermal expansion coefficient, for instance, upper and lower shield films. Further, it is also effective to enhance the heat radiation effect. This can be achieved by providing a radiator plate near the source of heat. However, though the deformation of the head can be restrained to some extent by these means, deformation still occur as long as there are differences in thermal expansion coefficient among the constituent members, and it is impossible to completely eliminate contact between the head and the magnetic disk.
An object of the present invention is to provide a highly sliding resistance reliability of recording/reproducing separated type magnetic head by preventing the head coming into contact with a recording medium, which arises with the deformation of the head and with a decrease in the flying height of the head, which is an indispensable requirement for high density recording.
The object stated above can be achieved by providing a level gap on the air bearing surface of an inductive write thin film head and the air bearing surface of a read GMR head with a protective film, forming the air bearing surface of the inductive write thin film head, which is subject to deformation by heat generation, in a concave shape in advance (forming a first concave), and thereby preventing the air bearing surface of the inductive write thin film head, which is subject to deformation by heat generation, from protruding through the air bearing surface of the read GMR head.
Thus, by removing only the carbon film of the multilayered protective film on the air bearing surface in a wear-susceptible area A of a recording/reproducing separated type magnetic head to form a concave air bearing surface of about 3.5 nm in depth in advance, it is possible to provide a highly reliable recording/reproducing separated type magnetic head that can avoid contact with the recording medium even when heated by the use. A similar effect can be achieved by totally removing the multilayered protective film on the air bearing surface of the recording/reproducing separated type magnetic head in the part matching the inductive write thin film head to form a concave.
The read GMR head is configured by stacking over a substrate 1 a lower shield film 2, a lower gap film 4, a magnetoresistive film (GMR film) 7 for detecting signals, a hard bias film 6 for controlling the domain in the end portion of the GMR film 7, an electrode film 8 for flowing an electric current to the GMR film 7, an upper gap film 5, an upper shield film-cum-lower magnetic film 3 and so forth. On the other hand, the inductive write thin film head uses the upper shield of the GMR head also as the lower magnetic film, and is configured by stacking over this upper shield film-cum-lower magnetic film 3 a write gap film 9, coils 10, an insulating layer 11, an upper magnetic film 12 and so on. Over the inductive write thin film head is stacked a protective film 13. Further, over the air bearing surface is formed a multilayered protective film 19 on the air bearing surface by stacking a silicon film Si and a carbon film C by sputtering or otherwise. The silicon film Si is a layer in tight contact with the carbon film C.
The multilayered protective film 19 on the air bearing surface is formed for the purpose of preventing the read GMR head from corrosion and discharge, of which the silicon film Si is about 1.5 nm and the carbon film C, about 3.5 nm. In the upper end portion of the protective film 13 is formed an air bearing surface shallow groove 14 (second concave) d2. Further by removing the part of the carbon film C in what will constitute a C film-removed area 20 from the multilayered protective film 19 on the air bearing surface, a protective film level gap (first concave) d1 of a depth corresponding to the thickness of the carbon film C (about 3.5 nm) is formed in the air bearing surface matching the upper magnetic film 12 of the inductive write thin film head. Incidentally, the second concave d2 can be dispensed with.
A number of methods are available for the formation of the level gap of the multilayered protective film 19 on the air bearing surface. A first method to form the level gap is, in the process of floating rail formation for the head, to mask other parts than the C film-removed area 20 with a resist (masking material), etch the exposed portion with oxygen (RIE) and remove the carbon film C while leaving the silicon film Si. A second method is to remove the carbon film C by reactive ion etching (RIE) with oxygen after forming a mask as in the first method, then remove the silicon film Si as well with CF4 reactive gas, and finally remove the whole multilayered protective film 19 on the air bearing surface. A third method is to form the whole air bearing surface protective film 19 of a carbon film C, and then remove the air bearing surface protective film 19 in the same way as described above. The last two methods require consideration of possible adverse impacts, such as damage or corrosion, on the surface of the upper magnetic film 12 which becomes exposed on the air bearing surface. No particular exactness is required for the depth of this protective film level gap d1, which may be 3 to 5 nm.
Next will be described in detail a manufacturing method for the recording/reproducing separated type magnetic head embodying the invention with reference to FIG. 2 and FIG. 4. First, reference is made to FIG. 2.
(1) The substrate 1 is formed in a wafer shape by stacking an Al2O3 film (base alumina) over sintered Al2O3.TiC (alumina titanium carbide) by sputtering. The lower shield film 2 is formed over this substrate 1 by plating. The lower shield film 2 is an NiFe alloy film of 2 μm in thickness.
(2) Next, the lower gap film 4 is formed of Al2O3 (alumina) by sputtering to a thickness of 0.05 μm. After that, it is processed into a desired shape by photolithography and ion milling.
(3) Then, the GMR film 7 is formed by sputtering, and processed into a desired shape by photolithography and ion milling. The GMR film 7 is a spin valve film having a CoFe free layer.
(4) Next, the hard bias film 6 and the electrode film 8 are formed by sputtering. Patterning is done by a lift-off method. The hard bias film 6 is a CoPt film. The electrode film 8 is a laminated layer of Ta and a thin film of its alloy.
(5) Then, the upper gap film 5 is formed of Al2O3 (alumina) by sputtering to a thickness of 0.05 μm. After that, it is processed into a desired shape by photolithography and ion milling.
(6) Further the upper shield film-cum-lower magnetic film 3 is formed an NiFe alloy film by plating to a thickness of 2 μm.
The formation of the read GMR head is now completed.
Then, the inductive write thin film head is stacked over the read GMR head.
(7) The write gap film 9 is formed of Al2O3 (alumina) to a thickness of 0.2 μm by sputtering over the upper shield film-cum-lower magnetic film 3.
(8) Then, the coil 10 is formed of Cu by plating. The number of turns of the coil 10 is nine.
(9) Next, the insulating layer 11 is formed by coating with a photoresist followed by heat treatment to a thickness of 10 μm.
(10) Then, the upper magnetic film 12 is formed of NiFeCo by plating.
(11) Next, a lower terminal 15 is formed of Cu by plating to be electrically connected to the electrode film 8.
(12) Next, the protective film 13 is formed of Al2O3 (alumina) to a thickness of 60 μm by sputtering.
(13) Then, the protective film 13 is lapped to expose the lower terminal 15, over which an upper terminal 16 is formed of Au to a thickness of 6 μm by plating.
The formation of the read head and the write head is now completed.
This is followed by the formation of the multilayered protective film 19 on the air bearing surface, and the level gap d2 is formed in the protective film 13 by shaped rail (SR) machining, and the level gap d1, in the multilayered protective film 19 on the air bearing surface.
(14) As shown in
(15) Next, as shown in
(16) Then, as shown in
(17) By removing the resist (masking material) 22 after that, the level gap (first concave) d1 of the air bearing surface protective film is formed as shown in FIG. 1.
(18) By cutting this bar block 18 into chips, the recording/reproducing separated type magnetic head, which is this first embodiment of the invention, is completed.
While the first embodiment described above is a recording/reproducing separated type magnetic head wherein the upper shield of the read head is also used as the lower magnetic film of the write head, the invention can also be applied to a type where the two elements are separated by an insulating separation film 23 as shown in
As hitherto described, by forming a level gap in the part of the multilayered protective film on the air bearing surface matching the inductive write thin film head of the head air bearing surface, it is made possible to provide a recording/reproducing separated type magnetic head in which the protrusion of the head to the air bearing surface due to thermal deformation can be cancelled and, at the same time, the lowest floating point of the read GMR head can be made
Number | Date | Country | Kind |
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2002-239059 | Aug 2002 | JP | national |
Number | Name | Date | Kind |
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5978176 | Ezaki et al. | Nov 1999 | A |
6396663 | Kasamatsu | May 2002 | B1 |
20020109942 | Otsuka | Aug 2002 | A1 |
Number | Date | Country |
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04-366408 | Dec 1992 | JP |
04-368408 | Dec 1992 | JP |
Number | Date | Country | |
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20040037012 A1 | Feb 2004 | US |