Patent Application
20090165489
The invention relates to the field of heat sinks in general, and more particularly to heat sinks with condenser for electronics cooling using refrigeration.
Most electronic devices are air cooled, with refrigeration systems only used in a minority of devices, mainly larger computer systems. Refrigeration, however, is feasible in mobile computer systems or those with smaller form factors, when a condenser of the refrigeration system performs at a sufficient level, is compact, and can withstand the pressures of the refrigeration cycle.
It would be advantageous to provide such a condenser to dissipate heat from components in a computer system, particularly from a mobile computer system.
Various advantages of embodiments of the invention will become apparent to one skilled in the art by reading the following specification and appended claims, and by referencing the following drawings, in which:
Described herein are some embodiments for a condenser stack, apparatus, system, and method of manufacture of the stack and apparatus. In the following description, numerous specific details are set forth. One of ordinary skill in the art, however, will appreciate that these specific details are not necessary to practice embodiments of the invention.
While certain exemplary embodiments of the invention are described and shown in the accompanying drawings, it is to be understood that such embodiments are merely illustrative and not restrictive of the current invention, and that this invention is not restricted to the specific constructions and arrangements shown and described because modifications may occur to those ordinarily skilled in the art.
In other instances, known semiconductor fabrication processes, techniques, materials, equipment, etc., have not been set forth in particular detail in order to highlight some embodiments of the invention.
Moreover, in some embodiments, the condenser stack 100 may include a first microchannel plate 120a mounted to the upper side of the cross-flow plate 110. The plate 120a may have a plurality of microchannels 122 along a medial plane, and may have an upper external surface that may act as an enclosure for the condenser stack 100. In some embodiments, a second microchannel plate 120b may be included and mounted to the lower side of the cross-flow plate 110. The plate 120b may have a plurality of microchannels 122 along a medial plane, and may have a lower external surface that may act as an enclosure for the condenser stack 100, according to some embodiments.
According to some embodiments of the invention, when the plates 110, 120a and 120b are mounted a cavity may be formed within them to allow for the flow of the refrigerant substantially through the plurality of microchannels in a direction generally perpendicular to the plurality of transverse slots 116. In some embodiments, the refrigerant may flow into and out of the condenser stack 100 via one or more lateral openings 140 at the distal ends of the condenser stack 100.
In some embodiments, the cross-flow plate 110 may provide internal structure or support. Each side of the cross-flow plate 110 may be mounted or bonded to the microchannel plates 120a and/or 120b to form a reasonably solid connection across the condenser stack 100. In some embodiments, this bonded structure may support the external surfaces (faces) of the microchannel plates 120a and/or 120b, which may become the external (top and/or bottom) surfaces of the condenser stack 100 once assembled, against the internal pressure of the refrigerant, which may prevent significant deformation of the condenser stack 100.
According to some embodiments, the plate 110 may also help promote the uniform flow of the refrigerant through the plurality of microchannels. The transverse slots may, in some embodiments, connect all the microchannels together. If a microchannel should become clogged at some point, for example, due to a solid particle, or suffer from a flow instability, then the transverse slots may allow the refrigerant to flow from adjacent microchannels to enter the clogged microchannel downstream of the blocked point.
In some embodiments, the plates 110, 120a and 120b may be mounted using a brazing process or equivalent bonding process, as one of ordinary skill in the relevant art would appreciate based at least on the teachings herein.
Moreover, in some embodiments, the plates 110, 120a and 120b may include aluminum, copper, or steel, as well as other metals, or composites or combinations, as one of ordinary skill in the relevant art would appreciate based at least on the teachings herein.
In some embodiments, the plates 110, 120a and 120b may be about one millimeter thick, and in some embodiments may be about two millimeters thick to several millimeters thick. The other dimensions of the condenser stack 100, as one of ordinary skill in the relevant art would appreciate based at least on the teachings herein, may range from a couple centimeters to several centimeters or more. Moreover, additional plates may be stacked, in accordance with the teachings herein, as one of ordinary skill in the relevant art would appreciate.
According to some embodiments and described in additional detail elsewhere herein, the plates 110, 120a and 120b may be formed substantially by one or more of extrusion, stamping, folding, bonding, machining, forging, molding, cutting, or any combination of these techniques or their equivalents.
In some embodiments of the invention, the apparatus 150 may include the condenser stack 100 and a first heat sink 130a to transfer thermal energy. The first heat sink 130a may be mounted to at least one of the first microchannel plate 120a or in the event, a heat sink 130b may be implemented, the second microchannel plate 120b.
In some embodiments, the second heat sink 130a or 130b may transfer thermal energy and may be mounted to the other one of the plates 120a or 120b than the one upon which the first heat sink 130 is mounted.
In some embodiments, the first or the second heat sink 130a or 130b may be mounted using a soldering process or equivalent bonding process, as one of ordinary skill in the relevant art would appreciate based at least on the teachings herein. Moreover, in some embodiments, either of heat sinks 130a or 130b may be a fin array, a fin-pin array, a bar shape, or an angled shape, or similar or equivalent configuration, as one of ordinary skill in the relevant art would appreciate based at least on the teachings herein.
Moreover, in some embodiments, the heat sinks 130a or 130b may include aluminum, copper, or steel, as well as other metals, or composites or combinations, as one of ordinary skill in the relevant art would appreciate based at least on the teachings herein.
According to some embodiments and described in additional detail elsewhere herein, the heat sinks 130a or 130b may be formed substantially by one or more of extrusion, stamping, folding, bonding, machining, forging, molding, cutting, or any combination of these techniques or their equivalents.
According to some embodiment, the system 200 may include an evaporator 230 to receive thermal energy from a component 235 and to transfer a portion of the thermal energy to a refrigerant, wherein the refrigerant may be conducted via pressure through tubing 210 coupled the evaporator 230. In some embodiments, a compressor 240 may be coupled via the tubing 210 to the evaporator 230 and be capable of increasing the pressure on the refrigerant and also capable of pumping it through the tubing 210.
According to some embodiments, the apparatus 150 may operate as a condenser coupled via the tubing 210 to the compressor 240, where the apparatus 150 may include the components of the embodiments described elsewhere herein.
In some embodiments, a throttling device 220 may be coupled via the tubing 210 to the apparatus 150 and may be capable of restricting the flow of the refrigerant to reduce the pressure within the tubing 210. In some embodiments, the throttling device 220 may be coupled to the evaporator 230 via the tubing 210 and may be capable of allowing the refrigerant to flow via the tubing 210 to the evaporator 230.
In some embodiments, the component 235 may include an electronic component 237, a cold plate 236, as well as other optional components, such as, but not limited to, a heat exchanger or a fan. Moreover, in some embodiments, the electronic component 237 may be a central processing unit (CPU), a processor, a core, a chipset, or a memory, or other component as one of ordinary skill in the relevant art would appreciate based at least on the teachings provided herein.
Furthermore, the refrigeration system 200 may include additional components not shown here, as one of ordinary skill in the relevant art would appreciate based at least on the teachings herein, such as, but not limited to temperature controlled baths, pre-heaters and/or pre-coolers, super-heaters or super-coolers, alternative pumping and metering devices, and/or expansion valves. Additionally, in some embodiments, the refrigeration system 200 may include multiples of these and the illustrated components, at various places in the system, as one of ordinary skill in the relevant art would appreciate based at least on the teachings provided herein. In some embodiments, the system 200 may be implemented in or on a computer, such as, but not limited to, various forms of personal computers, server computers, mobile computers, handheld electronic devices and their equivalents, as one of ordinary skill in the relevant art would appreciate based at least on the teachings provided herein.
The process 300 may begin at 302 by forming a cross-flow plate, such as plate 110, with a plurality of transverse slots, such as slots 116. The process 300 may then proceed to 304.
At 304, the process 300 may form a first microchannel plate, such as plate 120a, with a plurality of microchannels 122 below a medial plane of the plate 120a. The process 300 may then proceed to 306.
At 306, the process 300 may form a second microchannel plate, such as plate 120b with a plurality of microchannels 122 above a medial plane of the plate 120b. The process 300 may then proceed to 308.
At 308, the process 300 may mount the first microchannel plate, such as plate 120a, to an upper surface of the cross-flow plate. Moreover, the process 300 may also mount, at 310, the second microchannel plate, such as plate 120b, to a lower surface of the cross-flow plate. In some embodiments, the mounting of the process 300 may include brazing.
Moreover, according to some embodiments, the components formed by the process 300 may be formed substantially by one or more of extrusion, stamping, folding, bonding, machining, forging, molding, cutting, or any combination of these techniques or their equivalents.
As one of ordinary skill in the relevant art would appreciate based at least on the teachings provided herein, the operations of process 300 may be performed in a different order. Specifically, the operations 302, 304, and 306 may be performed in a different order, or simultaneously and independently, as they merely outline the formation of the components, according to embodiments of the invention. Moreover, the mounting operations of
The process 400 may begin at 402 by disposing the condenser stack formed by the process 300, such as, but not limited to condenser stack 100, to receive one or more heat sinks. The process 400 may then proceed to 404.
At 404, the process 400 may mount a first heat sink, such as, but not limited to heat sink 130a, to an upper surface of the first microchannel plate at the top of the condenser stack. The process 400 may then optionally proceed to 406.
Optionally, the process 400 may mount a second heat sink, such as, but not limited to heat sink 130b, to a lower surface of the second microchannel plate of the condenser stack. The process 400 may then optionally proceed to 408. In some embodiments, the mounting of 404 and 406 may include soldering.
At 408, the process 400 may attach one or more sections of tubing, such as, but not limited to the tubing 210, at one or more lateral openings, such as, but not limited to the lateral openings 140, of the condenser stack.
Several embodiments of the invention have thus been described. However, those of ordinary skill in the art will recognize that the invention is not limited to the embodiments described, but can be practiced with modification and alteration, including the equivalent substitution of materials, processes, dimensions, etc., within the scope and spirit of the appended claims that follow.
