Release layer paste and method of production of a multilayer type electronic device

Abstract

A release layer paste used for producing a multilayer type electronic device and forming a release layer of a thickness of 0.05 to 0.1 μm, used in combination with an electrode layer paste including one or more solvents selected from limonene, dihydroterpinyl methyl ether, α-terpinyl acetate, terpinyl methyl ether, isobornyl acetate, caryophyllene, 1-dihydrocarvyl acetate, menthone, menthyl acetate, perillyl acetate, carvyl acetate, d-dihydrocarvyl acetate, and butyl carbitol acetate and a binder comprised of ethyl cellulose, including a ceramic powder, organic vehicle, plasticizer, and dispersion agent, the organic vehicle containing a binder having polyvinyl acetal as its main ingredient, a ratio (P/B) of the ceramic powder with respect to the binder and plasticizer being controlled to 1.33 to 5.56 (however, excluding 5.56).

Description

BRIEF DESCRIPTION OF THE DRAWINGS

Embodiments of the present invention will be explained in detail below with reference to the drawings. Here,

FIG. 1 is a schematic cross-sectional view of a multilayer ceramic capacitor according to an embodiment of the present invention,

FIG. 2A to FIG. 2C are cross-sectional views of principal parts showing a method of formation of an electrode layer and green sheet according to an embodiment of the present invention,

FIG. 3A to FIG. 3C are cross-sectional views of principal parts showing a method of formation of a bonding layer according to an embodiment of the present invention,

FIG. 4A, FIG. 4B, FIG. 5A, and FIG. 5B are cross-sectional views of principal parts showing a method of stacking green sheets having electrode layers according to an embodiment of the present invention,

FIG. 6A and FIG. 6B are cross-sectional views of principal parts showing a method of stacking green sheets having electrode layers according to another embodiment of the present invention, and

FIG. 7A to FIG. 7C and FIG. 8A to FIG. 8C are cross-sectional views of principal parts showing a method of stacking green sheets having electrode layers according to another embodiment of the present invention.

Claims

1. A release layer paste used for producing a multilayer type electronic device and forming a release layer of a thickness of 0.05 to 0.1 μm, used in combination with an electrode layer paste including one or more solvents selected from limonene, dihydroterpinyl methyl ether, α-terpinyl acetate, terpinyl methyl ether, isobornyl acetate, caryophyllene, 1-dihydrocarvyl acetate, menthone, menthyl acetate, perillyl acetate, carvyl acetate, d-dihydrocarvyl acetate, and butyl carbitol acetate and a binder comprised of ethyl cellulose,including a ceramic powder, organic vehicle, plasticizer, and dispersion agent,said organic vehicle containing a binder having polyvinyl acetal as its main ingredient,a ratio (P/B) of said ceramic powder with respect to said binder and plasticizer being controlled to 1.33 to 5.56 (however, excluding 5.56).

2. A release layer paste used for producing a multilayer type electronic device and forming a release layer of a thickness of 0.05 to 0.1 μm, used in combination with an electrode layer paste including one or more solvents selected from limonene, dihydroterpinyl methyl ether, α-terpinyl acetate, terpinyl methyl ether, isobornyl acetate, caryophyllene, 1-dihydrocarvyl acetate, menthone, menthyl acetate, perillyl acetate, carvyl acetate, d-dihydrocarvyl acetate, and butyl carbitol acetate and a binder comprised of ethyl cellulose,including a ceramic powder, organic vehicle, plasticizer, and dispersion agent,said organic vehicle containing a binder having polyvinyl acetal as its main ingredient,said binder being contained in an amount of 12 to 50 parts by weight with respect to 100 parts by weight of said ceramic powder (however, excluding 12 parts by weight).

3. The release layer paste as set forth in claim 1, wherein said polyvinyl acetal has a polymerization degree of 2000 to 3600 and an acetalization degree of 66 to 74 mol %.

4. The release layer paste as set forth in claim 2, wherein said polyvinyl acetal has a polymerization degree of 2000 to 3600 and an acetalization degree of 66 to 74 mol %.

5. The release layer paste as set forth in claim 1, wherein said plasticizer is at least one plasticizer selected from the group of dibutyl phthalate (DBP), dioctyl phthalate (DOP), and butylbenzyl phthalate (BBP) and is contained in an amount of 0 to 100 parts by weight (however, excluding 0 part by weight and 100 parts by weight) with respect to 100 parts by weight of said ceramic powder.

6. The release layer paste as set forth in claim 2, wherein said plasticizer is at least one plasticizer selected from the group of dibutyl phthalate (DBP), dioctyl phthalate (DOP), and butylbenzyl phthalate (BBP) and is contained in an amount of 0 to 100 parts by weight (however, excluding 0 part by weight and 100 parts by weight) with respect to 100 parts by weight of said ceramic powder.

7. The release layer paste as set forth in claim 1, wherein said ceramic powder has an average particle size of larger than 0.02 μm and 0.1 μm or less.

8. The release layer paste as set forth in claim 2, wherein said ceramic powder has an average particle size of larger than 0.02 μm and 0.1 μm or less.

9. The release layer paste as set forth in claim 1, wherein said dispersion agent is a nonionic dispersion agent and is contained in an amount of 1 to 3 parts by weight with respect to 100 parts by weight of said ceramic powder.

10. The release layer paste as set forth in claim 2, wherein said dispersion agent is a nonionic dispersion agent and is contained in an amount of 1 to 3 parts by weight with respect to 100 parts by weight of said ceramic powder.

11. The release layer paste as set forth in claim 1, wherein said organic vehicle contains a solvent comprised of at least one of ethyl alcohol, methylethylketone, methylisobutylketone, propanol, xylene, and toluene and contained so as to give a concentration of nonvolatile ingredients of 5 to 20 wt %.

12. The release layer paste asset forth in claim 2, wherein said organic vehicle contains a solvent comprised of at least one of ethyl alcohol, methylethylketone, methylisobutylketone, propanol, xylene, and toluene and contained so as to give a concentration of nonvolatile ingredients of 5 to 20 wt %.

13. A method of production of a multilayer type electronic device comprising: a step of forming a release layer of a thickness of 0.05 to 0.1 μm on a releasing side of a first supporting sheet treated for releasing,a step of forming an electrode layer on the surface of said release layer in a predetermined pattern,a step of forming a green sheet on the surface of said electrode layer to obtain a green sheet having an electrode layer,a step of stacking said green sheets having electrode layers to form a green chip, anda step of firing said green chip, whereinas the release layer paste for forming said release layer, a release layer paste set forth in claim 1 is used.

14. A method of production of a multilayer type electronic device comprising: a step of forming a release layer of a thickness of 0.05 to 0.1 μm on a releasing side of a first supporting sheet treated for releasing,a step of forming an electrode layer on the surface of said release layer in a predetermined pattern,a step of forming a green sheet on the surface of said electrode layer to obtain a green sheet having an electrode layer,a step of stacking said green sheets having electrode layers to form a green chip, anda step of firing said green chip, whereinas the release layer paste for forming said release layer, a release layer paste set forth in claim 2 is used.

15. The method of production of a multilayer type electronic device as set forth in claim 13, further comprising treating said first supporting sheet for releasing by coating it with a release agent mainly comprised of silicone and controlling a peeling strength of said first supporting sheet to 8 to 20 mN/cm (however, excluding 8 mN/cm).

16. The method of production of a multilayer type electronic device as set forth in claim 14, further comprising treating said first supporting sheet for releasing by coating it with a release agent mainly comprised of silicone and controlling a peeling strength of said first supporting sheet to 8 to 20 mN/cm (however, excluding 8 mN/cm).

17. The method of production of a multilayer type electronic device as set forth in claim 13, further comprising treating said first supporting sheet for releasing by coating it with a release agent mainly comprised of an alkyd resin and controlling a peeling strength of said first supporting sheet to 50 to 130 mN/cm (however, excluding 50 mN/cm and 130 mN/cm).

18. The method of production of a multilayer type electronic device as set forth in claim 14, further comprising treating said first supporting sheet for releasing by coating it with a release agent mainly comprised of an alkyd resin and controlling a peeling strength of said first supporting sheet to 50 to 130 mN/cm (however, excluding 50 mN/cm and 130 mN/cm).

19. The method of production of a multilayer type electronic device as set forth in claim 13, wherein the ceramic powder contained in the release layer paste has the same composition as the ceramic powder contained in the paste for forming the green sheet.

20. The method of production of a multilayer type electronic device as set forth in claim 14, wherein the ceramic powder contained in the release layer paste has the same composition as the ceramic powder contained in the paste for forming the green sheet.

21. The method of production of a multilayer type electronic device as set forth in claim 13, wherein a thickness of said release layer and a thickness of said green sheet minus the thickness of the electrode layer part total 1.0 μm or less.

22. The method of production of a multilayer type electronic device as set forth in claim 14, wherein a thickness of said release layer and a thickness of said green sheet minus the thickness of the electrode layer part total 1.0 μm or less.

23. The method of production of a multilayer type electronic device as set forth in claim 13, further comprising, before forming said green sheet, forming on the surface of said release layer where said electrode layer is not formed a blank pattern layer to the same thickness as said electrode layer and of the same material as said green sheet.

24. The method of production of a multilayer type electronic device as set forth in claim 14, further comprising, before forming said green sheet, forming on the surface of said release layer where said electrode layer is not formed a blank pattern layer to the same thickness as said electrode layer and of the same material as said green sheet.

25. The method of production of a multilayer type electronic device as set forth in claim 13, further comprising before stacking said green sheets having electrode layers, forming an adhesive layer on the surface of said green sheet having electrode layers opposite to the electrode layer side and stacking said green sheets having electrode layers through said adhesive layers.

26. The method of production of a multilayer type electronic device as set forth in claim 14, further comprising before stacking said green sheets having electrode layers, forming an adhesive layer on the surface of said green sheet having electrode layers opposite to the electrode layer side and stacking said green sheets having electrode layers through said adhesive layers.