REPAIR INSTRUCTION DEVICE AND REPAIR INSTRUCTION METHOD

CROSS-REFERENCE TO RELATED APPLICATION

The present application claims priority from Japanese application JP 2024-002679, filed on Jan. 11, 2024, the content of which is hereby incorporated by reference into this application.

TECHNICAL FIELD
Field of the Invention

The present invention relates to a repair instruction device and a repair instruction method.

Related Art

As a related art of the present technical field, JP2018-145502A (referred to as PTL 1 hereinbelow) and JP2013-2390A (referred to as PTL 2 hereinbelow) disclose a technique related to gel-electroplating. The description of these literatures is included as a part of the specification of the present application.

SUMMARY OF THE INVENTION

However, in the above-described technique, there is a demand for giving an instruction for further appropriate electroplating for a repair target object, such as optimizing positions of a repairing gel and an electrode appropriate for various devices that perform electroplating to the repair target object.

The invention has been made in view of the above circumstances, and an object of the invention is to provide a repair instruction device and a repair instruction method capable of instructing appropriate electroplating for a repair target object.

In order to solve the above problems, a repair instruction device according to the invention includes: a shape measurement unit configured to determine an additional target shape, which is a target shape of plating to be added to a repair target portion, by measuring a shape of the repair target portion in a repair target object; a current distribution prediction unit configured to assume a gel material for electroplating to be applied to the repair target portion and an electrode, and calculate a current distribution at the repair target portion based on a distance between the assumed electrode and each part of the repair target portion and volume resistivity of the assumed gel material; a repair design unit configured to determine shapes of the gel material and the electrode based on the additional target shape and the current distribution; a repair disposition position instruction unit configured to determine positions of the gel material and the electrode based on the additional target shape and the current distribution; a repair condition instruction unit configured to determine a current value and an impressing time of a current to be supplied to the repair target portion via the electrode based on the additional target shape and the calculated current distribution; and an output unit configured to output an electroplating application condition including the shapes of the gel material and the electrode, the positions of the gel material and the electrode, the current value, and the impressing time.

According to the invention, it is possible to give an instruction for appropriate electroplating for the repair target object.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a block diagram of a plating repair system according to a first embodiment;

FIG. 2 is a schematic side view of a repair target object and the like in the first embodiment;

FIG. 3 is a schematic diagram showing an operation of a repair condition instruction unit;

FIG. 4 is a flowchart of a repair instruction routine executed by a repair instruction device in the first embodiment;

FIG. 5 is a diagram showing an example of a repair possibility input screen displayed on a reception unit;

FIG. 6 is a schematic side view of a repair target object and the like in a second embodiment;

FIG. 7 is another schematic side view of the repair target object and the like in the second embodiment;

FIG. 8 is a schematic side view of the repair target object in the middle of a repair in the second embodiment; and

FIG. 9 is a flowchart of a repair instruction routine executed by a repair instruction device in the second embodiment.

DESCRIPTION OF EMBODIMENTS
Overview of Embodiments

In order to ensure environmental problems and resources, there is a demand for long life of industrial products and product regeneration by repair techniques for the purpose of reducing waste and saving resources. In particular, in metal products, a repair is often required when a local defect occurs due to wear, deformation, corrosion, or the like. The repair includes melting metal and filling a damaged portion with the metal with build-up, or plating. Although the build-up is widely used, it is necessary to consider deformation due to heat particularly in a portion where a precise dimension is required, and there is a possibility that correction thereof takes a lot of work steps.

On the one hand, with electroplating, a repair amount can be adjusted depending on an immersion time in a plating solution, a condition and time of applying a current, and since an application temperature is low, it is possible to repair a precise portion without considering thermal deformation. On the other hand, in order to perform a local repair, it is necessary to perform a procedure of masking a target portion, electroplating, and then removing the mask, which is not desirable in terms of labor costs.

Therefore, a plating technique capable of reducing a use frequency of the mask is desired, and gel-electroplating can be a solution to this problem.

The gel-electroplating is a technique for performing electroplating using a gel containing a plating component, an electrode for passing a current through the gel, and a power supply for passing a current through the electrode. That is, it is possible to limit a plating range without masking by attaching, to a repair target portion, a gel having a certain hardness that conforms to a shape of the repair target portion and does not deform so much during work. A repair amount can be adjusted by limiting an amount of plating depending on a plating component amount contained in the gel or a thickness of the gel. When electroplating is applied by flowing a current, it is possible to increase a resistance component by adjusting the thickness of the gel, and to adjust a repair speed or a repair amount by adjusting a plating speed.

When the technique in PTL 1 described above is applied, it is considered that a supply of a plating component and a plating speed can be increased using a gel and a plating solution. However, PTL 1 does not particularly refer to a disposition position and a disposition method of the gel. When the technique in PTL 2 is applied, it is considered that it is possible to indicate a plating position and to use data using an augmented reality (AR), but PTL 2 does not describe a method of determining a specific position. Therefore, it is desired to define an instruction method for applying appropriate electroplating to an appropriate position. In order to determine an appropriate gel disposition position and an appropriate gel shape, it is considered necessary to grasp a shape of a repair position. Therefore, embodiments described later provide a repair instruction system that determines a film thickness and a disposition position of gel-electroplating and an electroplating application condition for optimizing a repair of industrial products.

Among industrial products, metal products deteriorate compared with performance at the start of use or lose functions due to damage or deformation caused by wear or corrosion. The performance can be recovered by repairing the damage or deformation causing the performance deterioration described above. In order to repair the repair target portion, it is preferable to perform an optimum application at an optimum position. However, in order to provide an optimum repair for a shape of the damage with a minimum amount of labor, strict control and time are required, and it often depends on know-how of an engineer. When it takes time to repair a repair part, a time loss in a manufacturing activity or the like is caused for a part user as well. Further, when a repairing method is not optimized, electric power and a plating solution at the time of repairing are excessively consumed, which may be a burden on an environment. Therefore, the present inventors have studied a combination of gel-electroplating to achieve a local repair and a system that measures a current shape to optimally process a gel and provide the gel, and the present inventors have come up with the embodiments to be described later.

First Embodiment

FIG. 1 is a block diagram of a plating repair system PS according to a first embodiment.

The repair system PS includes a repair instruction device 1 (computer) and an electroplating application device 60. For example, a repair target object 20 that is a metal product has a repair target portion 21 such as a scratch. More specifically, the repair target object 20 is, for example, a finished product having a sliding portion such as a compressor or a rotating machine, a sliding part such as a gear or a cylinder, or a metal product placed in a corrosive environment.

The electroplating application device 60 is a device that performs a repair by gel-electroplating on the repair target object 20 by causing a current to flow through the repair target object 20 via a gel material 102 for electroplating and an electrode 103 for electroplating. The electroplating application device 60 performs a repair by electroplating, and requires a current to flow through the electrode 103, the gel material 102, and the repair target object 20.

Therefore, the electroplating application device 60 includes an impressing device 62. The impressing device 62 performs electroplating on the repair target object 20 by energizing the electrode 103, the gel material 102, and the repair target object 20 with a current based on a designated current value PI and impressing time PT (details will be described later).

The repair instruction device 1 is a device that issues various instructions to the electroplating application device 60, and includes a general computer hardware. That is, the repair instruction device 1 includes a computing unit 160, a storage unit 130, a reception unit 140, and an output unit 150.

The reception unit 140 includes an input device (not shown) such as a keyboard, a mouse, or a touch panel that receives an input from a user, and a display or a speaker (not shown) that displays various types of information to the user. Accordingly, the reception unit 140 inputs various data to the computing unit 160 based on an operation of the user on the input device. Input data includes mechanical properties, chemical properties, required life, and the like required for the repair target object 20 after the repair. The output unit 150 outputs an electroplating application condition SA to the electroplating application device 60.

The storage unit 130 stores data input from the reception unit 140, and stores an electrochemical database SD, an electrochemical characteristic database SF, and an electroplating condition database ED. The electrochemical database SD stores a current distribution or the like when the gel material 102 and the electrode 103 having various shapes are applied to various repair target objects 20 and repair target portions 21 having various shapes. The stored current distribution is obtained by pre-simulation or experimental data. The electrochemical characteristic database SF and the electroplating condition database ED will be described later. The storage unit 130 is a non-transitory or temporary storage medium, and is, for example, a read only memory (ROM), a random access memory (RAM), a hard disk drive (HDD), or a flash memory.

The computing unit 160 includes a shape measurement unit 10, a current distribution prediction unit 11, a repair design unit 12, a repair disposition position instruction unit 13, and a repair condition instruction unit 14. The components of the computing unit 160 are functions implemented by a program or the like.

The shape measurement unit 10 measures the repair target portion 21 and outputs repair target portion information AR indicating a shape and position of the repair target portion 21. Further, the shape measurement unit 10 outputs an additional target shape SP that is a target shape of plating added to repair the repair target portion information AR. The shape measurement unit 10 also has a function of measuring a shape of the repair target object 20 after the repair of the repair target portion 21 and inspecting whether a processing tolerance of the repair target object 20 is within a predetermined allowable range. For example, when the electroplating application device 60 repairs the repair target object 20 so that a processing tolerance is within a range of a processing tolerance of the repair target object 20 when the repair target object 20 is originally manufactured, the shape measurement unit 10 can determine that the repair target object 20 passes an inspection.

The current distribution prediction unit 11 assumes conditions such as the shapes and positions of the gel material 102 and the electrode 103 based on the electrochemical database SD, and predicts a current distribution in the assumed conditions. That is, the current distribution prediction unit 11 calculates a current distribution in each part of the gel material 102 and the repair target portion 21 based on an assumed distance between the electrode 103 and each part of the repair target portion 21 and assumed volume resistivity of the gel material 102.

When the current distribution predicted by the current distribution prediction unit 11 is appropriate, the repair design unit 12 determines whether the gel material 102 has a physical requirement that can cope with an electroplating process. Here, a case where the current distribution is “appropriate” means that a current variation in each part of the gel material 102 is uniform and falls within a predetermined range. The physical requirement includes that.

- the gel material 102 can maintain the shape based on strength and shear strength of the gel material 102,
- adhesion of the gel material 102 to the repair target portion 21 can be ensured, and
- adhesion of the gel material 102 to the electrode 103 can be ensured.

When the current distribution is appropriate and the gel material 102 has the physical requirement, the repair design unit 12 adopts assumed shapes of the gel material 102 and the electrode 103 as shapes of the gel material 102 and the electrode 103 that are actually applied. The repair design unit 12 outputs gel shape information GS indicating the shape of the gel material 102 that is actually applied and electrode shape information ES indicating the shape of the electrode 103 that is actually applied.

When the current distribution predicted by the current distribution prediction unit 11 is appropriate and the gel material 102 has the above-described physical requirement, the repair disposition position instruction unit 13 adopts assumed positions of the gel material 102 and the electrode 103 as positions of the gel material 102 and the electrode 103 that are actually applied. The repair disposition position instruction unit 13 outputs gel position information GP indicating a disposition position of the gel material 102 that is actually applied and electrode position information EP indicating a disposition position of the electrode 103 that is actually applied.

The repair condition instruction unit 14 outputs the current value PI, the impressing time PT, and an additional operation instruction SB (details will be described later) for achieving an appropriate current distribution in the gel material 102. Instead of the current value PI, a voltage value PV (not shown) applied to the electrode 103 may be output.

In an example in FIG. 2, one gel material 102 and one electrode 103 are provided, but a plurality of gel materials 102 and a plurality of electrodes 103 may be provided. When a plurality of gel materials 102 and electrodes 103 are simultaneously applied to an electroplating process, the repair disposition position instruction unit 13 determines the gel position information GP and the electrode position information EP so that the plurality of gel materials 102 and electrodes 103 do not interfere with each other.

When a plurality of electrodes 103 are formed, the repair condition instruction unit 14 may output a different current value PI (or voltage value PV) and a different impressing time PT for each electrode 103. The electroplating application condition SA output to the electroplating application device 60 by the output unit 150 includes the above-described information AR, SP, GS, ES, GP, EP, the current value PI (or the voltage value PV), the impressing time PT, and the additional operation instruction SB.

FIG. 2 is a schematic side view of the repair target object 20 and the like in the first embodiment.

As described above, the repair target object 20 has the repair target portion 21 that is a damaged portion recessed on an upper surface thereof. The above-described shape measurement unit 10 (see FIG. 1) determines the additional target shape SP for the repair target object 20, which represents a shape of a portion to be plated. The additional target shape SP is, for example, a portion indicated by a dashed-dotted line. In the illustrated example, the additional target shape SP is a shape in which an upper surface thereof matches the upper surface of the repair target object 20 and with which the repair target portion 21 is completely filled.

In other words, the additional target shape SP is a shape with which the repair target portion 21 is filled to smooth a surface of the repair target object 20. However, the additional target shape SP is not necessarily limited to a shape with which the repair target portion 21 is completely filled. For example, as long as there is no problem in performance of the repair target object 20, the additional target shape SP may include some voids CV.

Thus, the repair instruction device 1 determines the electroplating application condition SA including the shape of the gel material 102, the shape of the electrode 103, the impressing time, and the like for achieving the additional target shape SP. The electroplating application device 60 produces the gel material 102 and the electrode 103 based on the electroplating application condition SA determined by the repair instruction device 1, and forms an assembly 120 in which the gel material 102 and the electrode 103 are integrated. The electroplating application device 60 attaches the assembly 120 to the repair target object 20, and flows a current between the assembly 120 and the repair target object 20 to repair the repair target object 20.

Returning to FIG. 1, the shape measurement unit 10 acquires the repair target portion information AR representing a detailed three-dimensional shape of the repair target portion 21 by performing physical measurement such as optical measurement or stylus measurement, or by analyzing image data. However, instead of the detailed three-dimensional shape, a depth of the repair target portion 21, a width of an opening, a length of the opening, and the like may be set as the repair target portion information AR. The shape measurement unit 10 may acquire the shape of the repair target object 20 by machine learning or the like based on image data obtained by imaging the repair target object 20, and set a result as the repair target portion information AR. That is, the repair target portion information AR does not necessarily need to be highly accurate, and it is sufficient to output the repair target portion information AR in a range that satisfies functional requirements of a final product, such as measurement using a gap gauge and clearance during fitting.

As described above, the electrochemical database SD stores a current distribution or the like when the gel material 102 and the electrode 103 having various shapes are applied to various repair target objects 20 and repair target portions 21 having various shapes. In other words, the electrochemical database SD stores a plurality of records, and one record includes a combination of the above-described information AR, SP, GS, ES, GP, and EP and a corresponding current distribution.

Although not shown, information in one record of the electrochemical database SD is called repair target portion accumulation information ARB, additional target shape accumulation information SPB, gel shape accumulation information GSB, electrode shape accumulation information ESB, gel position accumulation information GPB, electrode position accumulation information EPB, and current distribution accumulation information CDB.

The current distribution prediction unit 11 refers to the electrochemical database SD based on a two-dimensional aspect ratio and a three-dimensional shape of the repair target portion information AR and the additional target shape SP. That is, the current distribution prediction unit 11 acquires various kinds of accumulation information described above from the electrochemical database SD based on the repair target portion information AR and the additional target shape SP. However, in the repair target portion accumulation information ARB and the additional target shape accumulation information SPB accumulated in the electrochemical database SD, there is generally no information that completely matches the repair target portion information AR and the additional target shape SP obtained by measurement.

Accordingly, in general, the accumulation information GSB, ESB, GPB, and EPB in any record cannot be directly applied as the gel shape information GS, the electrode shape information ES, the gel position information GP, and the electrode position information EP. Therefore, the repair design unit 12 and the repair disposition position instruction unit 13 (see FIG. 1) may determine the information GS, ES, GP, and EP according to a correlation ratio between the additional target shape SP and the additional target shape accumulation information SPB.

The electrochemical characteristic database SF (see FIG. 1) stored in the storage unit 130 is a data group representing a plating component of the gel material 102 and electrochemical characteristics of the repair target object 20, and includes the following data.

- Measurement results of anode polarization characteristics, cathode polarization characteristics, and other potentiodynamic polarization characteristics of the gel material 102,
- Formation results of plating during constant potential and constant current polarization of the gel material 102, and
- Resistivity of the gel material 102.

The current distribution prediction unit 11 predicts a current distribution in the gel material 102 based on the electrochemical characteristic database SF and the additional target shape SP. The repair design unit 12 calculates a plating repair amount SPTV, which is a volume of plating to be added, based on the additional target shape SP. Next, the repair design unit 12 calculates a plating component amount required to achieve the additional target shape SP, based on the plating repair amount SPTV. Next, the repair design unit 12 determines the gel shape information GS such as a thickness of the gel material 102 based on the calculated plating component amount.

As an example, in a case of nickel plating, it is preferable to set a shape with which the entire repair target portion information AR is filled as the additional target shape SP, calculate an amount of nickel required to achieve the additional target shape SP, and determine the thickness of the gel material 102 in accordance with a plating bath component input by an operator. The thickness is preferably determined to be 3 mm or more in consideration of a possibility that the gel may be deformed by heat of reaction.

The electrochemical characteristic database SF stores data corresponding to various plating components, various bath types, and various thickeners applied to the gel material 102. For example, when nickel plating is adopted, a Watts bath, a Wood's bath, a sulfamic acid bath, or the like can be used as the bath type. As the thickener, gelatin, agar, xanthan gum, locust bean gum, and the like can be applied.

The gel material 102 contains a plating component whose film after plating satisfies required parameters such as hardness, corrosion resistance, wear resistance, and thermal conductivity. Specifically, the gel material 102 contains a plating component for performing wet plating, such as Cr, Ni, Cu, Ag, Zn, and Al.

Further, the gel material 102 contains a gelling material such as gelatin, agar, and locust bean gum, a gel hardness regulator such as KCl, and an electrolyte component such as Na₂SO₄for adjusting conductivity. As the gelling material, a material that does not have fluidity at a plating temperature and maintains a shape may be selected. However, it is not always necessary for the gel material 102 to maintain the shape by itself, and the gel material 102 may be a material capable of maintaining the shape by conforming to a shape of the electrode 103 or a gap therebetween.

For the purpose of preventing generation of hydrogen and improving gel hardening and a scratch filling property, it is also possible to add a commercially available leveling material, a gloss material, thiourea, saccharin, or the like to the gel material 102.

The electrode 103 may be an insoluble electrode or a soluble electrode. As the insoluble electrode, an electrochemically stable electrode such as platinum, platinized titanium, gold, or iridium oxide can be used. As the soluble electrode, in order to supply a plating component into the gel material 102, nickel in a case of nickel plating, copper in a case of copper plating, and pure silver metal in a case of silver plating can be used. Although an alloy may be used, in this case, it is necessary to consider physical properties of repair plating including elution of alloy elements. A shape of the electrode can be freely selected from a plate, a foil, and a mesh, but in the case of a mesh, since a current distribution changes according to a shape of the mesh, it is preferable to check the current distribution with data in the electrochemical database SD.

In particular, in a case of the soluble electrode, the electrode 103 is required to have a volume equal to or larger than a plating current due to a shape and thickness of the electrode. Therefore, the repair design unit 12 may determine the thickness of the electrode 103 according to an impressing time based on the calculated plating repair amount SPTV and the electrochemical database SD.

The repair condition instruction unit 14 calculates a charge amount for reducing and depositing a plating component amount that achieves the additional target shape SP, based on the gel shape information GS and the electrode shape information ES. Next, the repair condition instruction unit 14 determines and outputs the current value PI and the impressing time PT in consideration of plating inhibition factors stored in the electrochemical database SD and the electrochemical characteristic database SF, heat generation due to electrical resistance, and the like with respect to the calculated charge amount. The plating inhibition factor includes plating current efficiency and an amount of hydrogen gas generated by electrolysis.

FIG. 3 is a schematic diagram showing an operation of the repair condition instruction unit 14.

As described above, the shape measurement unit 10 outputs the additional target shape SP, and the repair design unit 12 outputs the plating repair amount SPTV indicating a volume of the plating to be added. The user determines a plating bath type EB in consideration of physical properties of the repair target object 20 and a use environment, and inputs the plating bath type EB from the reception unit 140. The repair condition instruction unit 14 calculates a charge amount required when the plating bath type EB is used. The current value PI and the impressing time PT are determined and output according to the charge amount. Here, depending on the plating bath type EB, gas may stay at an interface between the gel material 102 and the repair target object 20 upon gelation, and a failure may occur in plating.

Depending on a type of the thickener used for the gel material 102, when a current value is large, resistance heat generation may cause the gel to deform or melt as a temperature of the gel rises. As a countermeasure, it is conceivable to reduce the current value PI. However, it is not desirable that the impressing time PT becomes excessively long. Thus, the repair condition instruction unit 14 determines the current value PI and the impressing time PT so as to prevent generation of hydrogen and deformation of the gel.

The electroplating condition database ED stored in the storage unit 130 (see FIG. 1) stores data such as an amount of hydrogen generated and an amount of heat generated during plating. The electroplating condition database ED may be configured based on an application record at the time of actual plating, data of a sample test for achieving the additional target shape SP by plating, a physical property measurement result of the gel material 102, or the like.

By referring to the electroplating condition database ED, the repair condition instruction unit 14 determines the current value PI and the impressing time PT in which hydrogen generation and thermal deformation of the gel material 102 are as small as possible and a plating time is short. Here, the electroplating process is preferably completed in a single plating application. However, depending on the additional target shape SP, plating may not be sufficiently performed by one gel-electroplating application. For example, gas may be expected to accumulate between the gel material 102 and the repair target portion 21, or the gel material 102 may be expected to be deformed depending on a temperature of the gel material 102. In such a case, it is preferable to perform an additional operation such as replacing the gel material 102, moving the gel material 102 to allow for degassing at an interface, and cooling the gel material 102. A need for these additional operations depends on the additional target shape SP and the plating repair amount SPTV. Therefore, the repair condition instruction unit 14 outputs the additional operation instruction SB when such an additional operation is required. Thus, in the present embodiment, since an electroplating condition can be optimized, an electroplating processing time can also be optimized. Even for a user of a repair component, a time loss due to a missing component can be reduced by shortening a repair time. Further, by optimizing the electroplating condition, a burden on an environment can be reduced without consuming extra power.

Operation of First Embodiment

Next, an operation of the present embodiment will be described.

FIG. 4 is a flowchart of a repair instruction routine executed by the repair instruction device 1 in the first embodiment.

When a process is started in FIG. 4, processes of steps S2 and S4 are executed in parallel. First, in step S2, the shape measurement unit 10 measures shapes of the repair target object 20 and the repair target portion 21, and the shape measurement unit 10 outputs the repair target portion information AR and the additional target shape SP as results. At the same time, in step S4, a user inputs a gel component, a plating bath type EB, and the like having physical properties suitable for the repair target object 20 via the reception unit 140. The physical properties at this time indicate physical properties such as hardness and wear resistance, and chemical properties such as corrosion resistance. The physical properties relate to a product life and product performance.

Next, when the process proceeds to step S6, the repair design unit 12 executes a gel shape determination process. That is, the repair design unit 12 inquires of the electrochemical database SD based on output shape data. Based on an inquiry result, the repair design unit 12 determines an optimum shape of the gel material 102 to achieve the additional target shape SP, that is, the gel shape information GS.

Next, when the process proceeds to step S8, the repair disposition position instruction unit 13 executes a gel disposition position determination process. That is, the repair design unit 12 determines the gel position information GP that is a disposition position of the gel material 102 so that the additional target shape SP can be achieved based on a current distribution of each part.

As shown in FIG. 2, the additional target shape SP does not necessarily have to be a shape with which the entire repair target portion 21 is filled, and the void CV may be formed inside. That is, as long as a functional requirement such as strength and durability of the repair target object 20 are satisfied, the additional target shape SP including the void CV therein may be determined. When the additional target shape SP includes the void CV, the gel shape information GS and the gel position information GP may be determined so as to use a smaller amount of the gel material 102 than an amount of the gel material 102 with which the entire repair target portion 21 is filled. In other words, at this time, conditions such as “functional requirements required for the repair target object 20 are met” and “adhesiveness between the repair target object 20 and the plating is high and damage such as peeling does not occur” are satisfied.

The functional requirements required when repairing the repair target portion 21 indicate physical properties or chemical properties that withstand use during an expected life of the repair target object 20 or a use period of the repair target object 20 before a repair. For example, in a case of repairing a sliding portion of the repair target object 20, even if the void CV (see FIG. 2) exists in the additional target shape SP, an upper portion thereof may not be deformed, and the repair target object 20 may be operated until a next inspection or a designed product life.

Therefore, the repair instruction device 1 determines a plating film thickness in consideration of hardness that does not damage a counterpart member (not shown) of the repair target object 20 or (in a case of wear on the device itself) a wear amount of the repair target object 20 corresponding to the product life, and reflects the determined plating film thickness in the current value PI and the impressing time PT. Accordingly, the output unit 150 outputs the electroplating application condition SA including the current value PI and the impressing time PT to the electroplating application device 60.

For actual processing and disposition of the gel material 102, a direct application to the repair target object 20 using a dispenser (not shown) can be adopted. At this time, the gel material 102 processed into a shape determined by the gel shape information GS may be attached to a position designated by the gel position information GP. At this time, if a peripheral device required for cooling, position fixing, and the like exists, the peripheral device may be provided around the gel material 102.

Next, when the process proceeds to step S10, the repair design unit 12 determines a shape of the electrode 103 and outputs a result as the electrode shape information ES. The electrode shape information ES is constrained by the gel shape information GS. The repair design unit 12 determines a shape of the electrode 103 so as to achieve a desired current distribution. The gel shape information GS includes a distance between the electrode 103 and the repair target object 20, a shape of the electrode 103, and the like. At this time, the electrode 103 is provided outside the gel material 102 as an energizing point.

When priority is given to achieving the current distribution for the electrode position information EP, a plating component amount in the gel material 102 between the electrode 103 and the repair target object 20 may be insufficient to achieve the additional target shape SP. In this case, it is conceivable to use the electrode 103 as a soluble electrode to supply necessary ions. The gel material 102 may be provided not between the repair target object 20 and the electrode 103 but on an opposite side of the electrode 103 for replenishing the plating component. A size of the gel material 102 required for electroplating at this time is limited by the gel shape information GS determined in step S6. A shape of the electrode 103 when the gel material 102 is provided to replenish the plating component is preferably a mesh shape, a sponge shape, or the like so that the gel material 102 is continuous and ion diffusion is not hindered.

The electrode 103 preferably has a shape that conforms to the shape of the repair target object 20. For example, in order for the electrode 103 to sufficiently conform to a curvature surface, it is desirable that the electrode 103 is as thin as possible while maintaining strength for holding a weight of the gel material 102.

Next, when the process proceeds to step S12, the repair disposition position instruction unit 13 determines and outputs the electrode position information EP. Similar to the electrode shape information ES, the electrode position information EP is constrained by the gel position information GP. The repair disposition position instruction unit 13 determines the electrode position information EP so that a current is basically uniform with respect to the additional target shape SP.

On the other hand, there may be a case where a local repair is particularly required in the additional target shape SP, for example, when a bottom portion of the additional target shape SP has an acute angle. In such a case, the electrode 103 is provided at a position where an outermost surface of a final repair shape becomes smooth and an inside is repaired to an extent that performance or a life required for the repair target object 20 is satisfied.

Next, when the process proceeds to step S14, the repair condition instruction unit 14 determines a current condition, that is, the current value PI and the impressing time PT. At this time, the repair condition instruction unit 14 determines the current value PI and the impressing time PT that can sufficiently achieve the additional target shape SP in accordance with the gel shape information GS, the gel position information GP, the electrode shape information ES, and the electrode position information EP.

At the time of determination, the current value PI and the impressing time PT that allow a sufficient plating repair up to the plating repair amount SPTV are selected using the physical properties of the gel material 102 and the amount of hydrogen generated recorded in the electroplating condition database ED. When it is considered that this condition cannot be achieved at room temperature, measures other than electrical measures may be taken, such as heating the gel material 102 and the repair target object 20 to increase temperatures.

Next, when the process proceeds to step S16, the repair condition instruction unit 14 executes an additional operation determination process. First, the repair condition instruction unit 14 determines whether an additional operation is necessary. Here, if it is determined that the additional operation is unnecessary, step S16 immediately ends. On the other hand, if it is determined that the additional operation is necessary, the repair condition instruction unit 14 outputs the additional operation instruction SB. For example, the repair condition instruction unit 14 outputs the additional operation instruction SB when the target plating repair amount SPTV cannot be achieved in one plating operation.

In a repair operation using the gel material 102, unlike normal wet plating, hydrogen gas may stay at an interface between the gel material 102 and the repair target object 20. When electrical contact between the gel material 102 and the repair target object 20 is interrupted due to the stay of the hydrogen gas, a plating reaction is stopped. This is because an amount of hydrogen gas diffused into the gel material 102 is small. However, the hydrogen gas can be physically allowed to release. When heat generated by the gel material 102 is

large, the electroplating process may be hindered by the heat generation. Therefore, the additional operation instruction SB is an instruction for an additional operation for releasing heat or gas, such as replacing the gel material 102 or sliding the gel material 102 and the repair target object 20, at a time point at which a predetermined amount of hydrogen gas is predicted to stay or at a time point at which a temperature of the gel material 102 is predicted to reach a predetermined temperature.

Next, when the process proceeds to step S18, a repair possibility input screen 50 (see FIG. 5) is displayed on a display of the reception unit 140, and it is determined whether the repair is permitted by the user on this screen. Here, if “No” is determined, the process returns to step S4. Accordingly, when the user changes the gel component, the plating bath type EB, and the like, the processes of steps S4 to S18 are repeated based on a new gel component, plating bath type EB, and the like.

On the other hand, if “Yes” is determined in step S18, the process proceeds to step S20, and an electroplating application process is executed. That is, the repair instruction device 1 outputs the electroplating application condition SA to the electroplating application device 60 via the output unit 150 and instructs the electroplating application device 60 to execute plating. Accordingly, in the electroplating application device 60, plating is performed on the repair target object 20. Thus, the process of this routine ends.

FIG. 5 is a diagram showing an example of the repair possibility input screen 50 displayed on the reception unit 140.

The repair possibility input screen 50 includes a repair assumption diagram display unit 52, an electroplating application condition display unit 53, a Yes button 56, and a No button 57. The repair assumption diagram display unit 52 displays a schematic diagram of the gel material 102, the electrode 103, and the repair target object 20 shown in FIG. 2.

The electroplating application condition display unit 53 displays contents of the electroplating application conditions SA. If the user agrees with contents shown in the repair assumption diagram display unit 52 and the electroplating application condition display unit 53, the user clicks the Yes button 56. Accordingly, as described in step S20 in FIG. 4, the electroplating application device 60 executes the electroplating application process.

On the other hand, if the user does not agree with the contents shown in the repair assumption diagram display unit 52 and the electroplating application condition display unit 53, the user clicks the No button 57. Accordingly, as described with reference to FIG. 4, the processes after step S4 are executed again.

Second Embodiment

Next, a second embodiment will be described.

A configuration of the second embodiment is similar as that of the first embodiment (see FIGS. 1 and 3).

FIG. 6 is a schematic side view of the repair target object 20 and the like in the second embodiment.

In FIG. 6, a stepwise repair target portion 21 is formed at a corner of the repair target object 20. An additional target shape SP2 has a complex shape with which the stepwise repair target portion 21 is filled and a corner is restored. For such an additional target shape SP2, a sufficient repair may not be achieved by one plating process, and the repair may be achieved by a plurality of plating processes.

As shown in FIG. 6, when the additional target shape SP2 is located at an end portion of the repair target object 20, it may be difficult to fix disposition positions of the gel material 102 and the electrode 103. That is, when the additional target shape SP2 in which the gel material 102 has a complex shape is achieved by plating once, an assumed gel shape and disposition position may not be held during work, and an appropriate repair may not be achieved. Therefore, a plurality of repairs are required regardless of generation of hydrogen gas. Therefore, it may be preferable that a shape related to the additional target shape SP2 is divided into a plurality of shapes that can be sufficiently repaired once, and shapes and disposition positions of the gel material and the electrode are determined for the divided additional target shape SP2.

FIG. 7 is another schematic side view of the repair target object 20 and the like in the second embodiment.

In the present embodiment, when it is determined that it is difficult to achieve, by plating once, the additional target shape SP2 obtained by measuring the repair target portion 21, the shape related to the additional target shape SP2 is divided into a plurality of shapes. For example, as illustrated, the additional target shape SP2 is divided into a plurality of partial target shapes SP2-1 and SP2-2. Gel materials 102-1 and 102-2 and electrodes 103-1 and 103-2 are formed corresponding to the partial target shapes SP2-1 and SP2-2.

The electroplating application device 60 executes a plurality of plating processes on the repair target object 20 to sequentially achieve the partial target shapes SP2-1 and SP2-2. At that time, a plurality of gel materials and electrodes to be provided do not have to be provided simultaneously. In the example in FIG. 7, first, the gel material 102-1 and the electrode 103-1 may be provided and an electroplating process may be executed, and then the gel material 102-2 and the electrode 103-2 may be provided and an electroplating process may be executed.

In other words, the repair disposition position instruction unit 13 according to the present embodiment determines processes at a plurality of stages to provide the gel materials 102-1 and 102-2 and the electrodes 103-1 and 103-2 different for each of the stages. In particular, when a large repair is required at a predetermined portion of the repair target portion 21, shapes and positions of the gel materials 102-1 and 102-2 and the electrodes 103-1 and 103-2 may be determined so as to concentrate a current at the predetermined portion.

FIG. 8 is a schematic side view of the repair target object 20 in the middle of a repair in the second embodiment.

It is assumed that the electroplating process is executed on the repair target object 20 by the gel material 102-1 and the electrode 103-1 shown in FIG. 7, and as a result, a repaired portion TP shown in FIG. 8 is formed. Thereafter, the gel material 102-2 and the electrode 103-2 may be provided and an electroplating process corresponding to the partial target shape SP2-2 may be executed. In an example in FIG. 8, a posture of the repair target object 20 is not changed when only the gel material 102-2 is provided after the repaired portion TP is formed, but the posture or a disposition method of the repair target object 20 may be changed so that disposition of the gel material 102-2 is stable. A state of the repaired portion TP may be measured again, and the shape and the disposition method of the gel material 102-2 may be determined based on a result of the remeasurement.

FIG. 9 is a flowchart of a repair instruction routine executed by the repair instruction device 1 in the second embodiment.

When a process is started in FIG. 9, processes of steps S2 and S4 are executed in parallel. Processing contents are similar as those of the first embodiment (see FIG. 4). That is, in step S2, the repair target portion information AR and the additional target shape SP2 are output from the shape measurement unit 10, and in step S4, a user inputs a gel component, the plating bath type EB, and the like.

Next, in steps S6 to S12, for example, similar processes as in the first embodiment are executed on the gel material 102 and the electrode 103 shown in FIG. 6. That is, for the gel material 102, the repair design unit 12 determines the gel shape information GS in step S6, and the repair disposition position instruction unit 13 determines the gel position information GP in step S8. For the electrode 103, the repair design unit 12 determines the electrode shape information ES in step S10, and the repair disposition position instruction unit 13 determines the electrode position information EP in step S12.

Next, when the process proceeds to step S13, the computing unit 160 determines whether the repair target object 20 can be sufficiently repaired by one plating process, that is, whether a content of the additional target shape SP2 can be sufficiently achieved.

More specifically, in step S13, the computing unit 160 checks whether the gel material 102 sufficiently conforms to the additional target shape SP2, or by referring to jelly strength and shear strength, checks whether the gel material 102 is damaged. Even when the gel material 102 can conform to the additional target shape SP2, adhesion between the gel material 102 and the electrode 103 cannot be guaranteed, and the gel material 102 and the electrode 103 may be separated from each other. In step S13, it is also checked whether such separation occurs.

For example, in a state in FIG. 6, when the computing unit 160 determines that damage to the gel material 102, the separation of the gel material 102 and the electrode 103, or the like is within an allowable range, “Yes” is determined in step S13, and the process proceeds to step S14. In this case, processes of steps S14 to S20 are executed as in the first embodiment. Accordingly, if “Yes” is determined in step S18 (if execution is permitted), the electroplating application device 60 performs plating on the repair target object 20 using the gel material 102 and the electrode 103 (see FIG. 6), similarly to the first embodiment.

On the other hand, if “No” is determined in step S13, the process proceeds to step S36, and the repair design unit 12 executes a gel shape determination process. Here, first, the repair design unit 12 divides the additional target shape SP2 into a plurality of partial target shapes. For example, the additional target shape SP2 is divided into the partial target shapes SP2-1 and SP2-2 shown in FIG. 7.

At this time, the repair design unit 12 performs a determination in the same manner as in step S13 described above regarding whether each partial target shape is achievable, and determines the achievable partial target shape as the partial target shape to be adopted. Next, the repair design unit 12 determines the gel shape information GS corresponding to the plurality of partial target shapes. For example, when the partial target shapes SP2-1 and SP2-2 shown in FIG. 7 are adopted, the gel shape information GS may include partial gel shape information GS-1 and GS-2 (not shown) for specifying shapes of the gel materials 102-1 and 102-2.

Next, when the process proceeds to step S38, the repair disposition position instruction unit 13 determines the gel position information GP corresponding to the plurality of partial target shapes. In the example shown in FIG. 7, the gel position information GP may include partial gel position information GP-1 and GP-2 (not shown) of the gel materials 102-1 and 102-2. As described above, when the gel material 102-2 is applied after the gel material 102-1 is applied, the posture of the repair target object 20 may be changed.

Next, when the process proceeds to step S40, the repair design unit 12 determines and outputs the electrode shape information ES related to a plurality of electrodes corresponding to the plurality of gel materials. In the example shown in FIG. 7, the electrode shape information ES may include partial electrode shape information ES-1 and ES-2 (not shown), which are shapes of the corresponding electrodes 103-1 and 103-2, for the gel materials 102-1 and 102-2.

The shapes of the electrodes 103-1 and 103-2 are constrained by the shapes of the gel materials 102-1 and 102-2, but when partial current values PI-1 and PI-2 (not shown) and partial impressing times PT-1 and PT-2 (not shown) to be described later match, the electrodes 103-1 and 103-2 may be integrated.

Next, when the process proceeds to step S42, the repair disposition position instruction unit 13 determines the electrode position information EP designating positions of the plurality of electrodes. In the example shown in FIG. 7, the electrode position information EP may include partial electrode position information EP-1 and EP-2 (not shown) designating positions of the electrodes 103-1 and 103-2.

When there is a possibility that the electrodes 103-1 and 103-2 interfere with each other in the electrode position information EP-1 and EP-2, the electroplating process may be divided. That is, as described above, first, the gel material 102-1 and the electrode 103-1 may be provided and an electroplating process may be executed, and then the gel material 102-2 and the electrode 103-2 may be provided and an electroplating process may be executed.

Next, when the process proceeds to step S44, the repair condition instruction unit 14 determines a current condition, that is, the current value PI and the impressing time PT so as to execute a plurality of the electroplating processes corresponding to the plurality of electrodes. In the example shown in FIG. 7, the current value PI may include the partial current values PI-1 and PI-2 designating currents supplied to the electrodes 103-1 and 103-2. The impressing time PT may include the partial impressing times PT-1 and PT-2 designating impressing times for the electrodes 103-1 and 103-2.

Next, when the process proceeds to step S46, the repair condition instruction unit 14 executes an additional operation determination process. First, the repair condition instruction unit 14 determines whether an additional operation is necessary. Here, if it is determined that the additional operation is unnecessary, step S46 immediately ends. On the other hand, if it is determined that the additional operation is necessary, the repair condition instruction unit 14 outputs the additional operation instruction SB. For example, the repair condition instruction unit 14 outputs the additional operation instruction SB when the target plating repair amount SPTV cannot be achieved in one plating operation.

As in the first embodiment, the additional operation instruction SB gives an instruction for an additional process such as releasing hydrogen when it is difficult to achieve plating to a target film thickness. However, a timing of executing the additional process corresponding to the partial target shapes SP2-1 and SP2-2 does not necessarily belong to a period of plating processes of the partial target shapes SP2-1 and SP2-2. For example, after an electroplating process corresponding to the partial target shape SP2-1 is executed, an additional process corresponding to the partial target shape SP2-2 may be executed when the gel material 102-2 corresponding to the partial target shape SP2-2 is provided.

Modification

The invention is not limited to the above-described embodiments, and various modifications are possible. The embodiment described above has been exemplified to describe the invention in an easy-to-understand manner, and the invention is not necessarily limited to including all the described configurations. A part of a configuration of a certain embodiment can be replaced with a configuration of another embodiment, and a configuration of another embodiment can be added to a configuration of a certain embodiment. A part of a configuration of each embodiment can be deleted, or can be added or replaced by another configuration. Control lines and information lines shown in the drawings are considered to be necessary for description, and not all control lines and information lines in a product are necessarily shown. Actually, almost all configurations may be considered to be connected. Modifications that can be made to the above embodiment are as follows, for example.

(1) Since the hardware of the repair instruction device 1 in the embodiment can be achieved by a general computer, the flowchart shown in FIG. 4 or FIG. 9, other programs for executing the various processes described above, and the like may be stored in a storage medium (computer-readable recording medium in which a program is recorded) or may be distributed via a transmission line.

(2) Although the processes shown in FIG. 4 and FIG. 9 and other processes described above are described as software processes using a program in the embodiment, some or all of the processes may be replaced with hardware processes using an application specific integrated circuit (ASIC), a field programmable gate array (FPGA), or the like.

(3) Data in the storage unit 130 such as the electrochemical database SD may be stored in a cloud or the like (not shown) on a network, or may not be in the repair instruction device 1.

(4) The repair instruction device 1 may be used not only to repair the repair target object 20 after use of the repair target object 20, but also to correct a product that deviates from a processing tolerance when the repair target object 20 is originally manufactured and becomes defective. At this time, a repair amount may be determined with reference to the functional requirements required for the repair target object 20 and manufacturing drawing information.

Effects of Embodiment

As described above, according to the above-described embodiment, the repair instruction device 1 includes: the current distribution prediction unit 11 that assumes the gel material 102 for electroplating to be applied to the repair target portion 21 and the electrode 103, and calculates the current distribution at the repair target portion 21 based on the distance between the assumed electrode 103 and each part of the repair target portion 21 and the volume resistivity of the assumed gel material 102; the repair design unit 12 that determines the shapes of the gel material 102 and the electrode 103 based on the additional target shape SP and the current distribution; the repair disposition position instruction unit 13 that determines the positions of the gel material 102 and the electrode 103 based on the additional target shape SP and the current distribution; and the repair condition instruction unit 14 that determines the current value PI and the impressing time PT of the current to be supplied to the repair target portion 21 via the electrode 103 based on the additional target shape SP and the calculated current distribution.

Accordingly, since the shapes and positions of the gel material 102 and the electrode 103 can be determined based on an expected current distribution, an instruction for appropriate electroplating for the repair target object can be given. Since the shape and the disposition position of the gel material 102 and/or a value of a current flowing through the gel material 102 via the electrode 103 can be calculated based on a measured shape, an instruction for appropriate electroplating can be given according to the additional target shape SP.

It is more preferable that the current distribution prediction unit 11 calculates the current distribution at the repair target portion 21 based on the electrochemical database SD that stores a plurality of records corresponding to combinations of the repair target portion 21, the gel material 102, the electrode 103, and the current distribution. Accordingly, it is possible to give an instruction for more appropriate electroplating for the repair target object based on results or the like stored in the electrochemical database SD.

It is more preferable that the repair design unit 12 determines the shape of the gel material 102 based on strength of the gel material 102 and shear strength of the gel material 102. Accordingly, the shape of the gel material 102 can be determined according to the strength and the shear strength of the gel material 102.

It is more preferable that the repair design unit 12 determines the shape of the gel material 102 based on adhesion of the gel material 102 to the repair target portion 21 and adhesion of the gel material 102 to the electrode 103. Accordingly, it is possible to determine the shape of the gel material 102 according to the adhesion of the gel material 102 to the repair target portion 21 and the adhesion of the gel material 102 to the electrode 103.

It is more preferable that a plurality of the gel materials 102 and a plurality of the electrodes 103 are provided, and the repair disposition position instruction unit 13 determines positions of the plurality of gel materials 102 and the plurality of electrodes 103 so that the gel materials 102 and the electrodes 103 do not interfere with each other. Accordingly, the electroplating process can be simultaneously executed using the plurality of gel materials 102 and electrodes 103.

It is more preferable that the shape measurement unit 10 determines the additional target shape SP including the void CV therein according to a functional requirement or durability required for the repair target object 20. Accordingly, an electroplating processing time can be shortened, and required amounts of the gel material 102 and the electrode 103 can be reduced.

It is more preferable that the repair condition instruction unit 14 outputs the additional operation instruction SB to move the gel material 102 to release gas released from the gel material 102, or to cool the gel material 102, or to release heat during an electroplating process. Accordingly, deformation of the gel material 102 due to an impressing failure or heat caused by the generated gas can be prevented.

It is more preferable that the repair target portion 21 is a recessed portion generated in the surface of the repair target object 20, and the shape measurement unit 10 determines the additional target shape SP to smooth the surface of the repair target object 20 by filling the repair target portion 21 with plating. Accordingly, the surface of the repair target object 20 can be smoothed.

It is more preferable that the repair design unit 12 and the repair disposition position instruction unit 13 determine the shapes and positions of the gel material 102 and the electrode 103 to make a distribution of the current in the gel material 102 uniform.

Accordingly, the current distribution in the gel material 102 can be made uniform, and an instruction for more appropriate electroplating can be given.

It is more preferable that a plurality of gel materials 102-1 and 102-2 and a plurality of electrodes 103-1 and 103-2 are provided, and the repair disposition position instruction unit 13 determines processes at a plurality of stages to provide the gel materials 102-1 and 102-2 and the electrodes 103-1 and 103-2 that are different for each of the stages to concentrate a current at a predetermined portion of the repair target portion 21. Accordingly, even when the repair target portion 21 is formed at a corner or the like of the repair target object 20, an instruction for appropriate electroplating can be given.

It is more preferable that the repair disposition position instruction unit 13 makes a posture of the repair target object 20 different for each of the stages. Accordingly, it is possible to give the repair target object 20 an appropriate posture for each stage.

It is more preferable that the shape measurement unit 10 further has a function of inspecting whether a processing error of the repair target object 20 is within a predetermined allowable range. Accordingly, the inspection of the repair target object 20 can be appropriately executed.

According to another aspect, based on a measured shape that is a result of measuring the shape of the repair target object 20 having the additional target shape SP, the repair instruction device 1 outputs the shape and the disposition position of the gel material 102, the shape and the disposition position of the electrode 103 to achieve target plating performed on the repair target object 20, and the electroplating application condition SA to achieve the repair of the repair target object 20.

Accordingly, an instruction for appropriate electroplating for the additional target shape SP can be given.

It is more preferable that the gel material 102 and the electrode 103 are integrated and come into contact with the repair target object 20 to be energized. Accordingly, the gel material 102 and the electrode 103 can be handled as an integrated assembly.

It is more preferable that the electrode 103 includes a metal thin plate, a metal mesh, or the like that can conform to the additional target shape SP. Accordingly, the shape of the electrode 103 can be easily processed into a shape corresponding to the additional target shape SP.

REPAIR INSTRUCTION DEVICE AND REPAIR INSTRUCTION METHOD

Information

Publication Number

Date Filed

Date Published

Inventors

Original Assignees

CPC

International Classifications

Abstract

Description

Claims

Priority Claims (1)