Claims
- 1. A blend of a compound of the formula ##STR24## where R is a divalent linking group, and a bisdienophile, said blending being capable of forming a high temperature resistant thermoset resin.
- 2. The blend of claim 1 wherein said bisdienophile is a bis-maleimide of the formula: ##STR25## where Ar' is an aromatic linking group.
- 3. The blend of claim 2 wherein Ar' is an aromatic linking group such as a linking group selected from the group consisting of a meta phenylene group, a para phenylene group and the formula: ##STR26## where X is selected from the group consisting of --C(CF.sub.3).sub.2 --, --C(CH.sub.3).sub.2 --, --CH.sub.2 --, --O--, --S--, --CO--, and --SO.sub.2 --, or X represents a direct bond.
- 4. The blend of claim 3 wherein said compound is represented by the formula: ##STR27## where R is a divalent linking group.
- 5. The blend of claim 4 wherein said divalent linking group is an aromatic divalent linking group.
- 6. The blend of claim 4 wherein R is selected from the group consisting of --C(CF.sub.3).sub.2 --, --(CH.sub.3).sub.2 --, --CH.sub.2 --, --O--, --S--, --CO--, and --SO.sub.2 --, or R represents a direct bond.
- 7. The blend of claim 5 wherein R is represented by the formula ##STR28## where W is selected from the group consisting of --C(CF.sub.3).sub.2 --, --C(CH.sub.3).sub.2 --, --CH.sub.2 --, --O--, --S--, --CO--, and --SO.sub.2 --, or W represents a direct bond.
- 8. The blend of claim 5 where R is represented by the formula: ##STR29## where X is selected from the group consisting of --C(CF.sub.3).sub.2 --, --C(CH.sub.3).sub.2 --, --CH.sub.2 --, --O--, --S--, --CO--, and --SO.sub.2 --, or X represents a direct bond.
- 9. The blend of claim 5 wherein R is represented by the formula: ##STR30## where R' is selected from the group consisting of --C(CF.sub.3).sub.2 --, --C(CH.sub.3).sub.2 --, --CH.sub.2 --, --O--, --S--, --CO--, and --SO.sub.2 --, or R' represents a direct bond,
- n is 1 to 4, and
- Ar is selected from the group consisting of a meta phenylene group, a para phenylene group, and the formula: ##STR31## where X is selected from the group consisting of --C(CF.sub.3).sub.2 --, --C(CH.sub.3).sub.2 --, --CH.sub.2 --, --O--, --S--, --CO--, and --SO.sub.2 --, or X represents a direct bond.
- 10. The blend of claim 1 wherein said bisdienophile is a dicyanate of the formula
- N.tbd.C--O--Ar"--O--C.tbd.N (VIII)
- where Ar" is an aromatic linking group.
- 11. The blend of claim 10 wherein Ar" is represented by the formula ##STR32## where J is selected from the group consisting of --C(CF.sub.3).sub.2 --, --C(CH.sub.3).sub.2 --, --CH.sub.2 --, --O--, --S--, --CO--, and --SO.sub.2 --, or J represents a direct bond.
- 12. The blend of claim 10 wherein Ar" is represented by the formula ##STR33## where L is selected from the group consisting of --C(CF.sub.3).sub.2 --, --C(CH.sub.3).sub.2 --, --O--, --S--, --CO--, and --SO.sub.2 --, or L represents a direct bond.
- 13. The blend of claim 10 wherein Ar" is a meta phenylene group.
- 14. The blend of claim 1 wherein said bisdienophile is a bisphenylacetylene of the formula ##STR34## where Ar'" is an aromatic linking group.
- 15. The blend of claim 14 wherein Ar'" is represented by the formula ##STR35## where M is selected from the group consisting of --C(CF.sub.3).sub.2 --, --C(CH.sub.3).sub.2 --, --CH.sub.2 --, --O--, --S--, --CO--, and --SO.sub.2 --, or M represents a direct bond.
- 16. The blend of claim 14 wherein Ar'" is represented by the formula ##STR36## where Q is selected from the group consisting of ortho phenylene, meta phenylene, or para phenylene.
- 17. A resin which is a reaction product prepared by polymerization of a compound of the formula: ##STR37## where R is a divalent linking group.
- 18. The resin of claim 17 wherein said compound is represented by the formula: ##STR38## where R is a divalent linking group.
- 19. The resin of claim 18 wherein said divalent linking group is an aromatic divalent linking group.
- 20. The resin of claim 18 wherein R is selected from the group consisting of --C(CF.sub.3).sub.2 --, --C(CH.sub.3).sub.2 --, --CH.sub.2 --, --O--, --S--, --CO--, and --SO.sub.2 --, or R represents a direct bond.
- 21. The resin of claim 19 wherein R is represented by the formula: ##STR39## where W is selected from the group consisting of --C(CF.sub.3).sub.2 --, --C(CH.sub.3).sub.2 --, --CH.sub.2 --, --O--, --S--, --CO--, and --SO.sub.2 --, or W represents a direct bond.
- 22. The resin of claim 19 wherein R is represented by the formula: ##STR40## where X is selected from the group consisting of --C(CF.sub.3).sub.2 --, --C(CH.sub.3).sub.2 --, --CH.sub.2 --, --O--, --S--, --CO--, and --SO.sub.2 --, or X represents a direct bond.
- 23. The resin of claim 19 wherein R is represented by the formula: ##STR41## where R' is selected from the group consisting of --C(CF.sub.3).sub.2 --, --C(CH.sub.3).sub.2 --, --CH.sub.2 --, --O--, --S--, --CO--, and --SO.sub.2 --, or R' represents a direct bond,
- n is 1 to 4, and
- Ar is selected from the group consisting of a meta phenylene group, a para phenylene group, and the formula: ##STR42## where X is selected from the group consisting of --C(CF.sub.3).sub.2 --, --C(CH.sub.3).sub.2 --, --CH.sub.2 --, --O--, --S--, --CO--, and --SO.sub.2 --, or X represents a direct bond.
- 24. The resin of claim 20 wherein R is --C(CF.sub.3).sub.2 --.
- 25. The resin of claim 20 wherein W is --C(CF.sub.3).sub.2 13 .
- 26. The resin of claim 20 wherein W is --SO.sub.2 --.
- 27. A resin which is a reaction product prepared by Diels-Alder polymerization of a compound of the formula: ##STR43## where R is a divalent linking group, and a bisdienophile.
- 28. A resin which is a reaction product prepared by Diels-Alder polymerization of a bis-benzocyclobutene compound and a dienophile.
- 29. A resin as recited in claim 28 wherein said dienophile is benzoquinone.
- 30. A resin as recited in claim 28 wherein said dienophile is a bis-maleimide.
- 31. A resin which is a reaction product prepared by Diels-Alder polymerization of bis-2,2-(N-4-benzocyclobutenyl pthalimido)hexafluoropropane and 1,1'-(methylene di-4,1-phenylene)bis-maleimide.
- 32. A copolymer composition comprising, in polymerized form, a comonomer containing two polymerizable arylcyclobutane moieties, and a comonomer containing two polymerizable dienophilic moieties.
- 33. The copolymer composition of claim 32 wherein the arylcyclobutane moieties are benzocyclobutene moieties.
- 34. The copolymer composition of claim 33 wherein the dienophilic moieties are maleimide moieties.
CROSS-REFERENCE TO RELATED APPLICATIONS
This application is a continuation-in-part of U.S. patent application Ser. No. 861,020, filed May 8, 1986, now U.S. Pat. No. 4,711,964.
GOVERNMENT RIGHTS
The U.S. Government has rights in this invention pursant to Contract No. F33615-84-C-5020 awarded by the Department of the Air Force.
US Referenced Citations (8)
Foreign Referenced Citations (1)
Number |
Date |
Country |
86100718 |
Jan 1986 |
EPX |
Continuation in Parts (1)
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Number |
Date |
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Parent |
861020 |
May 1986 |
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