Claims
- 1. A process for producing a semiconductor device comprising the steps of:
- (a) solidifying a molten thermosetting resin composition by cooling, to form directly therefrom a resin tablet having a content of water together with volatile organic compounds of 0.05% by weight or less, and a gelled particles content of zero for particles of 60 mesh on and 10 ppm or less for particles of 100 mesh on; and
- (b) providing a semiconductor device by sealing a semiconductor element with the formed resin tablet.
- 2. A process according to claim 1, wherein the resin tablet contains volatile organic compounds in an amount of 0.03% by weight or less.
- 3. A process according to claim 1, wherein the resin tablet has a compressibility of at least 98%.
- 4. A process according to claim 1, the tablet having a metallic impurities content of less than 50 ppm.
- 5. A process according to claim 1, wherein the resin tablet has a Shore hardness (measured at 23.degree. C.) of at least 65.
- 6. A process according to claim 1, wherein the thermosetting resin composition comprises an epoxy resin composition as a main component.
- 7. A process according to claim 6, further comprising curing the epoxy resin with a novolak resin.
- 8. A process according to claim 7, wherein the sealing is conducted with transfer molding.
- 9. The process of claim 1, wherein the resin tablet has a compressibility distribution with a deviation of .+-.1% or less.
- 10. The process of claim 6, wherein the thermosetting resin composition further comprises a curing agent, a curing accelerator, a filler, and/or a surface treating agent.
- 11. The process of claim 1, further comprising measuring the content of water together with volatile organic compounds.
- 12. The process of claim 11, wherein the measuring uses gas chromatography.
- 13. The process of claim 1, wherein the water content in the resin tablet is 0.02% by weight or less.
- 14. The process of claim 2, wherein the water content in the resin tablet is 0.02% by weight or less.
- 15. The process of claim 1, further comprising measuring the content of gelled particles in the resin tablet.
- 16. A process for producing a semiconductor device comprising the steps of:
- (i) preheating one or more components to provide a thermosetting resin composition;
- (ii) heating the thermosetting resin composition to a molten state followed by solidifying the molten thermosetting resin composition by cooling, to form directly therefrom a resin tablet having a content of water together with volatile organic compounds of 0.05% by weight or less, and a gelled particles content of zero for particles of 60 mesh on and 10 ppm or less for particles of 100 mesh on; and
- (iii) providing a semiconductor device by sealing a semiconductor element with the formed resin tablet.
- 17. The process of claim 16, wherein the pre-heating is to about 150.degree. C. for about 30 minutes.
- 18. The process of claim 16, wherein the pre-heating is under reduced pressure.
- 19. The process of claim 16, wherein one or more of the components are pre-heated separately.
- 20. The process of claim 16, wherein one or more of the components are pre-heated as a mixture.
- 21. The process of claim 16, wherein volatile compounds are removed.
- 22. A method of reducing gate-clogging in a plasticizing pressuring method for semiconductor device production wherein a resin tablet seals a semiconductor element, comprising the step of
- providing a resin tablet formed by solidifying a molten thermosetting resin composition by cooling, to form directly therefrom a resin tablet having a content of water together with volatile organic compounds of 0.05% by weight or less, and a gelled particles content of zero for particles of 60 mesh on and 10 ppm or less for particles of 100 mesh on.
Priority Claims (1)
Number |
Date |
Country |
Kind |
6-051307 |
Feb 1994 |
JPX |
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Parent Case Info
This is a Continuation of application Ser. No. 08/612,499 filed on Mar. 7, 1996, now abandoned, which is a Continuation of application Ser. No. 08/458,681 filed Jun. 2, 1995, now abandoned, which is a Continuation of application Ser. No. 08/373,898 filed Jan. 17, 1995, now abandoned, which is a Continuation of application Ser. No. 08/209,052 filed Mar. 11, 1994, (abandoned).
US Referenced Citations (2)
Number |
Name |
Date |
Kind |
4293519 |
Knappenberger |
Oct 1981 |
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4554126 |
Sera |
Nov 1985 |
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Foreign Referenced Citations (1)
Number |
Date |
Country |
0530377 |
Mar 1993 |
EPX |
Continuations (4)
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Number |
Date |
Country |
Parent |
612499 |
Mar 1996 |
|
Parent |
458681 |
Jun 1995 |
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Parent |
373898 |
Jan 1995 |
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Parent |
209052 |
Mar 1994 |
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