Claims
- 1. A positive resist composition which comprises in admixture an alkali-soluble resin and, as a sensitizer, first and second quinone diazide sulfonic acid esters of a phenol compound, wherein
- (a) said first ester is a quinone diazide sulfonic acid diester of a phenol compound having not less than three hydroxyl groups which exhibits a pattern area that is not less than 40% of all pattern areas corresponding to the sensitizer in a high pressure liquid chromatography (HPLC) pattern measured with a primary detector using UV light having a wavelength of 254 nm, and
- (b) said second ester is a quinone diazide sulfonic acid ester that is a complete ester of a phenol compound having not less than two hydroxyl groups prepared by reacting the quinone diazide sulfonyl halogenide with a di- or polyhydric phenol compound of the formula ##STR7## wherein X is a group of the formula: ##STR8## in which R.sub.1, R.sub.2, R.sub.3, R.sub.4, R.sub.5 and R.sub.6 are the same or different and each a hydrogen atom, an alkyl group, an aryl group, an alkenyl group or cyclohexyl group and Ar is a divalent aromatic group; m and n are the same or different and each zero or a positive number, provided that the sum of m and n is not less than 2, which exhibits a pattern area corresponding to not less than 5% and is less than 60% of all pattern areas corresponding to the sensitizer in the HPLC pattern.
- 2. The positive resist composition according to claim 1, wherein the pattern area corresponding to the quinone diazide sulfonic acid diester of the phenol compound having not less than three hydroxyl groups is not less than 50% of all the pattern areas corresponding to the sensitizer in the HPLC pattern.
- 3. The positive resist composition according to claim 1, wherein an amount of the quinone diazide sulfonic acid ester of the phenol compound is from 10 to 50% by weight based on the total weight of the solid components in the resist composition.
- 4. The positive resist composition according to claim 1, wherein the quinone diazide sulfonic acid diester is prepared using the phenol compound ##STR9##
- 5. The positive resist composition according to claim 1, wherein the quinone diazide sulfonic acid diester is prepared using the phenol compound ##STR10##
- 6. The positive resist composition according to claim 1, wherein the quinone diazide sulfonic acid diester is prepared using the phenol compound ##STR11##
- 7. The positive resist composition according to claim 1, wherein the quinone diazide sulfonic acid diester is prepared using the phenol compound ##STR12##
- 8. The positive resist composition according to claim 1, wherein the quinone diazide sulfonic acid diester is prepared using the phenol compound ##STR13##
- 9. The positive resist composition according to claim 1, wherein the quinone diazide sulfonic acid diester is prepared using the phenol compound ##STR14##
- 10. The positive resist composition according to claim 1, wherein the quinone diazide sulfonic acid diester is prepared using the phenol compound ##STR15##
- 11. The positive resist composition according to claim 1, wherein the quinone diazide sulfonic acid diester is prepared from a condensation reaction wherein chloroform is used as a solvent.
- 12. The positive resist composition according to claim 1, wherein the quinone diazide sulfonic acid diester is prepared from a condensation reaction wherein trichloroethane, trichloroethylene or dichloroethane is used as a solvent.
- 13. The positive resist composition according to claim 1, wherein the alkali-soluble resin is a novolak resin.
- 14. A positive resist composition according to claim 1, wherein the phenol compound having not less than three hydroxyl groups is selected from the group consisting of ##STR16##
Priority Claims (1)
Number |
Date |
Country |
Kind |
63-258937 |
Oct 1988 |
JPX |
|
Parent Case Info
This application is a continuation, of application Ser. No. 07/419,831 filed on Oct. 11, 1989, now abandoned.
US Referenced Citations (17)
Foreign Referenced Citations (3)
Number |
Date |
Country |
58-150948 |
Sep 1983 |
JPX |
60-121445 |
Jun 1985 |
JPX |
63-110446 |
May 1988 |
JPX |
Continuations (1)
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Number |
Date |
Country |
Parent |
419831 |
Oct 1989 |
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